Abstract: The present invention provides a thermocompression tool, i.e. high strength bonding tool used for mounting a semiconductor device or element such as IC, LSI, etc. on a substrate, for example, a tool of pulse heating type used for soldering, and a mounting tool (bonding tool) used for heating, melting and bonding or thermocompression bonding in a lump a number of workpieces to be bonded, making up a part of electronic parts, in particular, a high precision tool called outer lead bonding tool. The high strength bonding tool comprises a substrate consisting of a cemented carbide having microscopic protrusions of hard carbides and/or hard carbonitrides on at least one surface and a coefficient of linear expansion of 4.0.times.10.sup.-6 to 5.5.times.10.sup.-6 /.degree. C. at room temperature to 400.degree. C.

Abstract: A cutting tool for milling comprises an insert consisting of a cubic boron nitride sintered body having heat conductivity of at least 400 W/m.K at 120.degree. C. and a thermal expansion coefficient within the range of at least 3.0.times.10.sup.-6 /K and not more than 4.0.times.10.sup.-6 /K in the temperature range of 20.degree. C. to 600.degree. C. According to this cutting tool for milling, sufficient tool life can be attained in high-speed face milling under a wet condition and high-speed end milling under a wet condition.

Abstract: Super hard composite material for tools, comprising a substrate of CBN sintered body containing more than 20% by volume of cubic boron nitride (CBN), improved in strength of base material, wear-resistance, hardness at high temperatures and acid-resistance usable in cutting work of steels which are difficult to be machined. The substrate (2) has a laminated film (1) consisting of super thin films (a) and (b) each deposited alternatively on the substrate (2), the super thin film (a) being made of nitride and/or carbide of at least one element selected from a group comprising IVa group elements, Va group elements, VIa group elements, Al and B and possessing a crystal structure of cubic system and metallic bond property, the super thin film (b) being made of at least one compound possessing a crystal structure other than cubic system and covalent bond property under equilibrium condition at ambient temperature and pressure, each unit layer of the super thin films (a) and (b) having a thickness of 0.

Abstract: Hard composite material for tools, comprising a substrate of CBN sintered body containing more than 20% by volume of cubic boron nitride or diamond sintered body containing more than 40% by volume of diamond. The substrate has at least one layer of hard heat-resisting film consisting mainly of Ti, Al and at least one element selected from a group comprising C, N and O on a portion or portions of said substrate where cutting participate. Improved in strength of base material, wear-resistance and oxidation-resistance, less reactive with iron and showing longer tool life comparing to known cutting tools and usable in wider applications such as hardened steel, cast ion and simultaneous cutting of cast ion and aluminum alloy.

Abstract: A method of manufacturing a diamond sintered body includes the following steps: preparing a diamond powder having a particle size within a range of 0.1 to 10 .mu.m, coating the surface of each particle of the diamond powder with a sintering assistant agent including Pd within a range of 0.01 to 40 percent by weight and at least one iron family metal as a remainder, and liquid-phase sintering the coated diamond powder under a high pressure and high temperature condition. In this manner, a diamond sintered body having high strength and high wear-resistance, and containing diamond particles of 80 to 96 percent by volume, can be obtained.

Abstract: A sintered body insert for cutting comprises an intermediate layer consisting of at least one of cemented carbide, a ferrous metal and a high melting point metal, and a first layer and a second layer, each consisting of hard sintered bodies containing cubic boron nitride or diamond, which are arranged on opposite sides respectively above and below with the intermediate layer therebetween. The first and second layers are bonded to the intermediate layer by sintering. The is so formed or configured that its front and rear surfaces define cutting faces. All noses and flanks involved in cutting are formed on the first layer and the second layer, while the centers of gravity of the cutting faces and of the overall insert are located at positions on or in the intermediate layer. Further, coating layers consisting of a nitride of an element belonging to the group 4a, 5a or 6a of the periodic table or other components are formed on the surfaces of the cutting faces and the flanks.

Abstract: Ultrafine particle-layered film for coating cutting tools. The film has more than two layers of at least two compounds consisting mainly of carbide, nitride, carbonitride or oxide of at least one element selected from a group consisting of IVa group elements, Va group elements, VIa group elements, Al, Si and B, and that each layer is made of ultrafine particles. Ultrafine particle-layered film improves hardness, strength, wear-resistance and heat-resistance of the tools.

