Patents by Inventor Thomas A. Hanft

Thomas A. Hanft has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11992439
    Abstract: A system for therapy of the eye by treating tissue with therapeutic radiation using nonlinear interaction. A laser device is provided, which delivers the therapeutic radiation. The therapeutic radiation is focussed by a focussing device in an image field, and xy scanners and z scanners shift the focus laterally and longitudinally within a treatment volume. The therapeutic radiation is either a second short pulse radiation or a first short pulse radiation, each of which have a spectral centroid within a wavelength range defined by the short pulse properties. The system is particularly corrected with regard to longitudinal chromatic aberrations and lateral chromatic aberrations such that the spectral characteristic curves of the two aberrations each have a local extreme within the wavelength ranges, and a certain tolerance within the wavelength ranges is not exceeded, therefore the characteristic curves are very shallow.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: May 28, 2024
    Assignee: Carl Zeiss Meditec AG
    Inventors: Thomas Nobis, Marco Hanft, Mark Bischoff
  • Patent number: 11753517
    Abstract: A method for manufacturing a patterned polyimide aerogel film on a substrate includes: dispensing a polyimide prepolymer sol onto a first portion of a surface of a substrate, a second portion of the surface of the substrate being substantially free of the polyimide prepolymer sol; forming a patterned film of a polyimide prepolymer gel on the substrate from the polyimide prepolymer sol; drying the polyimide prepolymer gel to form a patterned film of a polyimide prepolymer aerogel on the substrate; and curing the polyimide prepolymer aerogel on the substrate to form the patterned polyimide aerogel film on the first portion of the surface of the substrate, the second portion of the surface of the substrate being substantially free of the patterned polyimide aerogel film.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: September 12, 2023
    Assignee: RAYTHEON COMPANY
    Inventor: Thomas A. Hanft
  • Patent number: 11139164
    Abstract: An electronic device includes: a water impermeable substrate; at least one electronic circuit on the water impermeable substrate; a dielectric encapsulant on the electronic circuit; a capping layer comprising a polymer on the dielectric encapsulant; and a barrier layer on the capping layer, the water impermeable substrate, the dielectric encapsulant, the capping layer, and the barrier layer forming a hermetically sealed micro-cavity.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: October 5, 2021
    Assignee: Raytheon Company
    Inventors: Thomas A. Hanft, Michael A. Moore, John Bedinger
  • Publication number: 20210183647
    Abstract: An electronic device includes: a water impermeable substrate; at least one electronic circuit on the water impermeable substrate; a dielectric encapsulant on the electronic circuit; a capping layer comprising a polymer on the dielectric encapsulant; and a barrier layer on the capping layer, the water impermeable substrate, the dielectric encapsulant, the capping layer, and the barrier layer forming a hermetically sealed micro-cavity.
    Type: Application
    Filed: December 12, 2019
    Publication date: June 17, 2021
    Inventors: Thomas A. Hanft, Michael A. Moore, John Bedinger
  • Publication number: 20210179800
    Abstract: A method for manufacturing a patterned polyimide aerogel film on a substrate includes: dispensing a polyimide prepolymer sol onto a first portion of a surface of a substrate, a second portion of the surface of the substrate being substantially free of the polyimide prepolymer sol; forming a patterned film of a polyimide prepolymer gel on the substrate from the polyimide prepolymer sol; drying the polyimide prepolymer gel to form a patterned film of a polyimide prepolymer aerogel on the substrate; and curing the polyimide prepolymer aerogel on the substrate to form the patterned polyimide aerogel film on the first portion of the surface of the substrate, the second portion of the surface of the substrate being substantially free of the patterned polyimide aerogel film.
    Type: Application
    Filed: December 12, 2019
    Publication date: June 17, 2021
    Inventor: Thomas A. Hanft
  • Patent number: 8963313
    Abstract: Integrating a semiconductor component with a substrate through a low loss interconnection formed through adaptive patterning includes forming a cavity in the substrate, placing the semiconductor component therein, filling a gap between the semiconductor component and substrate with a fill of same or similar dielectric constant as that of the substrate and adaptively patterning a low loss interconnection on the fill and extending between the contacts of the semiconductor component and the electrical traces on the substrate. The contacts and leads are located and adjoined using an adaptive patterning technique that places and forms a low loss radio frequency transmission line that compensates for any misalignment between the semiconductor component contacts and the substrate leads.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: February 24, 2015
    Assignee: Raytheon Company
    Inventors: Sankerlingam Rajendran, Monte R. Sanchez, Susan M. Eshelman, Douglas R. Gentry, Thomas A. Hanft
  • Patent number: 8552813
    Abstract: Embodiments of the invention are directed toward a novel printed antenna that provides a low-loss transition into waveguide. The antenna is integrated with a heat spreader and the interconnection between the antenna and the output device (such as a power amplifier) is a simple conductive connection, such as (but not limited to), a wirebond. Integrating the antenna with the heat spreader in accordance with the concepts, circuits, and techniques described herein drastically shortens the distance from the output device to the waveguide, thus reducing losses and increasing bandwidth. The transition and technique described herein may be easily scaled for both higher and lower frequencies. Embodiments of the present apparatus also eliminate the complexity of the prior art circuit boards and transitions and enable the use of a wider range of substrates while greatly simplifying assembly.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: October 8, 2013
    Assignee: Raytheon Company
    Inventors: Darin M. Gritters, Kenneth W. Brown, Andrew K. Brown, Michael A. Moore, Patrick J. Kocurek, Thomas A. Hanft
  • Publication number: 20130161782
    Abstract: Integrating a semiconductor component with a substrate through a low loss interconnection formed through adaptive patterning includes forming a cavity in the substrate, placing the semiconductor component therein, filling a gap between the semiconductor component and substrate with a fill of same or similar dielectric constant as that of the substrate and adaptively patterning a low loss interconnection on the fill and extending between the contacts of the semiconductor component and the electrical traces on the substrate. The contacts and leads are located and adjoined using an adaptive patterning technique that places and forms a low loss radio frequency transmission line that compensates for any misalignment between the semiconductor component contacts and the substrate leads.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 27, 2013
    Applicant: RAYTHEON COMPANY
    Inventors: S. Rajendran, Monte R. Sanchez, Susan M. Eshelman, Douglas R. Gentry, Thomas A. Hanft
  • Publication number: 20130127563
    Abstract: Embodiments of the invention are directed toward a novel printed antenna that provides a low-loss transition into waveguide. The antenna is integrated with a heat spreader and the interconnection between the antenna and the output device (such as a power amplifier) is a simple conductive connection, such as (but not limited to), a wirebond. Integrating the antenna with the heat spreader in accordance with the concepts, circuits, and techniques described herein drastically shortens the distance from the output device to the waveguide, thus reducing losses and increasing bandwidth. The transition and technique described herein may be easily scaled for both higher and lower frequencies. Embodiments of the present apparatus also eliminate the complexity of the prior art circuit boards and transitions and enable the use of a wider range of substrates while greatly simplifying assembly.
    Type: Application
    Filed: November 23, 2011
    Publication date: May 23, 2013
    Applicant: Raytheon Company
    Inventors: Darin M. Gritters, Kenneth W. Brown, Andrew K. Brown, Michael A. Moore, Patrick J. Kocurek, Thomas A. Hanft