Abstract: A technique to de-solder an integrated circuit device having one or more rows of solder balls underneath connected to a printed circuit board (PCB). In one example embodiment, this is accomplished by placing the PCB on a table surface such that the integrated circuit device is disposed across from the table surface. A heating element is then positioned between the underneath the integrated circuit device and the PCB such that the heating element is substantially in contact with a current row of solder balls. The one or more rows of solder balls are then conductively heated until solder reaches reflow temperature and sliced in a direction substantially parallel to the table surface using the heating element on a row-by-row basis to de-solder the integrated circuit device from the PCB.