Abstract: In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the wiring portion formed in the through hole, in at least one face, in which electrodes of the semiconductor element are electrically connected to the wiring pattern, and in which the face of the substrate which has the semiconductor element is coated with a resin, the through hole has a through hole land with a width of 0.02 mm or more, which is conductive to the wiring portion, in a substrate face, and the wiring portion and the through hole land are exposed.

Abstract: In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the wiring portion formed in the through hole, in at least one face, in which electrodes of the semiconductor element are electrically connected to the wiring pattern, and in which the face of the substrate which has the semiconductor element is coated with a resin, the through hole has a through hole land with a width of 0.02 mm or more, which is conductive to the wiring portion, in a substrate face, and the wiring portion and the through hole land are exposed.

Abstract: In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the wiring portion formed in the through hole, in at least one face, in which electrodes of the semiconductor element are electrically connected to the wiring pattern, and in which the face of the substrate which has the semiconductor element is coated with a resin, the through hole has a through hole land with a width of 0.02 mm or more, which is conductive to the wiring portion, in a substrate face, and the wiring portion and the through hole land are exposed.

Abstract: In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the wiring portion formed in the through hole, in at least one face, in which electrodes of the semiconductor element are electrically connected to the wiring pattern, and in which the face of the substrate which has the semiconductor element is coated with a resin, the through hole has a through hole land with a width of 0.02 mm or more, which is conductive to the wiring portion, in a substrate face, and the wiring portion and the through hole land are exposed.

Abstract: The diving mask is capable of suitably restraining abnormal image vision and which can be precisely produced at low cost. The diving mask of the present invention comprises a viewfield lens, which is constituted by a flat front section and side sections extended from the front section. The side sections are formed like toric faces, and the side sections respectively have Fresnel lens parts capable of correcting negative refracting power under water.

Abstract: An electrical connecting member is provided with a holding member made of an electric insulating material and a plurality of conductive members held by the holding member in a state of being insulated with each other. One end of each of the conductive members is exposed on one surface of the holding member and the other end of each of the conductive members is exposed on the other surface of the holding member. The conductive members have portions exposed from the holding member, the length of which is longer than the thickness of the holding member. These exposed portions are easily deformed by the pressure force exerted at the time of connecting electric circuit components to reduce the coupling load even when there is irregularity in the heights thereof or unevenness in the junctions of the objects connection, hence enabling high density connections between the electric circuit components. The exposed portions can also be formed to have empty holes, i.e.

Abstract: A first terminal portion constructed by a plurality of contact pins of a first circuit board and a second terminal portion constructed by a plurality of contact pins of a second circuit board are joined in a housing of a connector. The connector has a presser for applying a pressing force to a joint portion. The presser applies the pressing force, thereby joining the plurality of contact pins of the first terminal and the plurality of contact pins of the second terminal through soft metal projections. Thus, a joint area of the contact terminal portion can be increased and the reliability of the joining can be improved. Since the circuit boards are positioned, the terminal portions of the circuit boards can be accurately joined.

Abstract: A method for the electrical connection between electrical joints of electric circuit components includes disposing said electric circuit components so that said joints for the electrical connection are opposed to each other, and making the electrical connection between said electrical joints with a biasing force which is exerted by an elastic member from at least one side of said electric circuit component so that the biasing force is exerted consecutively from an intermediate position of connecting area where said joints are located to the periphery of said connecting area.

Abstract: An electrical connecting member for use in an electrical connection for connecting a first electrical circuit component on a side thereof and a second electrical circuit component on another side thereof, said electrical connecting member comprising: a plurality of layers each layer having a plurality of conductive members and an insulative holder for holding said plurality of conductive members, wherein said plurality of conductive members are arranged such that each conductive member has one end exposed on one surface of said layer and another end exposed on another surface of said layer, and makes electric contact with at least one of a conductive member immediately below and a conductive member immediately above, but does not contact conductive members laterally offset thereof, and wherein said conductive members have diameters that are substantially equal to each other, between said one surface of said layer and said another surface of said layer; and said plurality of layers are stacked such that said p

Abstract: A watertight suit is capable of properly discharging air within the suit and safely maintaining a diver's position in the water. The suit includes an air outlet valve provided in an end section of a leg part, the air outlet valve functioning to discharge air from the inside of the leg part. Another air outlet valve can also be provided in an upper body part of the suit. An air inlet introduces air into the watertight suit as necessary to equalize external pressure. Where an automatic air outlet valve is provided, air in excess of external pressure is vented through the outlet valves automatically as warranted by the diving conditions, keeping an even balance of pressure even when air is excessively supplied form the air source through the inlet valve.

Abstract: A semiconductor optical device is provided with a photo-electric conversion unit having plural photo-electric conversion elements and is entirely sealed by a sealing member. The photo-electric conversion elements are connected to external leads with electrical connectors. The distance D between a planar outer surface and a photoelectric conversion area satisfies the equation, D.gtoreq./2.multidot.l/tan .theta., where .theta. is a critical angle of total reflection of the sealing member with respect to air and l is the maximum length of said photoelectric conversion area.

Abstract: An electrical connecting member is provided with a holding member made of an electric insulating material and a plurality of conductive members held by the holding member in a state of being insulated with each other. One end of each of the conductive members is exposed on one surface of the holding member and the other end of each of the conductive members is exposed on the other surface of the holding member. The conductive members have portions exposed from the holding member, the length of which is longer than the thickness of the holding member. These exposed portions are easily deformed by the pressure force exerted at the time of connecting electric circuit components to reduce the coupling load even when there is irregularity in the heights thereof or unevenness in the junctions of the objects connection, hence enabling high density connections between the electric circuit components.

