Abstract: A method of preparing for structural analysis a deep trench-type capacitor formed in a die employs a combination of mechanical and chemical action to expose the trench-type capacitors. The method of preparing the die includes the steps of (a) mechanically treating the die back side so as to remove a first portion of the substrate and leave intact a second portion of the substrate; (b) mounting the mechanically treated die by affixing the die by its top side to a mount; and (c) chemically treating the mounted die so as to remove the substrate second portion and provide a chemically treated die. By exposing the deep trench capacitors, the method facilitates the inspection of the device for the detection of possible structural defects such as metal shorts, capacitor holes, and particle failures. The method further overcomes the deficiencies associated with conventional methods of substrate removal, and facilitates inspection by a variety of methods.