Abstract: A room-temperature-curable organopolysiloxane composition for an oil seal, wherein an organosilane compound containing a specific organo-oxymethyl group and represented by formula (1) below and/or a partial hydrolysis condensate of said compound is used as a curing agent (crosslinking agent), and an organic compound having a guanidine skeleton is added in combination as a curing catalyst. In the formula, each R1 is independently a C1-12 unsubstituted or substituted monovalent hydrocarbon group, R2 is a C1-12 unsubstituted or substituted monovalent hydrocarbon group, Y is a hydrolyzable group, and n is 0, 1 or 2.

Abstract: The present invention is a room temperature curable resin composition comprising: as the main agent, an organic polymer in which both molecular chain terminals are sealed by a silanol group and/or a hydrolyzable silyl group; and an organic silicon compound of a specific structure having, in a molecule, an organosiloxane structure, a hydrolyzable silyl group, and a hindered amine skeleton. This resin composition produces a cured product in which the degradation over time associated with the effects of light such as UV rays can be suppressed.

Abstract: A transportation device includes a first transporter, a second transporter movable between a contact position and a separate position toward and away from the first transporter to hold a to-be-transported object between the second transporter and the first transporter in the contact position, and a transportation unit that transports the to-be-transported object to a nip area where the first transporter and the second transporter hold the to-be-transported object therebetween while the second transporter is located in the separate position. The second transporter moves from the separate position to the contact position to hold the to-be-transported object transported to the nip area by the transportation unit between the second transporter and the first transporter to transport the to-be-transported object.

Abstract: A transport device includes: a first transport body; a second transport body that is movable between a contact position and a separate position with respect to the first transport body and that nips a transported material with the first transport body at the contact position; and a transport section that includes a holder to hold a leading end portion of the transported material and that transports the transported material toward a nip region where the first transport body and the second transport body nip the transported material in a state in which the second transport body is located at the separate position. After holding of the leading end portion by the holder for the transported material transported by the transport section has been released, the second transport body nips the transported material with the first transport body and transports the transported material.

Abstract: An aqueous solution composition containing a co-hydrolysate or a co-hydrolytic condensate of an organosilicon compound of formula (1) and an organosilicon compound of formula (2), or both the co-hydrolysate and the co-hydrolytic condensate: wherein R1 and R2 are each independently an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms, R3 is an alkyl group having 12 to 24 carbon atoms, R4 and R5 are each independently an alkyl group having 1 to 6 carbon atoms, X is a halogen atom, m is an integer of 1 to 20, and n is an integer of 1 to 3.

Abstract: This polymer having a reactive silicon-containing group is represented by structural formula (1), and has good reactivity while having a monoalkoxysilyl group. (In the formula, X represents a monovalent to trivalent organic group including a main chain backbone including a predetermined polymer such as a polyurethane, a poly(meth)acrylate, or a polysiloxane, R1 and R2 each independently represent an alkyl group or the like having 1-10 carbon atoms, Y represents O, S, or the like, A1 and A2 each represent a single bond, or a divalent linking group such as a divalent hydrocarbon group having 1-20 carbon atoms, and n represents a number of 1-3.

Abstract: This organopolysiloxane which has a constituent unit represented by general formula (1) and a group represented by general formula (2), said group being directly bonded to a silicon atom, enables a curable composition containing a polyisocyanate compound to achieve a good balance between fast curing properties and storage stability, and enables the achievement of a cured product that has excellent hardness, heat resistance and wet heat resistance. (In formula (1), each of R1A and R1B independently represents a hydrogen atom, an alkyl group having from 1 to 10 carbon atoms, or an aryl group having from 6 to 10 carbon atoms; and A1 represents an unsubstituted or substituted divalent hydrocarbon group having from 1 to 20 carbon atoms and optionally having a hetero atom.) R2O—??(2) (In formula (2), R2 represents a hydrogen atom, an unsubstituted or substituted alkyl group having from 1 to 10 carbon atoms, or an unsubstituted or substituted aryl group having from 6 to 10 carbon atoms.

Abstract: An aqueous solution composition containing a co-hydrolysate or a co-hydrolytic condensate of an organosilicon compound of formula (1) and an organosilicon compound of formula (2), or both the co-hydrolysate and the co-hydrolytic condensate: wherein R1 and R2 are each independently an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms, R3 is an alkyl group having 12 to 24 carbon atoms, R4 and R5 are each independently an alkyl group having 1 to 6 carbon atoms, X is a halogen atom, m is an integer of 1 to 20, and n is an integer of 1 to 3.

Abstract: This organopolysiloxane having a structural unit represented by general formula (1): (in the formula, R1 represents an unsubstituted or substituted alkyl group having 1-12 carbon atoms or an unsubstituted or substituted aryl group having 6-10 carbon atoms) and having at least one group that directly binds to a silicon atom and that is selected from the groups represented by general formula (2); R2O—??(2) (in the formula, R2 represents a hydrogen atom, an unsubstituted or substituted alkyl group having 1-10 carbon atoms, or an unsubstituted or substituted aryl group having 6-10 carbon atoms), is capable of achieving both hardness and bending resistance, exhibits excellent fast curing ability even when an amine-based compound is used as a curing catalyst, and is highly safe.

