Patents by Inventor Tetsuya EMOTO
Tetsuya EMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230290631Abstract: A substrate processing method is provided. The substrate processing method includes: (S7) supplying a water repellent agent (SMT) to a substrate (W); (S11) supplying dilute isopropyl alcohol (dIPA) to the substrate (W) after the supplying a water repellent agent (SMT), the dilute isopropyl alcohol (dIPA) being obtained by diluting isopropyl alcohol; and (S12) drying the substrate (W) after the supplying dilute isopropyl alcohol (dIPA).Type: ApplicationFiled: June 22, 2021Publication date: September 14, 2023Inventors: Tetsuya EMOTO, Shigeru YAMAMOTO, Daiki FUJII, Kenji EDAMITSU, Keiji IWATA, Yuya KAWAI, Kenichi ITO
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Patent number: 10910213Abstract: A low surface tension liquid is supplied from a low surface tension liquid supplying unit to a heated substrate to replace a processing liquid by the low surface tension liquid. The heating of the substrate is weakened and the low surface tension liquid is supplied from the low surface tension liquid supplying unit to the substrate, so that a liquid film of the low surface tension liquid is formed. The liquid film on the substrate is removed by strengthening the heating of the substrate without supplying the low surface tension liquid from the low surface tension liquid supplying unit to a central region of the substrate.Type: GrantFiled: January 14, 2019Date of Patent: February 2, 2021Inventors: Tetsuya Emoto, Atsuro Eitoku, Tomomi Iwata
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Patent number: 10843223Abstract: A substrate processing method includes a rinse liquid supplying step of supplying a rinse liquid containing water to a major surface of a substrate, a rotating step of rotating the substrate around a rotation axis passing through a central portion of the major surface of the substrate, and a hydrophobizing agent supplying step of supplying a hydrophobizing agent containing a first dissolving agent to the major surface of the substrate to replace a liquid held on the major surface of the substrate with the hydrophobizing agent in parallel with the rotating step after the rinse liquid supplying step is performed, and the hydrophobizing agent supplying step includes a hydrophobizing agent discharging step of discharging a continuous flow of the hydrophobizing agent from a discharge port of a nozzle toward the major surface of the substrate held by a substrate holding unit with a Reynolds number at the discharge port being not more than 1500.Type: GrantFiled: May 30, 2018Date of Patent: November 24, 2020Assignee: SCREEN Holdings Co., Ltd.Inventors: Takayoshi Tanaka, Tetsuya Emoto, Akira Oato, Yuta Nakano, Teppei Nakano, Takashi Akiyama, Yuya Tsuchihashi, Reo Tamura, Atsuro Eitoku, Tomomi Iwata
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Patent number: 10790166Abstract: A substrate processing method includes a replacing step of replacing the processing liquid with a low surface tension liquid, a liquid film forming step of forming a liquid film of the low surface tension liquid on the upper surface of the substrate, by continuing supplying the low surface tension liquid to the upper surface of the substrate after the replacing step, an opening forming step of forming an opening at a central region of the liquid film, an enlarging removing step of removing the liquid film from the upper surface of the substrate by enlarging the opening toward a peripheral edge of the substrate, and a liquid film contact step of bringing a proximity member into contact with the liquid film, by bringing the proximity member close to the peripheral edge of the substrate after starting the opening forming step.Type: GrantFiled: January 11, 2018Date of Patent: September 29, 2020Assignee: SCREEN Holdings Co., Ltd.Inventor: Tetsuya Emoto
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Patent number: 10720320Abstract: A substrate processing method including a center portion discharging step of discharging a low-surface-tension liquid from a first low-surface-tension liquid nozzle disposed above a substrate toward the center portion of an upper surface, an inert gas supplying step of supplying inert gas to above the substrate in parallel with the center portion discharging step in order to form a gas flow flowing along the upper surface, and a peripheral edge portion discharging and supplying step of discharging the low-surface-tension liquid from a second low-surface-tension liquid nozzle disposed above the substrate toward a peripheral edge portion of the upper surface in parallel with the center portion discharging step and the inert gas supplying step.Type: GrantFiled: September 13, 2016Date of Patent: July 21, 2020Assignee: SCREEN Holdings Co., Ltd.Inventors: Tetsuya Emoto, Atsuro Eitoku, Tomomi Iwata, Akihiko Taki
