Patents by Inventor Tetsuya Itou

Tetsuya Itou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240086039
    Abstract: An order assistance apparatus includes: a display control unit configured to display sales information that has accepted the selecting operation with an addition of the number of orders corresponding to the number of times of the selecting operations in question; and a determination unit configured to determine whether or not the number of orders in question is equal to or greater than an upper limit value, in which when the number of orders is smaller than the upper limit value, the display control unit updates a display of the number of orders added to the sales information that has accepted a selecting operation by a value obtained by adding a number corresponding to the single selecting operation to the number of orders in question, and clears the number of orders in question when the number of orders is equal to or greater than the upper limit value.
    Type: Application
    Filed: September 6, 2021
    Publication date: March 14, 2024
    Applicant: NEC Corporation
    Inventors: Tetsuya Fuyuno, Kumiko Takatsuka, Mayumi Itou, Yosuke Minowa, Mari Tanaka
  • Patent number: 10731770
    Abstract: An actuator includes a rod, an electric motor to generate a rotational driving force on supply of electricity, an output shaft to output the rotational driving force of the electric motor to the rod, a feed screw mechanism, and a rotation prevention mechanism. The feed screw mechanism includes a female screw portion formed on one of the output shaft and the rod, and a male screw portion formed on the other to mesh with the female screw portion. The rotation prevention mechanism is configured to regulate rotation of the rod caused by the rotational driving force of the electric motor.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: August 4, 2020
    Assignees: DENSO CORPORATION, SOKEN, INC.
    Inventors: Yasuhiro Kawase, Yukikatsu Ozaki, Mikio Matsuda, Tetsuya Itou, Sadahisa Onimaru, Hiroki Ishii
  • Patent number: 10520231
    Abstract: A first valve member switches between a first communication state, in which a first inlet passage communicates with a first outlet passage and a second inlet passage is closed, and a second communication state, in which the second inlet passage communicates with the first outlet passage and the first inlet passage is closed. A second valve member switches between an opening state and a throttle state in which a smaller volume of a fluid flows from the third inlet passage to the second outlet passage as compared to the opening state. A valve driving member switches between a first operation state, in which the first valve member sets the first communication state and the second valve member sets the opening state, and a second operation state, in which the first valve member sets the second communication state and the second valve member sets the throttle state.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: December 31, 2019
    Assignee: DENSO CORPORATION
    Inventors: Tetsuya Itou, Masaaki Kawakubo
  • Patent number: 10391839
    Abstract: A refrigeration cycle device includes a pre-evaporator decompression unit that decompresses refrigerant which flowed out from an exterior heat exchanger, and an evaporator passage that guides the refrigerant which flowed out from the exterior heat exchanger to a suction port of a compressor while passing through a pre-evaporator decompression unit and an evaporator. Further, the refrigeration cycle device includes a bypass passage that guides the refrigerant which flowed out from the exterior heat exchanger to the suction port of the compressor while bypassing the pre-evaporator decompression unit and the evaporator, a pre-exterior device switching unit, and a passage switching unit that opens and closes the bypass passage. Further, the pre-exterior device switching unit and the passage switching unit form a coupled valve where the pre-exterior device switching unit and the passage switching unit are mechanically coupled.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: August 27, 2019
    Assignee: DENSO CORPORATION
    Inventors: Masaaki Kawakubo, Tetsuya Itou, Satoshi Itoh
  • Publication number: 20180222289
    Abstract: A refrigeration cycle device includes a pre-evaporator decompression unit that decompresses refrigerant which flowed out from an exterior heat exchanger, and an evaporator passage that guides the refrigerant which flowed out from the exterior heat exchanger to a suction port of a compressor while passing through a pre-evaporator decompression unit and an evaporator. Further, the refrigeration cycle device includes a bypass passage that guides the refrigerant which flowed out from the exterior heat exchanger to the suction port of the compressor while bypassing the pre-evaporator decompression unit and the evaporator, a pre-exterior device switching unit, and a passage switching unit that opens and closes the bypass passage. Further, the pre-exterior device switching unit and the passage switching unit form a coupled valve where the pre-exterior device switching unit and the passage switching unit are mechanically coupled.