Abstract: The present invention provides a thermocompression tool, i.e. high strength bonding tool used for mounting a semiconductor device or element such as IC, LSI, etc. on a substrate, for example, a tool of pulse heating type used for soldering, and a mounting tool (bonding tool). The tool is used for heating, melting and bonding or thermocompression bonding in a lump a number of workpieces to be bonded, making up a part of electronic parts, in particular, a high precision tool called outer lead bonding tool. The high strength bonding tool has a substrate that is composed of a cemented carbide having microscopic protrusions of hard carbides and/or hard carbonitrides on at least one surface and having a coefficient of linear expansion of 4.0.times.10.sup.-6 to 5.5.times.10.sup.-6 /.degree.C. at room temperature to 400.degree. C.

Abstract: The invention provides a sintered body for high-hardness tools which, when used for cutting work of cast irons where the cutting edge undergoes high temperature and abrupt impact, holds high chip-off and abrasion resistances and exhibits good cutting performance. The sintered body for high-hardness tools is obtained by sintering 60 to 75% by volume of cubic boron nitride powder and remaining part of a binder powder under a superhigh pressure, the binder comprising 5 to 15% by weight of Al, and the remaining part comprising a compound represented by (Hf.sub.X Ti.sub.y M.sub.1-x-y)(C.sub.Z N.sub.1-z).sub..alpha. (where M denotes an element belonging to IVa, Va or VIa group in the periodic table except Ti and Hf, and where 0.1.ltoreq.x.ltoreq.0.5, 0.5.ltoreq.y.ltoreq.0.9, 0.7.ltoreq.z.ltoreq.0.9, and 0.6.ltoreq..alpha..ltoreq.0.8) or a mixture of a plurality of compounds that totally results in the aforementioned composition.

Abstract: A polycrystalline diamond is prepared by chemical vapor deposition (step 101). A surface of the polycrystalline diamond is metallized (step 102). The metallized surface of the polycrystalline diamond is grooved with a YAG laser (step 103). A wedge or the like is driven into the grooves of the polycrystalline diamond to pressurize the same, whereby the polycrystalline diamond is divided along the grooves (step 104). Alternatively, a surface of a polycrystalline diamond prepared by chemical vapor deposition is grooved with a YAG laser (step 112), and the surface of the polycrystalline diamond is metallized (step 113) after the grooving. The obtained diamond heat sink (10) includes a first layer (11a) grooved with a laser, and a mechanically divided second layer (11b). Graphite adheres to the outer peripheral surface of the first layer (11a). The outer peripheral surface of the second layer (11b) has a greater surface roughness than that of the first layer (11a).

Abstract: In this invention, a cutting tool comprises two layers of hard sintered compact of cBN. The first sintered compact layer comprises about 75-98% by volume of cBN and a first binder material. The first binder material comprises from about 1 to out 40% by weight of Al. The second sintered compact layer comprises from about 40 to about 65% by volume of cBN and a second binder material. The second binder material comprises about 2 to about 30% by weight of Al. The first sintered compact layer is bonded to the second sintered compact layer. This composite material is bonded directly or indirectly to a tool holder to form a cutting tool. The first sintered compact layer constitutes a rake face of the cutting tool.

Abstract: A polycrystalline diamond cutting tool comprises a tool material of polycrystalline diamond formed by low-pressure vapor deposition, which is bonded to a shank of cemented carbide through a brazing layer. The thickness of the polycrystalline diamond layer is set at 0.1 to 1.0 mm, while that of the brazing layer is set at 10 to 50 .mu.m. The brazing layer is made of a material having a melting point of 950.degree. to 1300.degree. C., which is in the form of an alloy layer containing at least one material selected from metals belonging to the groups IVa, Va, VIa and VIIa of the periodic table and carbides thereof and at least one material selected from Au, Ag, Cu, Pt, Pd and Ni. The polycrystalline diamond cutting tool is improved in heat resistance and tool strength. In order to improve deposition resistance of the cutting tool, the surface roughness of a tool rake face is set to be not more than 0.2 .mu.m in Rmax. A portion of the polycrystalline diamond layer up to a depth of 10 .mu.

Abstract: In a hard sintered cutting tool, the tool life can be further increased. In this hard sintered body cutting tool, a rake face of an edge portion is formed by a major surface of a first sintered body layer containing at least 80 percent by volume and less than 98 percent by volume of diamond, while a flank of the edge portion is formed by a second sintered body layer containing at least 30 percent by volume and less than 75 percent by volume of cubic boron nitride (CBN). The first sintered body layer is formed to have a thickness of at least 0.02 mm and less than 0.1 mm, and to be in a thickness ratio of at least 1:5 to the second sintered body layer. Thus, chipping resistance of the rake face is improved by the first sintered body layer, while wear resistance of the flank is improved by the second sintered body layer. As a result, it is possible to suppress progress of local wear and chipping, whereby the life of the cutting tool is increased as compared with the prior art.

