Patents by Inventor Tetsushi Senda

Tetsushi Senda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing composition and polishing method using the same
    Publication number: 20060218867
    Abstract: A polishing composition contains sodium hypochlorite, colloidal silica and water. The effective chlorine concentration in the polishing composition is 0.5 to 2.5%, and the content of colloidal silica in the polishing composition is 1 to 13% by weight. The polishing composition can be preferably used in polishing germanium or silicon-germanium single crystal.
    Type: Application
    Filed: March 27, 2006
    Publication date: October 5, 2006
    Inventors: Isamu Koshiyama, Sachiko Hoshiya, Tetsushi Senda, Haruo Masai
  • Polishing method of goods and abrasive pad therefor
    Patent number: 5104421
    Abstract: A polishing method and abrasive pads used to polish of abrade, for example, lenses. The pad is manufactured with an abrasives such as grains of the mean diameter: 0.5-10 .mu.m of alumina, zirconium oxide, tin oxide, and cerium oxide, a kind of water-soluble cellulose ether selected from the group of hydroxypropylmethyl and the like, and a kind of insolubilizing agent such as glyoxal, citric acid, and the like. The substances above are blended and coated on a sheet-like substrate. In polishing process, only water is poured between the rotating abrasives pad and goods to be polished.
    Type: Grant
    Filed: November 14, 1990
    Date of Patent: April 14, 1992
    Assignee: Fujimi Abrasives Co., Ltd.
    Inventors: Gisaburo Takizawa, Tetsushi Senda, Shiro Miura