    Type: Application
    Filed: July 20, 2016
    Publication date: August 9, 2018
    Inventors: Masaaki KAWAKUBO, Tetsuya ITOU, Satoshi ITOH
  • Publication number: 20180202569
    Abstract: An actuator includes a rod, an electric motor to generate a rotational driving force on supply of electricity, an output shaft to output the rotational driving force of the electric motor to the rod, a feed screw mechanism, and a rotation prevention mechanism. The feed screw mechanism includes a female screw portion formed on one of the output shaft and the rod, and a male screw portion formed on the other to mesh with the female screw portion. The rotation prevention mechanism is configured to regulate rotation of the rod caused by the rotational driving force of the electric motor.
    Type: Application
    Filed: July 7, 2016
    Publication date: July 19, 2018
    Applicants: Nippon Soken, Inc., Denso Corporation
    Inventors: Yasuhiro KAWASE, Yukikatsu OZAKI, Mikio MATSUDA, Tetsuya ITOU, Sadahisa ONIMARU, Hiroki ISHII
  • Publication number: 20180195780
    Abstract: A first valve member switches between a first communication state, in which a first inlet passage communicates with a first outlet passage and a second inlet passage is closed, and a second communication state, in which the second inlet passage communicates with the first outlet passage and the first inlet passage is closed. A second valve member switches between an opening state and a throttle state in which a smaller volume of a fluid flows from the third inlet passage to the second outlet passage as compared to the opening state. A valve driving member switches between a first operation state, in which the first valve member sets the first communication state and the second valve member sets the opening state, and a second operation state, in which the first valve member sets the second communication state and the second valve member sets the throttle state.
    Type: Application
    Filed: June 29, 2016
    Publication date: July 12, 2018
    Inventors: Tetsuya ITOU, Masaaki KAWAKUBO
  • Publication number: 20180023835
    Abstract: An expansion valve device has a housing, a valve body, an actuator, a first, second, and third detectors, and a controller. The housing defines a first refrigerant path and a second refrigerant path therein. The first detector detects a temperature of the refrigerant flowing in the first refrigerant path. The second detector detects a temperature and a pressure of the refrigerant flowing on an upstream side of the valve body in the second refrigerant path. The third detector detects a temperature or a pressure of the refrigerant flowing on a downstream side of the valve body in the second refrigerant path. The controller calculates a flow rate of the refrigerant flowing in the second refrigerant path and a superheating degree of the refrigerant flowing in the first refrigerant path, and controls the opening degree of the valve body such that the superheating degree falls within a specified range.
    Type: Application
    Filed: March 10, 2016
    Publication date: January 25, 2018
    Inventors: Mitsuo OOURA, Tatsuhiro MATSUKI, Tetsuya ITOU
  • Patent number: 9683761
    Abstract: In an integration valve, a body, in which a vapor-liquid separating space is provided, includes a fixed throttle decompressing liquid-phase refrigerant, a liquid-phase refrigerant side valve body member opening or closing a liquid-phase refrigerant passage, and a vapor-phase refrigerant side valve body member opening or closing a vapor-phase refrigerant passage. Further, the vapor-phase refrigerant side valve body member is configured by a differential pressure regulating valve operated based on a pressure difference between a refrigerant pressure at a side of the vapor-phase refrigerant passage and a refrigerant pressure at a side of the liquid-phase refrigerant passage. The vapor-phase refrigerant side valve body member is movable when the liquid-phase refrigerant side valve body member is moved by a solenoid. Therefore, a cycle configuration of a heat pump cycle configuring a gas injection cycle can be simplified.
    Type: Grant
    Filed: October 2, 2012
    Date of Patent: June 20, 2017
    Assignee: DENSO CORPORATION
    Inventors: Tetsuya Itou, Teruyuki Hotta, Atsushi Inaba, Yukihiko Takeda, Shigeji Ohishi, Keiichi Yoshii
  • Publication number: 20160290525
    Abstract: In a first expansion valve, a pair of fitting side surfaces, which are formed in a screw member, is opposed to a pair of groove side surfaces, respectively, which are formed in a rotatable member. The fitting side surfaces are rotated about an axis by the groove side surfaces. An overlapping width, throughout which the groove side surface and the fitting side surface are overlapped with each other, is larger than a female-thread inner diameter of a threaded hole, into which the screw member is threadably engaged.