Abstract: A semiconductor laser is provided with a heat radiating component for radiating or dissipating heat which is generated in operation. In this heat radiating component, a polycrystalline diamond layer (3) synthesized by vapor deposition is formed on an upper surface of a stem (4). A semiconductor laser element (1) is bonded, e.g. by brazing to the surface of the vapor-deposited polycrystalline diamond layer (3) through a brazing filler metal (2). The heat radiating component has a thermal expansion coefficient which is the same as that of an LSI chip to be mounted thereon to provide an excellent heat radiating property.

Abstract: A polycrystalline diamond is prepared by chemical vapor deposition (step 101). A surface of the polycrystalline diamond is metallized (step 102). The metallized surface of the polycrystalline diamond is grooved with a YAG laser (step 103). A wedge or the like is driven into the grooves of the polycrystalline diamond to pressurize the same, whereby the polycrystalline diamond is divided along the grooves (step 104). Alternatively, a surface of a polycrystalline diamond prepared by chemical vapor deposition is grooved with a YAG laser (step 112), so that the surface of the polycrystalline diamond is metallized (step 113) after the grooving.

Abstract: A polycrystalline diamond cutting tool is prepared by employing polycrystalline diamond which is synthesized on a mirror-finished surface of a base material by a low-pressure vapor phase method, as a tool material. A surface, which has been in contact with the base material, of the polycrystalline diamond layer is utilized as a tool rake face. A flank of the tool is formed by laser processing. The flank is covered with a graphite coating layer in one embodiment, while such a graphite coating layer is removed by acid treatment or the like in another embodiment. In still another embodiment, a flank is formed by grinding, and a cutting edge portion is honed by laser processing.

Abstract: A sintered body for high-accuracy working tools is obtained by sintering powder mixture containing at least 45 percent by volume and not more than 60 percent by volume of cubic boron nitride powder having an average particle size of not more than 2 .mu.m and having a remainder formed of binder powder under a superhigh pressure. The binder contains at least 5 percent by weight and not more than 15 percent by weight of Al and at least 2 percent by weight and not more than 20 percent by weight of W, and has a binder remainder formed of a Ti compound or compounds. The atomic ratio of Ti contained in the binder to a transition metal element or elements belonging to any of the groups IVa, Va and/or VIa of the periodic table including Ti is at least 2/3 and not more than 97/100. In the structure of the sintered body, cubic boron nitride crystals are bonded with each other through bonding phases formed by the binder. When at least one or more Ti compounds are selected from a group of TiN.sub.z, Ti(C.sub.1-x N.sub.x).

Abstract: A hard sintered body for tools is obtained by sintering under a superhigh pressure, a sinter powder mixture containing at least 20 percent by volume and not more than 70 percent by volume of cubic boron nitride powder and having a remainder formed of a binder powder mixture. The binder contains at least 2 percent by weight and not more than 20 percent by weight of Al and at least 2 percent by weight and not more than 20 percent by weight of W, and has a remainder formed of a Ti compound or compounds. The atomic ratio of Ti contained in the binder to a transition metal element or elements belonging to any of the groups IVa, Va and/or VIa of the periodic table including Ti is at least 2/3 and not more than 97/100. In the structure of the sintered body, cubic boron nitride crystals are bonded with each other through bonding phases formed by the binder. For forming the sintered body, at least one or more Ti compounds are selected from a group of TiN.sub.z, Ti(C,N).sub.z, TiC.sub.z, (Ti,M)N.sub.z, (Ti, M) (C,N).

Abstract: A sintered diamond compact or high pressure form boron nitride compact with an improved brazability, suitable for use for wear resisting tools, cutting tools, drill bits, dressers and wire-drawing dies is provided. This compact comprises a compact part containing at least 20% by volume of diamond and/or high pressure form boron nitride and a cemented carbide substrate bonded directly or through an interlayer to the compact part, characterized in that the surface of the compact is coated, at least partly, with a thin film consisting essentially of at least one member selected from the group consisting of carbides, carbonitrides and nitrides and mixtures or solid solutions thereof of at least one element selected from the group consisting of silicon and Group IVa, Va and VIa of Periodic Table, and having a thickness of 1 to 20 .mu.m.

Abstract: A hard sintered compact for tools is a sintered compact obtained by super-high pressure sintering of 45-75% by vol. of cubic boron nitride powder and the remaining proportion of binder powder. The binder includes 5-25% by wt. of Al and the remaining proportion of at least one species of compounds represented by (Hf.sub.1-z M.sub.z) C, where M denotes elements of IVa, Va and VIa groups in a periodic table except for Hf, and 0.ltoreq.z.ltoreq.0.3 is satisfied. Because of this composition, improvements are made in strength, wear resistance and heat resisting property of the binder, and a hard sintered compact for tools having excellent strength and excellent wear resistance can be obtained.