Abstract: A wafer held on a delivery pad is lifted from a holding surface, and when a lower surface of the wafer has been spaced in its entirety from the holding surface, an air flow rate regulating valve is opened to eject air from the holding surface. As the distance between the holding surface and the wafer spaced from the holding surface increases by lifting of a delivery unit, the degree of opening of the air flow rate regulating valve is adjusted to increase a flow rate of air from the holding surface, thereby spacing the wafer from the holding surface in a short period of time without rupturing the wafer.

Abstract: A grinding apparatus including a chuck table for holding a wafer, a grinding unit having a spindle for rotating a grinding wheel, an inclination adjusting unit for adjusting the inclination of the rotation axis of the chuck table with respect to the rotation axis of the spindle, a touch panel, and a control portion. The control portion is adapted to compare the information regarding the target sectional shape input into a target shape input field with the information regarding the present sectional shape input into a present shape input field and then control the inclination adjusting unit to change the inclination of the rotation axis of the chuck table so that the wafer is ground to obtain the target sectional shape of the wafer.

Abstract: A wafer grinding method includes a step of holding a wafer on a holding surface of a chuck table, a first grinding step of controlling a grinding feeding mechanism by a control unit so as to increase or decrease a load value measured by a load measuring unit and grinding the wafer to a thickness not reaching a predetermined finished thickness of the wafer, and a second grinding step of imparting a preset load value and grinding the wafer until the predetermined finished thickness is reached, after the first grinding step.

Abstract: A wafer held on a delivery pad is lifted from a holding surface, and when a lower surface of the wafer has been spaced in its entirety from the holding surface, an air flow rate regulating valve is opened to eject air from the holding surface. As the distance between the holding surface and the wafer spaced from the holding surface increases by lifting of a delivery unit, the degree of opening of the air flow rate regulating valve is adjusted to increase a flow rate of air from the holding surface, thereby spacing the wafer from the holding surface in a short period of time without rupturing the wafer.

Abstract: A method of grinding a workpiece is carried out by a grinding apparatus including a spindle for rotating a grinding wheel, a servomotor for moving the spindle, and a servo driver for sending signals to the servomotor. The method includes a depth-of-cut command issuing step of issuing a command representing a projected depth of cut to the servo driver and a grinding step of grinding the workpiece. In the grinding step, the servo driver finishes movement of the spindle when the spindle has moved by a target distance corresponding to the projected depth of cut.

Abstract: A grinding apparatus including a chuck table for holding a wafer, a grinding unit having a spindle for rotating a grinding wheel, an inclination adjusting unit for adjusting the inclination of the rotation axis of the chuck table with respect to the rotation axis of the spindle, a touch panel, and a control portion. The control portion is adapted to compare the information regarding the target sectional shape input into a target shape input field with the information regarding the present sectional shape input into a present shape input field and then control the inclination adjusting unit to change the inclination of the rotation axis of the chuck table so that the wafer is ground to obtain the target sectional shape of the wafer.

Abstract: Grinding apparatus includes plural chuck tables disposed on a turntable, a first grinding unit and a second grinding unit that execute infeed grinding of a wafer, and a first grinding feed unit and a second grinding feed unit that execute grinding feed of them. Each grinding feed unit has a pair of guides parallel to the grinding feed direction and a ball screw. The grinding area of each grinding unit has a circular arc shape in which one end exists at the outer circumference of the wafer and the other end exists at the center of the wafer.

Abstract: Grinding apparatus includes plural chuck tables disposed on a turntable, a first grinding unit and a second grinding unit that execute infeed grinding of a wafer, and a first grinding feed unit and a second grinding feed unit that execute grinding feed of them. Each grinding feed unit has a pair of guides parallel to the grinding feed direction and a ball screw. The grinding area of each grinding unit has a circular arc shape in which one end exists at the outer circumference of the wafer and the other end exists at the center of the wafer.