Abstract: A method for producing an electrical circuit member includes the steps of positioning and arranging first and second electrical circuit parts having plural electrical connecting portions to be spaced and oppose each other, preparing an electrical connecting member having a plurality of electrical conductive members, each of which extends from one side of a holding member of an electrical insulating material therethrough to an opposite side of the holding member and is held in the holding member so that opposing ends of the electrical conductive member protrude from opposite sides of the holding member, and applying an adhesive to at least one side of the electrical connecting member including the electrical conductive members. The electrical connecting member with the adhesive is inserted between the first and second electrical circuit parts, and a pressing force is applied so that the first and second electrical parts contact the ends of the electrical conductive members.

Abstract: An electrical circuit member comprises an electrical connecting member, said electrical connecting member having a holding member comprising an electrically insulating material and a plurality of electroconductive members embedded at predetermined intervals within said holding member, each of said plurality of electroconductive members being insulated with said electrically insulating material and also having the ends of said electroconductive member exposed on both surfaces of said holding member; and an electrical circuit part, said electrical circuit part having connecting portions to be connected to said electroconductive member or said wiring pattern exposed on both surfaces of said holding member, and being connected to at least one surface of said holding member.

Abstract: An electrical connecting member, one surface of which is connected to a connecting section of a first electrical circuit member and another surface of which is connected to a connecting section of a second electrical circuit member. The electrical connecting member includes a holding member formed of an electrically insulative member. The holding member has a plurality of recess holes. The connecting member also includes a plurality of electrically conductive members provided in the electrically insulative member, insulated from each other. One end of the electrically conductive members is exposed on one surface of the holding member to be connected to the connecting section of the first electrical circuit member. Another end of the electrically conductive members is exposed on another surface of the holding member to be connected to the connecting section of the second electrical circuit member.

Abstract: In a method for manufacturing a semiconductor photo-sensor, an assembly including a photoelectric conversion element having a photoreceiving section, and a lead terminal having an inner lead connected to the photoelectric conversion element by a bonding wire is provided. A light transmitting member is also provided within the cavity spaced apart from the photoelectric conversion element and at a light-incident side of the photoelectric conversion element, the light transmitting member having an inner surface facing an upper surface of the photoelectric conversion element and an outer surface opposite the inner surface. The photoelectric conversion element, the inner lead and the bonding wire are sealed by introducing a light transmitting resin into the cavity so as to provide a relation l<2.multidot.(d.sub.1 +d.sub.2).multidot.tan.theta..sub.1, wherein l is a length of the photoreceiving section of the photoelectric conversion element, d.sub.

Abstract: A method for checking a part to be measured, by using an electric connection member having a holder made of electrically insulative material and a plurality of electrically conductive members embedded within the holder with being insulated from each other, both ends of the electrically conductive members being exposed on both surfaces of the holder in such a manner that the both ends are flush with or protruded from the both surfaces of the holder; an electric circuit member having connection portions; and a measured part having connection portions. At least one of the ends of the electrically conductive members exposed on one surface of the holder is electrically connected to one of the connection portions of the electric circuit member and at least one of the ends of the electrically conductive members exposed on the other surface of the holder is electrically connected to one of the connection portions of the measured part.

Abstract: A process for preparing an electrical connecting member having a holding member comprising an electrically insulating material and a plurality of electroconductive members equipped in the holding member under the state mutually insulated from each other, one end of the each electroconductive member being exposed at one surface of the holding member, and the other end of the each electroconductive member being exposed at the other surface of the each holding member, the process having the following steps, namely the step of forming a matrix having the state where the holding member is in contact with a base member for supporting the holding member the step of irradiating a high energy beam on the matrix from the holding member side to remove the holding member, thereby forming a plurality of holes the step of filling an electroconductive material which becomes the electroconductive member into the plurality of holes formed and the step of removing the base member.

Abstract: A guided-wave circuit module includes a guided-wave circuit chip having an input waveguide part and an output waveguide part at the ends thereof, a guided-wave circuit part having a predetermined function and positioned between the input waveguide part and the output waveguide part; and a holder for supporting the guided-wave circuit chip, wherein the guided-wave circuit part of the guided-wave circuit chip does not come in contact with the chip holder; at least part of the input and output waveguide parts of the guided-wave circuit chip is fixed to the holder with a fixing agent; and the packaged chip does not have a warp which leads to deterioration of characteristics. A fixing agent having a high hardness is applied to the periphery of the endfaces of the input and output waveguide parts of the guided-wave circuit module and to the periphery of the fiber endfaces of the optical fiber array connected to the module.

Abstract: A method of manufacturing an electrical connecting member having a holding member formed of an electrically insulative material, and a plurality of electrically conductive members provided in a mutually insulated state in the holding member, one end of each of the electrically conductive members being exposed on one surface of the holding member and the other end of each of the electrically conductive members being exposed on the other surface of the holding member, includes the steps of providing photosensitive resin which provides the holding member on a base body, applying light to the photosensitive resin through a photomask forming a predetermined pattern to thereby expose the photosensitive resin to the light, developing the photosensitive resin to form a plurality of apertures in the photosensitive resin, thereby exposing the base body, leaving the photosensitive resin through which the base body has been exposed in a heated atmosphere and/or a negative pressure atmosphere for a predetermined time, etc