Patents by Inventor Theodore T. Paczkowski

Theodore T. Paczkowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hearing-aid assembly using folded flex circuits
    Publication number: 20040141627
    Abstract: Hearing aids improve not only the hearing, but the lives of millions. Unfortunately, far too many sufferers of hearing loss forego the benefits of hearing aids because of size and cost of the devices. To address this need, the present inventor devised hearing-aid circuit modules that use folded flexible circuits. The modules save space and reduce the cost of manufacturing hearing aids.
    Type: Application
    Filed: January 6, 2004
    Publication date: July 22, 2004
    Applicant: HEI, Inc.
    Inventor: Theodore T. Paczkowski
  • Hearing-aid assembly using folded flex circuits
    Patent number: 6674869
    Abstract: Hearing aids improve not only the hearing, but the lives of millions. Unfortunately, far too many sufferers of hearing loss forego the benefits of hearing aids because of size and cost of the devices. To address this need, the present inventor devised hearing-aid circuit modules that use folded flexible circuits. The modules save space and reduce the cost of manufacturing hearing aids.
    Type: Grant
    Filed: February 23, 2001
    Date of Patent: January 6, 2004
    Assignee: Hei, Inc.
    Inventor: Theodore T. Paczkowski
  • Hearing-aid assembly using folded flex circuits
    Publication number: 20010038703
    Abstract: Hearing aids improve not only the hearing, but the lives of millions. Unfortunately, far too many sufferers of hearing loss forego the benefits of hearing aids because of size and cost of the devices. To address this need, the present inventor devised hearing-aid circuit modules that use folded flexible circuits. The modules save space and reduce the cost of manufacturing hearing aids.
    Type: Application
    Filed: February 23, 2001
    Publication date: November 8, 2001
    Inventor: Theodore T. Paczkowski
  • High density stacked circuit module
    Patent number: 6014320
    Abstract: A high density circuit module construction uses a flex circuit attached to a substrate and folded over on it to provide higher packaging density while providing an increase in the surface area available for I/O pads. A substrate has components such as ICs mounted on one surface, and module I/O pads on the opposite surface. This surface also provides interconnects for the flex circuit. The flex circuit has one portion attached to the interconnect pads on one surface of the substrate. Another portion of the flex circuit folds around the substrate and is attached to the other side of the substrate. The surface area of this portion of the flex circuit provides in additional surface area for mounting circuit components, within essentially the same footprint area as the substrate. This module construction provides a higher density than prior art constructions, while providing a larger, unobstructed area for the I/O pads, which simplifies connecting the module into a larger assembly.
    Type: Grant
    Filed: March 30, 1998
    Date of Patent: January 11, 2000
    Assignee: Hei, Inc.
    Inventors: Shawn M. Mahon, Theodore T. Paczkowski, Steven R. Schmieg