Abstract: An aspect of the present invention has a first disk-shaped member coupled to a first rotating shaft to rotate and a first plate-shaped member having a surface perpendicular to a surface of the first disk-shaped member and holding a first magnet. Moreover, a second disk-shaped member provided so as to face the first disk-shaped member and coupled to a second rotating shaft to rotate, and a second plate-shaped member having a surface perpendicular to a surface of the second disk-shaped member and holding a second magnet are provided. A magnetic pole of the first magnet on a side facing the second magnet and a magnetic pole of the second magnet on a side facing the first magnet have the same pole.

Abstract: An aspect of the present invention has a first disk-shaped member coupled to a first rotating shaft to rotate and a first plate-shaped member having a surface perpendicular to a surface of the first disk-shaped member and holding a first magnet. Moreover, a second disk-shaped member provided so as to face the first disk-shaped member and coupled to a second rotating shaft to rotate, and a second plate-shaped member having a surface perpendicular to a surface of the second disk-shaped member and holding a second magnet are provided. A magnetic pole of the first magnet on a side facing the second magnet and a magnetic pole of the second magnet on a side facing the first magnet have the same pole.

Abstract: A floating oil collecting system which can collect floating oil containing a very small amount of water is provided. The system includes a liquid-level following type suction apparatus having an intake pipe in which one end is an inlet side end opening upwardly and the other end is connected with an inlet port of a pump, a float which causes the inlet side end to closely follow a liquid level within liquid in a storage tank, and an adjustment pipe which is loosely fitted to the inlet side end of the intake pipe so as to be movable up and down movement, in which an upper end opening edge is an inlet opening; a separation tank which receives an oil/water mixture from the storage tank to separate the mixture into oil and water; a pump for sucking up the oil/water mixture from the storage tank so as to be supplied to the separation tank; and a deaerator for removing air in the oil/water mixture sucked up from the storage tank.

Abstract: A floating oil collecting system which can collect floating oil containing a very small amount of water is provided. The system includes a liquid-level following type suction apparatus having an intake pipe in which one end is an inlet side end opening upwardly and the other end is connected with an inlet port of a pump, a float which causes the inlet side end to closely follow a liquid level within liquid in a storage tank, and an adjustment pipe which is loosely fitted to the inlet side end of the intake pipe so as to be movable up and down movement, in which an upper end opening edge is an inlet opening; a separation tank which receives an oil/water mixture from the storage tank to separate the mixture into oil and water; a pump for sucking up the oil/water mixture from the storage tank so as to be supplied to the separation tank; and a deaerator for removing air in the oil/water mixture sucked up from the storage tank.

Abstract: A hemopoietic stem cell augmenting agent in which at least one type of hepatocyte growth factor is contained as an active component is provided. The hepatocyte growth factor has an augmenting activity on undifferentiated pluripotent hemopoietic stem cells and is useful as a hemopoietic stem cell augmenting agent for treatment of bone marrow suppression and for treatment of bone marrow malfunctions and furthermore is useful for in vitro growth of peripheral blood stem cells and bone marrow stem cells. Furthermore, a hepatocyte growth factor derived from human normal fibroblasts which is considered to be a type of hepatocyte growth factor can be obtained by genetic recombination techniques, and said factor is also useful as a hemopoietic stem cells augmenting agent.

Abstract: A commutator for a miniature motor having a permanent magnet field; comprising a commutator core having a commutator core flat portion, a cylindrical portion provided upright at the center of the flat portion, insert pieces provided in the opposite direction to the cylindrical portion; commutator segments having arc-shaped segment pieces disposed in contact with the outer periphery of the cylindrical portion, and commutator legs disposed along the commutator core flat portion; and a commutator washer engaged with the outer periphery of the arc-shaped segment pieces to fixedly fit the commutator segments to the commutator core; in which winding hooks (in the form of projections or lanced and raised pieces, for example) for hooking rotor windings are provided at predetermined locations of the commutator core flat portions on the sides of the commutator legs disposed in the abovementioned manner.

Abstract: In an improved method for inspecting crimp bonded terminals, instead of inspecting visually, contour images of crimp bonded terminals are picked up and scanned to provide necessary data and processing operations are performed on the data to make a decision automatically on the acceptance or rejection of the crimp bonded terminals, thereby elevating the inspection efficiency and improving the accuracy of deciding the acceptance or rejection of the crimp bonded terminals.