Patents by Inventor Tetsuya Sugita

Tetsuya Sugita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8323551
    Abstract: Provided in this invention are polyethylene terephthalate resins which can suppress the formation of acetaldehyde as a by-product in melt molding of the resins and can provide the molded products reduced in acetaldehyde content. A polyethylene terephthalate resin which has an intrinsic viscosity [?2] of not less than 0.70 dl/g and not more than 1.50 dl/g and an acetaldehyde content [AA0 (ppm by weight)] of not more than 10 ppm by weight, and has such properties that the acetaldehyde content [AA1 (ppm by weight)] of the molded product obtained by injection molding the resin at 280° C. with its moisture content adjusted to 30±20 ppm by weight and the acetaldehyde content [AA2 (ppm by weight)] of the molded product obtained by injection molding the resin at 280° C. with its moisture content adjusted to 120±20 ppm by weight satisfy the following formula (1): [(AA1?AA2)/AA1]×100?30??(1).
    Type: Grant
    Filed: May 9, 2006
    Date of Patent: December 4, 2012
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Syuji Anno, Yoshihiro Fujimori, Jouji Akiyama, Katsuji Tanaka, Tetsuya Sugita
  • Publication number: 20060264599
    Abstract: Provided in this invention are polyethylene terephthalate resins which can suppress the formation of acetaldehyde as a by-product in melt molding of the resins and can provide the molded products reduced in acetaldehyde content. A polyethylene terephthalate resin which has an intrinsic viscosity [?2] of not less than 0.70 dl/g and not more than 1.50 dl/g and an acetaldehyde content [AA0 (ppm by weight)] of not more than 10 ppm by weight, and has such properties that the acetaldehyde content [AA1 (ppm by weight)] of the molded product obtained by injection molding the resin at 280° C. with its moisture content adjusted to 30±20 ppm by weight and the acetaldehyde content [AA2 (ppm by weight)] of the molded product obtained by injection molding the resin at 280° C.
    Type: Application
    Filed: May 9, 2006
    Publication date: November 23, 2006
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Syuji Anno, Yoshihiro Fujimori, Jouji Akiyama, Katsuji Tanaka, Tetsuya Sugita