Patents by Inventor Theresa M. Larson

Theresa M. Larson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stencil and method for depositing solder
    Patent number: 6592943
    Abstract: A method of depositing solder on a conductive region of a substrate comprising providing a substrate having a substrate aperture and a coefficient of thermal expansion. A polymeric stencil is also provided such as to have a stencil aperture and a coefficient of thermal expansion which is approximately equal to the coefficient of thermal expansion of the substrate. The method also includes disposing the polymeric stencil on the substrate such that the stencil aperture is aligned with a conductive region; and reflowing the solder paste while the polymeric stencil remains disposed on the substrate. The polymeric stencil is then removed from the substrate essentially without any solder-paste being removed with the polymeric stencil.
    Type: Grant
    Filed: January 8, 2001
    Date of Patent: July 15, 2003
    Assignee: Fujitsu Limited
    Inventors: Albert W. Chan, Michael G. Lee, Theresa M. Larson
  • Stencil and method for depositing solder
    Publication number: 20010046586
    Abstract: A method of depositing solder on a conductive region of a substrate comprising providing a substrate having a substrate aperture and a coefficient of thermal expansion. A polymeric stencil is also provided such as to have a stencil aperture and a coefficient of thermal expansion which is approximately equal to the coefficient of thermal expansion of the substrate. The method also includes disposing the polymeric stencil on the substrate such that the stencil aperture is aligned with a conductive region; and reflowing the solder paste while the polymeric stencil remains disposed on the substrate. The polymeric stencil is then removed from the substrate essentially without any solder-paste being removed with the polymeric stencil.
    Type: Application
    Filed: January 8, 2001
    Publication date: November 29, 2001
    Inventors: Albert W. Chan, Michael G. Lee, Theresa M. Larson