    Type: Application
    Filed: June 30, 2014
    Publication date: October 6, 2016
    Inventors: Teruyuki HOTTA, Tetsuya ITOU, Yusuke ARAI, Hitoshi UMEZAWA
  • Patent number: 9109823
    Abstract: A vapor-liquid separating space is provided in a body. The body houses a fixed throttle-decompressing liquid-phase refrigerant, and an integration valve member selectively opening or closing a liquid-phase refrigerant passage and a vapor-phase refrigerant passage. The integration valve member is moved by a stepping motor connected to the integration valve member via a shaft. Accordingly, a cycle configuration of a heat pump cycle working as a gas injection cycle can be simplified.
    Type: Grant
    Filed: October 2, 2012
    Date of Patent: August 18, 2015
    Assignee: DENSO CORPORATION
    Inventors: Tetsuya Itou, Yukihiko Takeda, Teruyuki Hotta, Atsushi Inaba, Keiichi Yoshii, Shigeji Ohishi
  • Patent number: 9099545
    Abstract: A compound semiconductor device includes a substrate; a compound semiconductor layer formed on the substrate; a first insulating film formed on the compound semiconductor layer; a second insulating film formed on the first insulating film; and a gate electrode, a source electrode, and a drain electrode, each being formed on the compound semiconductor layer, wherein the gate electrode is formed of a first opening filled with a first conductive material via at least a gate insulator, and the first opening is formed in the first insulating film and configured to partially expose the compound semiconductor layer, and wherein the source electrode and the drain electrode are formed of a pair of second openings filled with at least a second conductive material, and the second openings are formed in at least the second insulating film and the first insulating film and configured to partially expose the compound semiconductor layer.
    Type: Grant
    Filed: September 23, 2013
    Date of Patent: August 4, 2015
    Assignee: Transphorm Japan, Inc.
    Inventors: Shinichi Akiyama, Kenji Nukui, Mutsumi Katou, Yoshitaka Watanabe, Tetsuya Itou, Yoichi Fujisawa, Toshiya Sato, Tsutomu Hosoda, Yuuichi Satou
  • Publication number: 20150052242
    Abstract: An information processing system includes a plurality of information processing apparatuses and a controller that controls the information processing apparatuses. The controller includes a selector that selects one of the information processing apparatuses, as a collecting unit, each of the information processing apparatus including a retriever that retrieves historical information items from the other information processing apparatuses, the retriever being operable after the information processing apparatus is assigned as the collecting unit; and a collector that collects the historical information items to generate collected information.
    Type: Application
    Filed: July 16, 2014
    Publication date: February 19, 2015
    Inventor: Tetsuya ITOU
  • Publication number: 20140290772
    Abstract: A vapor-liquid separating space is provided in a body. The body houses a fixed throttle-decompressing liquid-phase refrigerant, and an integration valve member selectively opening or closing a liquid-phase refrigerant passage and a vapor-phase refrigerant passage. The integration valve member is moved by a stepping motor connected to the integration valve member via a shaft. Accordingly, a cycle configuration of a heat pump cycle working as a gas injection cycle can be simplified.
    Type: Application
    Filed: October 2, 2012
    Publication date: October 2, 2014
    Applicant: DENSO CORPORATION
    Inventors: Tetsuya Itou, Yukihiko Takeda, Teruyuki Hotta, Atsushi Inaba, Keiichi Yoshii, Shigeji Ohishi
  • Publication number: 20140238067
    Abstract: In an integration valve, a body, in which a vapor-liquid separating space is provided, includes a fixed throttle decompressing liquid-phase refrigerant, a liquid-phase refrigerant side valve body member opening or closing a liquid-phase refrigerant passage, and a vapor-phase refrigerant side valve body member opening or closing a vapor-phase refrigerant passage. Further, the vapor-phase refrigerant side valve body member is configured by a differential pressure regulating valve operated based on a pressure difference between a refrigerant pressure at a side of the vapor-phase refrigerant passage and a refrigerant pressure at a side of the liquid-phase refrigerant passage. The vapor-phase refrigerant side valve body member is movable when the liquid-phase refrigerant side valve body member is moved by a solenoid. Therefore, a cycle configuration of a heat pump cycle configuring a gas injection cycle can be simplified.
