Patents by Inventor Tetsuyuki Ota

Tetsuyuki Ota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7744983
    Abstract: The laminated structure includes a lightweight and shape-retaining foamed resin base member, an outer circumference frame integrally laminated on the reverse side of the foamed resin base member along the outer circumference of an article, and bridging ribs connecting between respective points on the outer circumference frame. Accordingly, the present invention provides a lightweight laminated structure with low cost by reducing the amount of the resin used, since the molded synthetic resin outer circumference frame and bridging ribs have small projection areas.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: June 29, 2010
    Assignee: Kasai Kogyo Co., Ltd.
    Inventors: Tetsuyuki Ota, Masahiko Hara, Tatsushi Ohno, Hiroyuki Aizawa, Kiyohiko Obara
  • Publication number: 20060141240
    Abstract: To provide an interior component that partly includes a laminated assembly and a manufacturing method thereof that prevent flattening of pile of a decorative member in press molding to improve appearance. A door trim includes a laminated assembly (door trim upper portion) including a resin foam substrate that is light in weight and has a shape-holding property, a resin rib integrally laminated on a rear surface of the resin foam substrate, and a decorative member attached to a front surface of the resin foam substrate, and a resin molding (door trim lower portion). For the laminated assembly, a resin form sheet heated and softened and the decorative member that is not heated or is heated at a low temperature are placed into a forming die assembly in an laminated manner and integrated by a low pressing pressure, thereby preventing flattening of pile or thermal deformation of the decorative member, ensuring satisfactory moldability, and reducing a molding load in molding.
    Type: Application
    Filed: December 28, 2004
    Publication date: June 29, 2006
    Inventors: Tetsuyuki Ota, Masahiko Hara, Tatsushi Ohno
  • Publication number: 20040043187
    Abstract: The laminated structure comprises a lightweight and shape-retaining foamed resin base member, an outer circumference frame integrally laminated on the reverse side of the formed resin base member along the outer circumference of an article, and bridging ribs connecting between respective points on the outer circumference frame. Accordingly, the present invention provides a lightweight laminated structure with low cost by reducing the amount of the resin used, since the molded synthetic resin comprising the outer circumference frame and bridging ribs has a small projection area.
    Type: Application
    Filed: August 28, 2002
    Publication date: March 4, 2004
    Inventors: Tetsuyuki Ota, Masahiko Hara, Tatsushi Ohno, Hiroyuki Aizawa, Kiyohiko Obara
  • Patent number: 5811053
    Abstract: In a method for molding a laminated assembly comprising a resin core member, and a surface skin member either partly or entirely placed over the surface of the resin core member, the dimensional precision of a part of the surface skin member involving a high rate of extension is improved, and the cushioning property and the surface quality of this part are avoided from being impaired. An approximately molded portion is defined in a part of the surface skin member involving a relatively high rate of extension during the vacuum molding process using a vacuum molding die assembly, and the thus molded surface skin member is mounted on the upper die for mold press forming with a gap defined between the approximately molded portion or an unmolded portion and the associated die surface.
    Type: Grant
    Filed: September 11, 1997
    Date of Patent: September 22, 1998
    Assignee: Kasai Kogyo Co., Ltd.
    Inventors: Tetsuyuki Ota, Masahiko Hara
  • Patent number: 5776509
    Abstract: In a method and die assembly device for molding a laminated assembly comprising a resin core member and a surface skin member covering a part of the surface of the resin core member, the shifting and creasing of the surface skin member is avoided, the molding precision is increased during the mold press forming process, and the external appearance of the assembly is improved.
    Type: Grant
    Filed: March 27, 1996
    Date of Patent: July 7, 1998
    Assignee: Kasai Koyco Co., Ltd
    Inventors: Tetsuyuki Ota, Masahiko Hara