Abstract: A heat dissipating structure includes a composite having a thermal expansion coefficient between 30° C. and 250 ° C. in a range from 2 to 13.10−6 K−1, a volume mass below 3000 kg·m−3, and a conductivity equal to or greater than 113 W·m−1·K−1. The composite is formed by a matrix which is made of a metal, polymer, or resin, in combination with a reinforcement component. The reinforcement component contains microfibers at a volume proportion in a range from 5 to 90% and nanofibers at a volume proportion from 1 to 60%, with the composite obtained through infiltration of the reinforcement component by the metal in liquid state or the polymer and resin in liquid or uncured state. Applied onto the composite is a surface layer having entirely or at least partially a metallic character.

Abstract: The invention relates to a method for attaching a first body which is of one of a metal matrix composite (MMC)-material or copper to a second body which is a ceramic member for acting as a heat sink, wherein the surface of the ceramic member which is placed against the MMC- or copper body is coated with a first metal by heating the two bodies to above the eutectic temperature of a system comprised of the matrix metal of the MMC-body or the copper of the copper body and the first metal applied to the surface of the ceramic member; and subsequently cooling the system to room temperature.

Abstract: A process for making a metal-matrix composite (MMC), includes a mixture of particulate ceramic powder with a liquid carrier, without addition of a binder, to prepare a slip having thixotropic properties. The slip is introduced in a substantially dense consistency into a casting mold which is then subjected to vibrations so as to separate the carrier from the ceramic particles and to allow the carrier to float upon the ceramic particles while at the same time compacting the slip to realize a ceramic preform of porous consistency having pores. After terminating the exposure of the casting mold to vibrations, the liquid carrier is removed and the preform is allowed to solidify in the casting mold, without exposure to any further compaction measures, such as sintering, pressing or the like, and the casting mold is maintained in a position of rest. Subsequently, matrix metal is poured into the casting mold to fill the pores of the preform.

Abstract: The invention relates to a method for attaching a first body which is of one of a metal matrix composite (MMC)-material or copper to a second body which is a ceramic member for acting as a heat sink, wherein the surface of the ceramic member which is placed against the MMC- or copper body is coated with a first metal by heating the two bodies to above the eutectic temperature of a system comprised of the matrix metal of the MMC-body or the copper of the copper body and the first metal applied to the surface of the ceramic member; and subsequently cooling the system to room temperature.

Abstract: Metal matrix composite body (MMC body) includes a porous reinforcement material (15) having pores being filled with an infiltration material (14) selected from the group metal and metal alloy, with the reinforcement material (15) being formed by recrystallized silicon carbide (RSiC).

Abstract: A molded article of metal matrix composite (MMC) includes a preform infilted in a casting process with metal or metal alloy, with the preform comprised of a plurality of spaced preform plates arranged in mosaic disposition in at least one plane, or stacked in several planes above one another, and formed with bores. The spacing between neighboring preform plates and the spacing between overlying planes of preform plates are filled with infiltration metal or metal alloy, without permeation of infiltration metal into the bores.

Abstract: A composite structure includes a first nonmetallic component and a second mponent of metal or nonmetal, with the first and second components being joined together by a bonding material which is so introduced by way of a casting process as to permeate to an area between the first and second components.