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Patent number: 10510528Abstract: A substrate processing method includes a replacement step of replacing a rinse liquid adhered to the front surface of a substrate with a low surface tension liquid whose surface tension is lower than that of the rinse liquid, where the replacement step includes a low surface tension liquid supply step of supplying the low surface tension liquid to the front surface while supplying a heating fluid to the rear surface on a side opposite to the front surface and a post-heating step of supplying the heating fluid to the rear surface on the side opposite to the front surface of the substrate, in a state in which the supply of the low surface tension liquid to the front surface is stopped, before the start of a spin dry step after the completion of the low surface tension liquid supply step.Type: GrantFiled: June 13, 2016Date of Patent: December 17, 2019Assignee: SCREEN Holdings Co., Ltd.Inventor: Tetsuya Emoto
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Publication number: 20190148134Abstract: A low surface tension liquid is supplied from a low surface tension liquid supplying unit to a heated substrate to replace a processing liquid by the low surface tension liquid. The heating of the substrate is weakened and the low surface tension liquid is supplied from the low surface tension liquid supplying unit to the substrate, so that a liquid film of the low surface tension liquid is formed. The liquid film on the substrate is removed by strengthening the heating of the substrate without supplying the low surface tension liquid from the low surface tension liquid supplying unit to a central region of the substrate.Type: ApplicationFiled: January 14, 2019Publication date: May 16, 2019Inventors: Tetsuya EMOTO, Atsuro EITOKU, Tomomi IWATA
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Patent number: 10224198Abstract: A low surface tension liquid is supplied from a low surface tension liquid supplying unit to a heated substrate to replace a processing liquid by the low surface tension liquid. The heating of the substrate is weakened and the low surface tension liquid is supplied from the low surface tension liquid supplying unit to the substrate, so that a liquid film of the low surface tension liquid is formed. The liquid film on the substrate is removed by strengthening the heating of the substrate without supplying the low surface tension liquid from the low surface tension liquid supplying unit to a central region of the substrate.Type: GrantFiled: December 22, 2016Date of Patent: March 5, 2019Assignee: SCREEN Holdings Co., Ltd.Inventors: Tetsuya Emoto, Atsuro Eitoku, Tomomi Iwata
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Publication number: 20180345315Abstract: A substrate processing method includes a rinse liquid supplying step of supplying a rinse liquid containing water to a major surface of a substrate, a rotating step of rotating the substrate around a rotation axis passing through a central portion of the major surface of the substrate, and a hydrophobizing agent supplying step of supplying a hydrophobizing agent containing a first dissolving agent to the major surface of the substrate to replace a liquid held on the major surface of the substrate with the hydrophobizing agent in parallel with the rotating step after the rinse liquid supplying step is performed, and the hydrophobizing agent supplying step includes a hydrophobizing agent discharging step of discharging a continuous flow of the hydrophobizing agent from a discharge port of a nozzle toward the major surface of the substrate held by a substrate holding unit with a Reynolds number at the discharge port being not more than 1500.Type: ApplicationFiled: May 30, 2018Publication date: December 6, 2018Inventors: Takayoshi TANAKA, Tetsuya EMOTO, Akira OATO, Yuta NAKANO, Teppei NAKANO, Takashi AKIYAMA, Yuya TSUCHIHASHI, Reo TAMURA, Atsuro EITOKU, Tomomi IWATA
