Abstract: A multilayer ceramic electronic device includes a multilayer chip having a plurality of dielectric layers and a plurality of internal electrode layers, one end of each of the plurality of internal electrode layers being exposed from the multilayer chip, an external electrode that is provided on an end face of the multilayer chip and is electrically connected to the one end of at least some of the plurality of internal electrode layers and includes a glass component, the end face being an end of the multilayer chip in a direction in which the plurality of internal electrode layers extend. The external electrode includes a crystal contacting or extending into the glass component at an interface between the external electrode and the end face of the multilayer chip. The crystal includes an element that is the same as at least one of elements included in the plurality of dielectric layers.

Abstract: A multilayer ceramic capacitor includes a laminated body in which dielectric layers and internal electrodes are laminated alternately. The dielectric layer includes a first phase that contains calcium strontium zirconate titanate as a main component thereof and a second phase that contains barium zirconate as a main component thereof. At a cross section of the dielectric layer, a line parallel to the direction in which the dielectric layers and the internal electrodes are laminated contacts the boundaries between the first phase and the second phase once or more on average, thereby the statistically averaged contact number N of such a line with the boundaries determined by a prescribed procedure being 1.0 or greater.

Abstract: A ceramic electronic device includes a multilayer structure in which each of dielectric layers and each of internal electrode layers are alternately stacked, wherein a main component of the dielectric layers is (Ba, Sr, Ca)(Zr, Ti)O3, wherein a Ba concentration and a Ca concentration have variation in at least one of crystal grains in the dielectric layers.

Abstract: A ceramic electronic device includes a multilayer structure in which each of dielectric layers and each of internal electrode layers are alternately stacked, wherein a main component of the dielectric layers is (Ba, Sr, Ca)(Zr, Ti)O3, wherein a Ba concentration and a Ca concentration have variation in at least one of crystal grains in the dielectric layers.

Abstract: A ceramic capacitor includes a multilayer structure, wherein a main component of dielectric layers is ceramic expressed by a general formula AmBO3 (0.995?m?1.010), wherein the dielectric layers include a rare earth element Re as a first sub-component by 2.0 mol to 5.0 mol when converted into Re2O3/2, include Mg as a second sub-component by 1.0 mol to 3.0 mol when converted into MgO, include V as a third sub-component by 0.05 mol to 0.25 mol when converted into V2O5/2, include Si as a fourth sub-component by 0.5 mol to 5.0 mol when converted into SiO2, include an alkali earth metal element M as a fifth sub-component by 0.1 mol to 5.0 mol when converted into MCO3, on a presumption that an amount of the ceramic is 100 mol, wherein a ratio Si/V is 30 or less.

Abstract: A multilayer ceramic capacitor includes a laminated body in which dielectric layers and internal electrodes are laminated alternately. The dielectric layer includes a first phase that contains calcium strontium zirconate titanate as a main component thereof and a second phase that contains barium zirconate as a main component thereof. At a cross section of the dielectric layer, a line parallel to the direction in which the dielectric layers and the internal electrodes are laminated contacts the boundaries between the first phase and the second phase once or more on average, thereby the statistically averaged contact number N of such a line with the boundaries determined by a prescribed procedure being 1.0 or greater.

Abstract: The present technology provides an electronic component with an interposer, including an electronic component and an interposer. An adhesive section is disposed in an opposing space between a main body of the electronic component and a substrate. When a direction in which first and second external electrodes of the electronic component face each other is a first direction, a direction orthogonal to the first direction is a second direction, and a direction in which the electronic component and the interposer face each other is a third direction, the adhesive section includes a plurality of unitary adhesive sections separated from each other, and the unitary adhesive sections are disposed in a two-dimensional array such that the number of unitary adhesive sections arrayed along the second direction is smaller on opposing sides in the first direction than at a center.

Abstract: In an embodiment, an electronic component with metal terminals includes: an electronic component 10 having a component body 11 of roughly rectangular solid shape, as well as external electrodes 12 provided on the ends thereof in the first direction d1, respectively; and metal terminals 20 provided in sets of two on each external electrode 12. Each metal terminal 20 has a first planar part 21 and a second planar part 23 oriented differently from the first planar part 21; the first planar part 21 is connected to each external electrode 12 in a manner facing one face of the component body 11; and the second planar part 23 is positioned in a manner facing at least partially, across a clearance 24, another face adjoining the one face of the component body 11, while being fixed to the component body 11 by an adhesive 40 provided in the clearance 24.

Abstract: The present technology provides an electronic component with an interposer, including an electronic component and an interposer. An adhesive section is disposed in an opposing space between a main body of the electronic component and a substrate. When a direction in which first and second external electrodes of the electronic component face each other is a first direction, a direction orthogonal to the first direction is a second direction, and a direction in which the electronic component and the interposer face each other is a third direction, the adhesive section includes a plurality of unitary adhesive sections separated from each other, and the unitary adhesive sections are disposed in a two-dimensional array such that the number of unitary adhesive sections arrayed along the second direction is smaller on opposing sides in the first direction than at a center.

Abstract: A ceramic capacitor includes a multilayer structure, wherein a main component of dielectric layers is ceramic expressed by a general formula AmBO3 (0.995?m?1.010), wherein the dielectric layers include a rare earth element Re as a first sub-component by 2.0 mol to 5.0 mol when converted into Re2O3/2, include Mg as a second sub-component by 1.0 mol to 3.0 mol when converted into MgO, include V as a third sub-component by 0.05 mol to 0.25 mol when converted into V2O5/2, include Si as a fourth sub-component by 0.5 mol to 5.0 mol when converted into SiO2, include an alkali earth metal element M as a fifth sub-component by 0.1 mol to 5.0 mol when converted into MCO3, on a presumption that an amount of the ceramic is 100 mol, wherein a ratio Si/V is 30 or less.