Abstract: Disclosed is an organopolysiloxane having a constituent unit represented by a general formula (1), a constituent unit represented by a general formula (2), and a group represented by a general formula (3) that is directly bonded to a silicon atom. R1 represents an alkyl group or an aryl group. R2 each independently represents an alkyl group or an aryl group, n is each independently 2 or 3, and m is an integer of 5 to 100. R3O—??(3) R3 represents a hydrogen atom, an alkyl group, or an aryl group.

Abstract: The present invention is a room temperature curable resin composition comprising: as the main agent, an organic polymer in which both molecular chain terminals are sealed by a silanol group and/or a hydrolyzable silyl group; and an organic silicon compound of a specific structure having, in a molecule, an organosiloxane structure, a hydrolyzable silyl group, and a hindered amine skeleton. This resin composition produces a cured product in which the degradation over time associated with the effects of light such as UV rays can be suppressed.

Abstract: A specific conductivity measurement method includes: performing first measurement to obtain a resonance frequency f1 that is outputted to a measuring device when the first and second dielectric flat plates each have a thickness t1, and an unloaded Qu1 that corresponds to the resonance frequency f1; performing second measurement to obtain a resonance frequency f2 that is outputted to the measuring device when the first and second dielectric flat plates each have a thickness t2 that is different from the thickness t1, and an unloaded Qu2 that corresponds to the resonance frequency f2; and calculating a specific conductivity ?r of the copper foil and the first and second conductor flat plates based on an arithmetic equation that includes the resonance frequency the unloaded Qu1, the resonance frequency f2, and the unloaded Qu2.

Abstract: A room-temperature-curable organopolysiloxane composition for an oil seal, wherein an organosilane compound containing a specific organo-oxymethyl group and represented by formula (1) and/or a partial hydrolysis condensate of said compound is used as a curing agent (crosslinking agent), and an organic compound having a guanidine skeleton is added in combination as a curing catalyst. (In the formula, each R1 is independently a C1-12 unsubstituted or substituted monovalent hydrocarbon group, R2 is a C1-12 unsubstituted or substituted monovalent hydrocarbon group, Y is a hydrolyzable group, and n is 0, 1 or 2.) It is thus possible to obtain a cured product having good rubber properties, adhesiveness, and engine oil resistance after curing even without containing a metal-based catalyst.

Abstract: Provided is a polyoxyalkylene group-containing organosilicon compound which contains at least one group represented by structural formula (1) in one molecule and has a polyoxyalkylene structure in the main chain. This polyoxyalkylene group-containing organosilicon compound exhibits satisfactorily fast curability and excellent safety even when an amine compound is used as a curing catalyst (In the formula, each R1 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 and group, each R2 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 aryl group, and each R3 independently represents an unsubstituted or substituted C1-10 alkyl group, or a hydrogen atom. m is a number from 1-3, and n is an integer of 2 or greater. A dashed line represents a bond.

Abstract: An addition reaction-curable silicone emulsion composition containing a water-soluble silane coupling agent (I) and an organopolysiloxane (II) having at least two alkenyl groups in one molecule thereof, where the water-soluble silane coupling agent (I) has at least one group selected from among a succinic anhydride group, a quaternary ammonium group, and a ureido group, and 1 part by mass or more of the water-soluble silane coupling agent (I) is contained relative to 100 parts by mass of the organopolysiloxane (II). This provides: a silicone emulsion composition that gives a cured film adhering well to plastic film substrates regardless of the type, while having suitable release properties regarding adhesives; and a delamination film made by forming a cured film of the silicone emulsion composition.

Abstract: An organopolysiloxane compound represented by average structural formula (1) is capable of imparting an electron beam curable resin with high antistatic properties, while having excellent antistatic performance durability.

Abstract: An electronic component includes: a first terminal that is inserted into a first through hole in a substrate; and a second terminal that is inserted into a second through hole in the substrate, wherein a length of the first terminal from a first end that is inserted into the first through hole to a second end is longer than a length of the second terminal from a third end that is inserted into the second through hole to a fourth end, and a cross sectional area of a portion of the first terminal positioned on a side of the second end with respect to a first joined portion is larger than a cross sectional area of a portion of the second terminal positioned on a side of the fourth end with respect to a second joined portion.

Abstract: Provided are: a removable radiation-curable silicone composition which has excellent radiation curability and gives cured objects having excellent adhesiveness to the substrates; and a release sheet. The removable radiation-curable silicone composition comprises the following components (A), (B), (C), and (D): (A) 100 parts by mass of an organopolysiloxane having an alkenyl group; (B) 1-30 parts by mass of an organopolysiloxane having a mercaptoalkyl group; (C) 0.1-5 parts by mass of a compound having a plurality of acryl groups in the molecule; and (D) 0.1-15 parts by mass of a radical polymerization initiator.

Abstract: A laser wavelength control device, includes a memory; and a processor coupled to the memory and configured to: measure a wavelength of a laser beam emitted by a light source, when the measured wavelength is not in a target wavelength band, adjust a voltage to be applied to the light source such that a wavelength of the laser beam falls within the target wavelength band, and when a wavelength measured after the adjustment of the voltage is not in the target wavelength band, adjust a temperature of the light source such that the wavelength of the laser beam falls within the target wavelength band.

Abstract: An integrated circuit (IC) tag includes: an IC chip; a substrate that is provided with an antenna on a first surface; an adhesive portion configured to adhere a side surface of the IC chip and a peripheral of the IC chip in a state that a terminal of the IC chip is electrically coupled to the antenna; and a first member that is provided between the antenna and the adhesive portion, the first member having an elastic modulus higher than an elastic modulus of the antenna.