Patents by Inventor Tetsuro Shirasaka

Tetsuro Shirasaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE PROCESSING METHOD
    Publication number: 20240141501
    Abstract: A controller performs an adjustment processing including: forming a film on a surface of a substrate by a film forming unit; removing a peripheral portion of the film by the film forming unit; acquiring surface information indicating a state of the surface of the substrate including the film, from which the peripheral portion has been removed, by a surface inspection unit and adjusting a cut width of the peripheral portion based on the surface information; and peeling the film, from which the peripheral portion has been removed, by the film forming unit, and a process processing including: forming the film on the surface of the substrate by the film forming unit; and removing the peripheral portion by the cut width adjusted in the adjustment processing in the film forming unit.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Inventors: Tetsuro Shirasaka, Naoto Nakamura
  • Substrate processing apparatus, substrate processing method and recording medium
    Patent number: 11905597
    Abstract: A controller performs an adjustment processing including: forming a film on a surface of a substrate by a film forming unit; removing a peripheral portion of the film by the film forming unit; acquiring surface information indicating a state of the surface of the substrate including the film, from which the peripheral portion has been removed, by a surface inspection unit and adjusting a cut width of the peripheral portion based on the surface information; and peeling the film, from which the peripheral portion has been removed, by the film forming unit, and a process processing including: forming the film on the surface of the substrate by the film forming unit; and removing the peripheral portion by the cut width adjusted in the adjustment processing in the film forming unit.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: February 20, 2024
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Tetsuro Shirasaka, Naoto Nakamura
  • SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM
    Publication number: 20220145468
    Abstract: A controller performs an adjustment processing including: forming a film on a surface of a substrate by a film forming unit; removing a peripheral portion of the film by the film forming unit; acquiring surface information indicating a state of the surface of the substrate including the film, from which the peripheral portion has been removed, by a surface inspection unit and adjusting a cut width of the peripheral portion based on the surface information; and peeling the film, from which the peripheral portion has been removed, by the film forming unit, and a process processing including: forming the film on the surface of the substrate by the film forming unit; and removing the peripheral portion by the cut width adjusted in the adjustment processing in the film forming unit.
    Type: Application
    Filed: February 14, 2020
    Publication date: May 12, 2022
    Inventors: Tetsuro Shirasaka, Naoto Nakamura