Abstract: In an embodiment, an electronic component fuse 10 includes: (1) an insulator sleeve 11 having a hollow part 11a that opens to the exterior at both ends; (2) a conductor element 12 having a fusible part 12a whose cross-section is smaller than the cross-section of the hollow part 11a, a first engagement part 12b provided at one end of the fusible part 12a, and a second engagement part 12c provided at the other end of the fusible part 12a, where the fusible part 12a is positioned in the hollow part 11a, the first engagement part 12b and the second engagement part 12c are disposed on the respective ends of the insulator sleeve 11; (3) a first terminal 13 having a first connection part 13a connected to the first engagement part 12b; and (4) a second terminal 14 having a second connection part 14a connected to the second engagement part 12c.

Abstract: A multilayer ceramic capacitor includes a laminate constituted by internal electrode layers of different polarities alternately layered via dielectric layers, wherein the multilayer ceramic capacitor is such that the dielectric layers contain ceramic grains whose primary component is BaTiO3, the ceramic grains contain Mo, Mn, rare earth R, and at least one of V and W, and the average valence number of Mo in the ceramic grains is 4.50 to 5.50. The multilayer ceramic capacitor can offer excellent service life characteristics and sufficiently suppress leak current even when the thickness of the dielectric layer is 0.8 ?m or less.

Abstract: In an embodiment, an electronic component with metal terminals includes: an electronic component 10 having a component body 11 of roughly rectangular solid shape, as well as external electrodes 12 provided on the ends thereof in the first direction d1, respectively; and metal terminals 20 provided in sets of two on each external electrode 12. Each metal terminal 20 has a first planar part 21 and a second planar part 23 oriented differently from the first planar part 21; the first planar part 21 is connected to each external electrode 12 in a manner facing one face of the component body 11; and the second planar part 23 is positioned in a manner facing at least partially, across a clearance 24, another face adjoining the one face of the component body 11, while being fixed to the component body 11 by an adhesive 40 provided in the clearance 24.

Abstract: An electric circuit device connecting first and second external elements, the electric circuit device including: a first electronic component; a first bus bar electrically connected to the first electronic component; a second bus bar electrically connected to the electronic component and overlapped with the first bus bar in a direction perpendicular to main surfaces of the first and second bus bars; a first external terminal electrically connecting the first bus bar to the first external element; a second external terminal electrically connecting the second bus bar to the second external element; a first region in the first external terminal electrically coupled to the first external element; and a second region in the second external terminal electrically coupled to the second external element, and at least partially overlapped with the first region in the direction.

Abstract: In an embodiment, an electronic component fuse 10 includes: (1) an insulator sleeve 11 having a hollow part 11a that opens to the exterior at both ends; (2) a conductor element 12 having a fusible part 12a whose cross-section is smaller than the cross-section of the hollow part 11a, a first engagement part 12b provided at one end of the fusible part 12a, and a second engagement part 12c provided at the other end of the fusible part 12a, where the fusible part 12a is positioned in the hollow part 11a, the first engagement part 12b and the second engagement part 12c are disposed on the respective ends of the insulator sleeve 11; (3) a first terminal 13 having a first connection part 13a connected to the first engagement part 12b; and (4) a second terminal 14 having a second connection part 14a connected to the second engagement part 12c.

Abstract: In an embodiment, a multilayer ceramic capacitor with interposer CWI1 has adhesive material parts 40 provided between the multilayer ceramic capacitor 10 and interposer 20, and the adhesive material parts 40 include space-setting members 41 for setting the spacing between the multilayer ceramic capacitor 10 and interposer 20. The electronic component with interposer can offer an improvement to the issue of its height dimension varying excessively.

Abstract: A multilayer ceramic capacitor has a laminate including dielectric layers laminated alternately with internal electrode layers of different polarities, wherein the dielectric layer contains ceramic grains having Ba, Ti, and X (wherein X represents at least one type of element selected from the group consisting of Mo, Ta, Nb, and W) and a variation in the concentration distribution of X above in the ceramic grain is within ±5%. The multilayer ceramic capacitor can offer excellent service life characteristics even when the thickness of the dielectric layer is 0.8 ?m or less, as well as excellent bias characteristics.

Abstract: An electric circuit device connecting first and second external elements, the electric circuit device including: a first electronic component; a first bus bar electrically connected to the first electronic component; a second bus bar electrically connected to the electronic component and overlapped with the first bus bar in a direction perpendicular to main surfaces of the first and second bus bars; a first external terminal electrically connecting the first bus bar to the first external element; a second external terminal electrically connecting the second bus bar to the second external element; a first region in the first external terminal electrically coupled to the first external element; and a second region in the second external terminal electrically coupled to the second external element, and at least partially overlapped with the first region in the direction.

Abstract: A multi-layer ceramic capacitor has a structure where the dispersion, nd, of average grain size of the dielectric grains constituting the dielectric layer (a value (D90/D10) obtained by dividing D90 which is a grain size including 90% cumulative abundance of grains by D10 which is a grain size including 10% cumulative abundance of grains) is smaller than 4.

Abstract: A multi-layer ceramic capacitor has a structure where the dispersion, nd, of average grain size of the dielectric grains constituting the dielectric layer (a value (D90/D10) obtained by dividing D90 which is a grain size including 90% cumulative abundance of grains by D10 which is a grain size including 10% cumulative abundance of grains) is smaller than 4.