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Publication number: 20180269056Abstract: A substrate processing method including a center portion discharging step of discharging a low-surface-tension liquid from a first low-surface-tension liquid nozzle disposed above a substrate toward the center portion of an upper surface, an inert gas supplying step of supplying inert gas to above the substrate in parallel with the center portion discharging step in order to form a gas flow flowing along the upper surface, and a peripheral edge portion discharging and supplying step of discharging the low-surface-tension liquid from a second low-surface-tension liquid nozzle disposed above the substrate toward a peripheral edge portion of the upper surface in parallel with the center portion discharging step and the inert gas supplying step.Type: ApplicationFiled: September 13, 2016Publication date: September 20, 2018Applicant: SCREEN Holdings Co., Ltd.Inventors: Tetsuya EMOTO, Atsuro EITOKU, Tomomi IWATA, Akihiko TAKI
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Publication number: 20180247837Abstract: A substrate processing method includes a replacing step of replacing the processing liquid with a low surface tension liquid, a liquid film forming step of forming a liquid film of the low surface tension liquid on the upper surface of the substrate, by continuing supplying the low surface tension liquid to the upper surface of the substrate after the replacing step, an opening forming step of forming an opening at a central region of the liquid film, an enlarging removing step of removing the liquid film from the upper surface of the substrate by enlarging the opening toward a peripheral edge of the substrate, and a liquid film contact step of bringing a proximity member into contact with the liquid film, by bringing the proximity member close to the peripheral edge of the substrate after starting the opening forming step.Type: ApplicationFiled: January 11, 2018Publication date: August 30, 2018Inventor: Tetsuya EMOTO
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Publication number: 20170182515Abstract: A low surface tension liquid is supplied from a low surface tension liquid supplying unit to a heated substrate to replace a processing liquid by the low surface tension liquid. The heating of the substrate is weakened and the low surface tension liquid is supplied from the low surface tension liquid supplying unit to the substrate, so that a liquid film of the low surface tension liquid is formed. The liquid film on the substrate is removed by strengthening the heating of the substrate without supplying the low surface tension liquid from the low surface tension liquid supplying unit to a central region of the substrate.Type: ApplicationFiled: December 22, 2016Publication date: June 29, 2017Inventors: Tetsuya EMOTO, Atsuro EITOKU, Tomomi IWATA
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Publication number: 20160372320Abstract: A substrate processing method includes a replacement step of replacing a rinse liquid adhered to the front surface of a substrate with a low surface tension liquid whose surface tension is lower than that of the rinse liquid, where the replacement step includes a low surface tension liquid supply step of supplying the low surface tension liquid to the front surface while supplying a heating fluid to the rear surface on a side opposite to the front surface and a post-heating step of supplying the heating fluid to the rear surface on the side opposite to the front surface of the substrate, in a state in which the supply of the low surface tension liquid to the front surface is stopped, before the start of a spin dry step after the completion of the low surface tension liquid supply step.Type: ApplicationFiled: June 13, 2016Publication date: December 22, 2016Inventor: Tetsuya EMOTO
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Patent number: 9455134Abstract: A hydrophobizing agent vapor is supplied to a substrate and a surface of the substrate including a pattern is hydrophobized. Thereafter, the substrate is dried by vaporizing the hydrophobizing agent. The substrate to be processed is maintained in a state of not contacting water until it is dried after being hydrophobized. Collapse of a pattern formed on the substrate surface is thereby suppressed or prevented.Type: GrantFiled: March 5, 2015Date of Patent: September 27, 2016Assignee: SCREEN Holdings Co., Ltd.Inventors: Masahiro Kimura, Tomonori Kojimaru, Tetsuya Emoto, Manabu Okutani, Masayuki Otsuji
