Patents by Inventor Tetsuya Inaba

Tetsuya Inaba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6478132
    Abstract: An output shaft of an automatic transmission is constituted by a first output shaft outputting a driving force from a gear train of an automatic transmission and a second output shaft connected to the first output shaft so as to be movable in an axial direction and to be fixed in a rotational direction with respect to the first output shaft. The second output shaft is integral with a parking gear which fixes the second output shaft in rotation when the automatic transmission is set at a parking position. This arrangement improves applicability to the change of a longitudinal dimension of an automatic transmission and suppresses vibrations from being inputted from driving wheels to a gear train.
    Type: Grant
    Filed: October 19, 2000
    Date of Patent: November 12, 2002
    Assignee: Jatco Transtechnology Ltd.
    Inventor: Tetsuya Inaba
  • Patent number: 6374977
    Abstract: A drum supporting structure in an automatic transmission has a drum support immovably installed in the transmission case. The drum support includes a cylindrical hollow shaft portion on which the drum is rotatably disposed and a circular wall portion which is concentrically and integrally formed on one end of the cylindrical hollow shaft portion. A first part of the circular wall portion is secured to the transmission case and has a plurality of hydraulic fluid passages defined therein, and a second, diametrically opposed part of the circular wall portion has a plurality of blind bores defined therein. The number of the blind bores is at least the same as that of the hydraulic fluid passages. With this arrangement, the circular wall portion and thus the drum supporting structure is able to have a well-balanced structure.
    Type: Grant
    Filed: October 18, 2000
    Date of Patent: April 23, 2002
    Assignee: Jatco Transtechnology Ltd.
    Inventor: Tetsuya Inaba
  • Publication number: 20010040793
    Abstract: An electronic device comprising plurality of chips mounted at a high density as in a multi-chip module and having a reduced area and a thinner shape, provided with a folded flexible board having flexibility, chips mounted on a surface of the flexible board, and an adhesive comprising an insulating material filled between facing surfaces of the folded board for sealing the chips and affixing the facing surfaces.
    Type: Application
    Filed: January 31, 2001
    Publication date: November 15, 2001
    Inventor: Tetsuya Inaba