Patents by Inventor Tetsuya OKAMAE

Tetsuya OKAMAE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10529744
    Abstract: According to an aspect, a display device includes: a substrate including a display region and a non-display region surrounding the display region; at least one driver IC including connecting terminals with a first surface fixed to face the non-display region; first wires supplying a signal to the display region; first bumps connected with the first wires; second wires transferring a signal to and from outside; second bumps connected with the second wires; and inspection wires. The connecting terminals of the driver IC include first connecting terminals overlapping the first or second bumps in plan view, and a second connecting terminal not overlapping the first or second bumps in plan view. At least one inspection wire includes a connecting conductor between itself and the second connecting terminal, and at least one fuse portion, a narrower width part of the inspection wire in plan view.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: January 7, 2020
    Assignee: Japan Display Inc.
    Inventors: Tetsuya Okamae, Osamu Kobayashi
  • Patent number: 10153244
    Abstract: According to an aspect, a display device includes: a substrate including a display region and a non-display region surrounding the display region; at least one driver IC including connecting terminals with a first surface fixed to face the non-display region; first wires supplying a signal to the display region; first bumps connected with the first wires; second wires transferring a signal to and from outside; second bumps connected with the second wires; and inspection wires. The connecting terminals of the driver IC include first connecting terminals overlapping the first or second bumps in plan view, and second connecting terminals not overlapping the first or second bumps in plan view. The inspection wires include a connecting conductor between themselves and at least one of the second connecting terminals. The inspection wires are pulled out to an outside of the driver IC in plan view.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: December 11, 2018
    Assignee: Japan Display Inc.
    Inventors: Tetsuya Okamae, Shinji Yamakawa, Kazuyuki Sunohara
  • Publication number: 20170287939
    Abstract: According to an aspect, a display device includes: a substrate including a display region and a non-display region surrounding the display region; at least one driver IC including connecting terminals with a first surface fixed to face the non-display region; first wires supplying a signal to the display region; first bumps connected with the first wires; second wires transferring a signal to and from outside; second bumps connected with the second wires; and inspection wires. The connecting terminals of the driver IC include first connecting terminals overlapping the first or second bumps in plan view, and a second connecting terminal not overlapping the first or second bumps in plan view. At least one inspection wire includes a connecting conductor between itself and the second connecting terminal, and at least one fuse portion, a narrower width part of the inspection wire in plan view.
    Type: Application
    Filed: March 27, 2017
    Publication date: October 5, 2017
    Inventors: Tetsuya OKAMAE, Osamu KOBAYASHI
  • Publication number: 20170285376
    Abstract: According to an aspect, a display device includes: a substrate including a display region and a non-display region surrounding the display region; at least one driver IC including connecting terminals with a first surface fixed to face the non-display region; first wires supplying a signal to the display region; first bumps connected with the first wires; second wires transferring a signal to and from outside; second bumps connected with the second wires; and inspection wires. The connecting terminals of the driver IC include first connecting terminals overlapping the first or second bumps in plan view, and second connecting terminals not overlapping the first or second bumps in plan view. The inspection wires include a connecting conductor between themselves and at least one of the second connecting terminals. The inspection wires are pulled out to an outside of the driver IC in plan view.
    Type: Application
    Filed: March 24, 2017
    Publication date: October 5, 2017
    Inventors: Tetsuya OKAMAE, Shinji YAMAKAWA, Kazuyuki SUNOHARA