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Patent number: 9259758Abstract: A substrate treatment method is provided, which includes: a liquid film forming step of forming a liquid film of a treatment liquid on a front surface of a substrate; a hydrophobization liquid supplying step of supplying a hydrophobization liquid to a center portion of the front surface of the substrate for hydrophobizing the front surface of the substrate, while rotating the substrate; an inactivation suppressing step of suppressing inactivation of the supplied hydrophobization liquid on a peripheral edge portion of the front surface of the substrate simultaneously with the hydrophobization liquid supplying step; and a drying step of drying the substrate to which the hydrophobization liquid has been supplied.Type: GrantFiled: August 27, 2013Date of Patent: February 16, 2016Assignee: SCREEN HOLDINGS CO., LTD.Inventors: Tetsuya Emoto, Manabu Okutani
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Publication number: 20150179431Abstract: A hydrophobizing agent vapor is supplied to a substrate and a surface of the substrate including a pattern is hydrophobized. Thereafter, the substrate is dried by vaporizing the hydrophobizing agent. The substrate to be processed is maintained in a state of not contacting water until it is dried after being hydrophobized. Collapse of a pattern formed on the substrate surface is thereby suppressed or prevented.Type: ApplicationFiled: March 5, 2015Publication date: June 25, 2015Inventors: Masahiro KIMURA, Tomonori KOJIMARU, Tetsuya EMOTO, Manabu OKUTANI, Masayuki OTSUJI
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Patent number: 9005703Abstract: A hydrophobizing agent is supplied to a substrate and a surface of the substrate is hydrophobized. Thereafter, the substrate is dried. The substrate to be processed is maintained in a state of not contacting water until it is dried after being hydrophobized. Collapse of a pattern formed on the substrate surface is thereby suppressed or prevented.Type: GrantFiled: June 10, 2014Date of Patent: April 14, 2015Assignee: SCREEN Holdings Co., Ltd.Inventors: Masahiro Kimura, Tomonori Kojimaru, Tetsuya Emoto, Manabu Okutani, Masayuki Otsuji
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Publication number: 20140283882Abstract: A hydrophobizing agent is supplied to a substrate and a surface of the substrate is hydrophobized. Thereafter, the substrate is dried. The substrate to be processed is maintained in a state of not contacting water until it is dried after being hydrophobized. Collapse of a pattern formed on the substrate surface is thereby suppressed or prevented.Type: ApplicationFiled: June 10, 2014Publication date: September 25, 2014Inventors: Masahiro KIMURA, Tomonori KOJIMARU, Tetsuya EMOTO, Manabu OKUTANI, Masayuki OTSUJI
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Patent number: 8821974Abstract: A liquid hydrophobizing agent is supplied to a substrate and a surface of the substrate is hydrophobized. A solvent, lower in surface tension than water and capable of dissolving the hydrophobizing agent, is supplied to the substrate in a pre-drying rinsing step. Thereafter, the substrate is dried. The substrate to be processed is maintained in a state of not contacting water until it is dried after being hydrophobized.Type: GrantFiled: August 18, 2011Date of Patent: September 2, 2014Assignee: Dainippon Screen Mfg. Co., Ltd.Inventors: Masahiro Kimura, Tomonori Kojimaru, Tetsuya Emoto, Manabu Okutani, Masayuki Otsuji
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Publication number: 20140065295Abstract: A substrate treatment method is provided, which includes: a liquid film forming step of forming a liquid film of a treatment liquid on a front surface of a substrate; a hydrophobization liquid supplying step of supplying a hydrophobization liquid to a center portion of the front surface of the substrate for hydrophobizing the front surface of the substrate, while rotating the substrate; an inactivation suppressing step of suppressing inactivation of the supplied hydrophobization liquid on a peripheral edge portion of the front surface of the substrate simultaneously with the hydrophobization liquid supplying step; and a drying step of drying the substrate to which the hydrophobization liquid has been supplied.Type: ApplicationFiled: August 27, 2013Publication date: March 6, 2014Applicant: DAINIPPON SCREEN MFG. CO., LTDInventors: Tetsuya EMOTO, Manabu OKUTANI