Patents by Inventor Tetsuo Toyoda

Tetsuo Toyoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8605919
    Abstract: A microphone has a housing (9) defining an acoustic hole (99) and having inner faces. The microphone includes a MEMS capacitor (1) secured to and electrically connected with a first face (6) of the inner faces of the housing (9), the first face defining the acoustic hole (99), a detecting circuit (7) secured to and electrically connected with a second face (8) of the inner faces of the housing (9), the second face (8) being not adjacent the first face (6), the detecting circuit (7) detecting at least a change in the electrostatic capacity of the MEMS capacitor (1). The microphone further includes a flexible substrate (4) secured to the first face (6) and the second face (8) and disposed under a bent state inside the housing (9). The flexible substrate (4) establishes electrical connection between the MEMS capacitor (1) and the detecting circuit (7) via a wire electrically connecting the first face (6) and the second face (8).
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: December 10, 2013
    Assignee: Hosiden Corporation
    Inventors: Ryuji Awamura, Noriaki Hanada, Kensuke Nakanishi, Tetsuo Toyoda
  • Publication number: 20110135122
    Abstract: A microphone has a housing (9) defining an acoustic hole (99) and having inner faces. The microphone includes a MEMS capacitor (1) secured to and electrically connected with a first face (6) of the inner faces of the housing (9), the first face defining the acoustic hole (99), a detecting circuit (7) secured to and electrically connected with a second face (8) of the inner faces of the housing (9), the second face (8) being not adjacent the first face (6), the detecting circuit (7) detecting at least a change in the electrostatic capacity of the MEMS capacitor (1). The microphone further includes a flexible substrate (4) secured to the first face (6) and the second face (8) and disposed under a bent state inside the housing (9). The flexible substrate (4) establishes electrical connection between the MEMS capacitor (1) and the detecting circuit (7) via a wire electrically connecting the first face (6) and the second face (8).
    Type: Application
    Filed: December 1, 2010
    Publication date: June 9, 2011
    Applicant: HOSIDEN CORPORATION
    Inventors: Ryuji Awamura, Noriaki Hanada, Kensuke Nakanishi, Tetsuo Toyoda
  • Patent number: 4014091
    Abstract: An improved method for making a backplate assembly for an electret transducer used in a microphone wherein a synthetic resin film such as polytetrafluoroethylene or fluorinated ethylene-propylene copolymer is attached to a plate member having a flat conductive surface and which has been heated so as to securely attach the film thereon and charging said synthetic film to form an electret.
    Type: Grant
    Filed: August 22, 1972
    Date of Patent: March 29, 1977
    Assignee: Sony Corporation
    Inventors: Yoichi Kodera, Tetsuo Toyoda