Patents by Inventor Tetsuya Nishizawa

Tetsuya Nishizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11201527
    Abstract: To prevent creation of unnecessary resin when fixing a magnet with resin, a manufacturing method for manufacturing a magnet embedded core comprises: a placing step of placing the rotor core on a mounting table such that an end surface of the rotor core is in contact with the mounting table; a resin charging step of charging the resin in solid state into the magnet insertion hole; a melting step of inciting the resin in the magnet insertion hole; a magnet inserting step of inserting the magnet into the magnet insertion hole; a closure step of closing the opening of the magnet insertion hole remote from the mounting table; and a resin pressurizing step of pressurizing the molten resin that has flowed into a buffer chamber formed in the mounting table from the opening of the magnet insertion hole on a side of the mounting table following the closure step.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: December 14, 2021
    Assignee: KURODA PRECISION INDUSTRIES LTD.
    Inventors: Osamu Fukuyama, Tomoaki Murayama, Tetsuya Nishizawa, Masanobu Ikeda, Kazuo Nakamura
  • Patent number: 7909596
    Abstract: The resin molding machine is capable of cleaning a resin molding die while performing a molding action without stopping the molding action and capable of securely removing contaminations from the resin molding die. The resin molding machine comprises: a press unit including a resin molding die; and a cleaning unit for cleaning a molding face of the resin molding die. The cleaning unit has an energy ray irradiation section, which irradiates an energy ray to the molding face of the resin molding die so as to easily peel off a contamination, which has been stuck on the molding face during a molding action, from the molding face. The contamination is stuck onto resin of a molded product when the product is resin-molded, so that the molded product is released from the resin molding die together with the contamination.
    Type: Grant
    Filed: November 20, 2007
    Date of Patent: March 22, 2011
    Assignee: Apic Yamada Corporation
    Inventors: Fumio Miyajima, Yoshio Watanabe, Tetsuya Nishizawa, Hiroaki Yamagishi, Mitsugi Yoshino, Takashi Katayama
  • Publication number: 20080116598
    Abstract: The resin molding machine is capable of cleaning a resin molding die while performing a molding action without stopping the molding action and capable of securely removing contaminations from the resin molding die. The resin molding machine comprises: a press unit including a resin molding die; and a cleaning unit for cleaning a molding face of the resin molding die. The cleaning unit has an energy ray irradiation section, which irradiates an energy ray to the molding face of the resin molding die so as to easily peel off a contamination, which has been stuck on the molding face during a molding action, from the molding face. The contamination is stuck onto resin of a molded product when the product is resin-molded, so that the molded product is released from the resin molding die together with the contamination.
    Type: Application
    Filed: November 20, 2007
    Publication date: May 22, 2008
    Inventors: Fumio Miyajima, Yoshio Watanabe, Tetsuya Nishizawa, Hiroaki Yamagishi, Mitsugi Yoshino, Takashi Katayama