    Type: Application
    Filed: October 2, 2012
    Publication date: August 28, 2014
    Applicant: DENSO CORPORATION
    Inventors: Tetsuya Itou, Teruyuki Hotta, Atsushi Inaba, Yukihiko Takeda, Shigeji Ohishi, Keiichi Yoshii
  • Patent number: 8769984
    Abstract: A decompression device includes an upstream throttle portion, a middle passage portion and a downstream throttle portion, which are arranged within a body portion. The upstream throttle portion is a variable throttle including an upstream throttle passage in which the refrigerant is decompressed and expanded, and a valve body having an open degree adjusting portion configured to adjust an open degree of the upstream throttle passage. The downstream throttle portion is a fixed throttle for decompressing and expanding refrigerant flowing from the middle passage portion. Furthermore, a refrigerant passage defined from the upstream throttle portion to the downstream throttle portion through the middle passage portion is provided in the body portion, and is bent at least at a bent portion in which the refrigerant flow is bent in the body portion.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: July 8, 2014
    Assignee: Denso Corporation
    Inventors: Tetsuya Itou, Teruyuki Hotta, Atsushi Inaba
  • Publication number: 20140077633
    Abstract: A vehicle includes a motor, a driving device, and a cooling device. The motor includes a motor main body and a winding switching unit. The motor main body includes windings and a first coolant channel to cool said windings. The winding switching unit is disposed on an outer surface of said motor main body and includes heat-generating components and a second coolant channel. The heat-generating components are used to switch said windings. The second coolant channel is to cool said heat-generating components. The driving device is configured to control switching of said winding switching unit and configured to apply driving voltage to said windings, the drive device including a third coolant channel. The cooling device is to cool coolant that flows through said first coolant channel, said second coolant channel and said third coolant channel.
    Type: Application
    Filed: November 18, 2013
    Publication date: March 20, 2014
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Toshio NAGAO, Yuuto FUKUMA, Takeshi INOUE, Tetsuya ITOU
  • Publication number: 20140021513
    Abstract: A compound semiconductor device includes a substrate; a compound semiconductor layer formed on the substrate; a first insulating film formed on the compound semiconductor layer; a second insulating film formed on the first insulating film; and a gate electrode, a source electrode, and a drain electrode, each being formed on the compound semiconductor layer, wherein the gate electrode is formed of a first opening filled with a first conductive material via at least a gate insulator, and the first opening is formed in the first insulating film and configured to partially expose the compound semiconductor layer, and wherein the source electrode and the drain electrode are formed of a pair of second openings filled with at least a second conductive material, and the second openings are formed in at least the second insulating film and the first insulating film and configured to partially expose the compound semiconductor layer.
    Type: Application
    Filed: September 23, 2013
    Publication date: January 23, 2014
    Applicant: FUJITSU SEMICONDUCTOR LIMITED
    Inventors: Shinichi AKIYAMA, Kenji NUKUI, Mutsumi KATOU, Yoshitaka WATANABE, Tetsuya ITOU, Yoichi FUJISAWA, Toshiya SATO, Tsutomu HOSODA, Yuuichi SATOU
  • Patent number: 8614527
    Abstract: This disclosure discloses a motor comprising: a motor main body; and a winding switching unit configured to switch windings of the motor main body; the motor main body including: a motor housing that a first coolant channel is formed inside; and a stator having the windings and fixed to an inner surface of the motor housing, the winding switching unit including: a winding switching housing that a second coolant channel is formed inside and being disposed on an outer surface of the motor housing, and heat-generating components disposed at an outer surface of the winding switching housing and used to switch the windings.
    Type: Grant
    Filed: January 7, 2011
    Date of Patent: December 24, 2013
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Toshio Nagao, Yuuto Fukuma, Takeshi Inoue, Tetsuya Itou
  • Patent number: 8569124
    Abstract: A compound semiconductor device includes a substrate; a compound semiconductor layer formed on the substrate; a first insulating film formed on the compound semiconductor layer; a second insulating film formed on the first insulating film; and a gate electrode, a source electrode, and a drain electrode, each being formed on the compound semiconductor layer, wherein the gate electrode is formed of a first opening filled with a first conductive material via at least a gate insulator, and the first opening is formed in the first insulating film and configured to partially expose the compound semiconductor layer, and wherein the source electrode and the drain electrode are formed of a pair of second openings filled with at least a second conductive material, and the second openings are formed in at least the second insulating film and the first insulating film and configured to partially expose the compound semiconductor layer.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: October 29, 2013
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Shinichi Akiyama, Kenji Nukui, Mutsumi Katou, Yoshitaka Watanabe, Tetsuya Itou, Yoichi Fujisawa, Toshiya Sato, Tsutomu Hosoda, Yuuichi Satou