Patents by Inventor Thida Ma Win

Thida Ma Win has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10403362
    Abstract: A split memory bank may comprise a number of memory matrices forming a memory bank and a shift register in which the shift register physically separates the matrices. An integrated circuit may comprise a number of shift registers and a plurality of memory matrices forming a memory bank in which the matrices are spatially separated by the shift register. An integrated printhead may comprise a number of memory banks each comprising a plurality of memory matrices and a number of shift registers in which each shift register spatially separates a number of the matrices.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: September 3, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Boon Bing Ng, Thida Ma Win, Ning Ge, Jose Jehrome Rando
  • Patent number: 10384449
    Abstract: In an example implementation, a grounding structure includes a perimeter ground line around the perimeter of a printhead die, and having north, south, east, and west segments. The structure includes an inter-slot ground line extending from the north segment to the south segment between two fluid slots, and an alternative ground line extending from the east segment to the west segment and intersecting the inter-slot ground line in a connection area near ends of the fluid slots.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: August 20, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Boon Bing Ng, Thida Ma Win, Jose Jehrome Rando
  • Publication number: 20190156892
    Abstract: A split memory bank may comprise a number of memory matrices forming a memory bank and a shift register in which the shift register physically separates the matrices. An integrated circuit may comprise a number of shift registers and a plurality of memory matrices forming a memory bank in which the matrices are spatially separated by the shift register. An integrated printhead may comprise a number of memory banks each comprising a plurality of memory matrices and a number of shift registers in which each shift register spatially separates a number of the matrices.
    Type: Application
    Filed: January 23, 2019
    Publication date: May 23, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Boon Bing Ng, Thida Ma Win, Ning Ge, Jose Jehrome Rando
  • Patent number: 10236063
    Abstract: A split memory bank may comprise a number of memory matrices forming a memory bank and a shift register in which the shift register physically separates the matrices. An integrated circuit may comprise a number of shift registers and a plurality of memory matrices forming a memory bank in which the matrices are spatially separated by the shift register. An integrated printhead may comprise a number of memory banks each comprising a plurality of memory matrices and a number of shift registers in which each shift register spatially separates a number of the matrices.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: March 19, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Boon Bing Ng, Thida Ma Win, Ning Ge, Jose Jehrome Rando
  • Publication number: 20180268905
    Abstract: A split memory bank may comprise a number of memory matrices forming a memory bank and a shift register in which the shift register physically separates the matrices. An integrated circuit may comprise a number of shift registers and a plurality of memory matrices forming a memory bank in which the matrices are spatially separated by the shift register. An integrated printhead may comprise a number of memory banks each comprising a plurality of memory matrices and a number of shift registers in which each shift register spatially separates a number of the matrices.
    Type: Application
    Filed: May 22, 2018
    Publication date: September 20, 2018
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Boon Bing Ng, Thida Ma Win, Ning Ge, Jose Jehrome Rando
  • Patent number: 10029457
    Abstract: A nozzle firing cell may comprise a firing transistor and a pre-charge transistor having a source and drain coupled between a pre-charge line and a gate of the firing transistor wherein the pre-charge line is routed over the gate of the pre-charge transistor. A fluid ejection device may comprise a circuit comprising a nozzle firing cell, the nozzle firing cell comprising a firing transistor and a pre-charge transistor having a source and drain coupled between a pre-charge Sine and a gate of the firing transistor in which the pre-charge line is routed over the gate of the pre-charge transistor. A circuit may comprise a number of firing transistors and a number of pre-charge transistors each having a source and drain coupled between a pre-charge line and a gate of one of the firing transistors in which the pre-charge line is routed over each of the gates of the pre-charge transistors.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: July 24, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Boon Bing Ng, Thida Ma Win, Ning Ge, Jose Jehrome Rando
  • Publication number: 20180186151
    Abstract: In an example implementation, a grounding structure includes a perimeter ground line around the perimeter of a printhead die, and having north, south, east, and west segments. The structure includes an inter-slot ground line extending from the north segment to the south segment between two fluid slots, and an alternative ground line extending from the east segment to the west segment and intersecting the inter-slot ground line in a connection area near ends of the fluid slots.
    Type: Application
    Filed: March 2, 2018
    Publication date: July 5, 2018
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Boon Bing Ng, Thida Ma Win, Jose Jehrome Rando
  • Patent number: 10014055
    Abstract: A split memory bank may comprise a number of memory matrices forming a memory bank and a shift register in which the shift register physically separates the matrices. An integrated circuit may comprise a number of shift registers and a plurality of memory matrices forming a memory bank in which the matrices are spatially separated by the shift register. An integrated printhead may comprise a number of memory banks each comprising a plurality of memory matrices and a number of shift registers in which each shift register spatially separates a number of the matrices.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: July 3, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Boon Bing Ng, Thida Ma Win, Ning Ge, Jose Jehrome Rando
  • Patent number: 9975335
    Abstract: In an example implementation, a grounding structure includes a perimeter ground line around the perimeter of a printhead die, and having north, south, east, and west segments. The structure includes an inter-slot ground line extending from the north segment to the south segment between two fluid slots, and an alternative ground line extending from the east segment to the west segment and intersecting the inter-slot ground line in a connection area near ends of the fluid slots.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: May 22, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Boon Bing Ng, Thida Ma Win, Jose Jehrome Rando
  • Publication number: 20170225462
    Abstract: In an example implementation, a grounding structure includes a perimeter ground line around the perimeter of a printhead die, and having north, south, east, and west segments. The structure includes an inter-slot ground line extending from the north segment to the south segment between two fluid slots, and an alternative ground line extending from the east segment to the west segment and intersecting the inter-slot ground line in a connection area near ends of the fluid slots.
    Type: Application
    Filed: August 18, 2014
    Publication date: August 10, 2017
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Boon Bing Ng, Thida Ma Win, Jose Jehrome Rando
  • Publication number: 20170210124
    Abstract: A nozzle firing cell may comprise a firing transistor and a pre-charge transistor having a source and drain coupled between a pre-charge line and a gate of the firing transistor wherein the pre-charge line is routed over the gate of the pre-charge transistor. A fluid ejection device may comprise a circuit comprising a nozzle firing ceil, the nozzle firing cell comprising a firing transistor and a pre-charge transistor having a source and drain coupled between a pre-charge Sine and a gate of the firing transistor in which the pre-charge line is routed over the gate of the pre-charge transistor. A circuit may comprise a number of firing transistors and a number of pre-charge transistors each having a source and drain coupled between a pre-charge line and a gate of one of the firing transistors in which the pre-charge line is routed over each of the gates of the pre-charge transistors.
    Type: Application
    Filed: July 30, 2014
    Publication date: July 27, 2017
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Boon Bing Ng, Thida Ma Win, Ning Ge, Jose Jehrome Rando
  • Publication number: 20170213596
    Abstract: A split memory bank may comprise a number of memory matrices forming a memory bank and a shift register in which the shift register physically separates the matrices. An integrated circuit may comprise a number of shift registers and a plurality of memory matrices forming a memory bank in which the matrices are spatially separated by the shift register. An integrated printhead may comprise a number of memory banks each comprising a plurality of memory matrices and a number of shift registers in which each shift register spatially separates a number of the matrices.
    Type: Application
    Filed: July 30, 2014
    Publication date: July 27, 2017
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Boon Bing Ng, Thida Ma Win, Ning Ge, Jose Jehrome Rando