Patents by Inventor Tetsuya Sawai

Tetsuya Sawai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoplastic elastomeric resin composition and a process for the preparation thereof
    Patent number: 6646047
    Abstract: The invention provides a process for the preparation of a thermoplastic elastomeric resin composition comprising melt kneading (a) 100 parts by weight of a block copolymer consisting of at least two polymeric blocks (A) composed mainly of a vinyl aromatic compound and at least one polymeric block (B) composed mainly of a conjugated diene compound, and/or a hydrogenated block copolymer obtained by hydrogenating said block copolymer, (b) 20 to 300 parts by weight of a non-aromatic softening agent for rubber, (c) 1 to 150 parts by weight of a peroxide-crosslinking type olefinic resin and/or a copolymeric rubber containing said resin, and (d) 10 to 150 parts by weight of a peroxide-decomposing type olefinic resin and/or a copolymer containing said resin, characterized in that the process comprises a step of heat-processing component (a), component (b), at least a part of component (c), at least a part of component (d) and at least a part of 1.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: November 11, 2003
    Assignee: Riken Technos Corporation
    Inventors: Michihisa Tasaka, Akihiro Tamura, Tetsuya Sawai
  • THERMOPLASTIC ELASTOMERIC RESIN COMPOSITION AND A PROCESS FOR THE PREPARATION THEREOF
    Publication number: 20030017223
    Abstract: The invention provides a process for the preparation of a thermoplastic elastomeric resin composition comprising melt kneading
    Type: Application
    Filed: April 30, 1999
    Publication date: January 23, 2003
    Inventors: MICHIHISA TASAKA, AKIHIRO TAMURA, TETSUYA SAWAI