Abstract: A memory device comprising a memory array including memory cells to store memory data, error correcting code (ECC) circuitry configured to generate ECC data and use the ECC data to detect errors in the memory data, and an ECC circuitry checker. The ECC circuitry checker is configured to substitute the ECC data with check ECC data, compare an output of the ECC circuitry to an expected output when the substituted check ECC data is applied to the ECC circuitry, and generate an alert when the comparing indicates an error in the ECC circuitry.

Abstract: A user equipment (UE) may simulate transmissions received from a BS to perform on-device testing of the UE. For example, the UE may be configured to loopback uplink data from the UL data path and input the uplink data as simulated downlink data for processing in the DL data path. The uplink data may include data related to a video call or network diagnostics. The user application data generated by the application and proceeding through the UL data path may be used to validate the DL data path. Downlink control information (DCI) may be determined by the UE and provided to the DL data path to accompany the uplink data. The DCI may include simulated uplink grants and/or simulated downlink scheduling assignments. The simulated downlink scheduling assignments may be determined based on availability of the uplink data in the UE's memory.

Abstract: A user equipment (UE) may simulate transmissions received from a BS to perform on-device testing of the UE. For example, the UE may be configured to loopback uplink data from the UL data path and input the uplink data as simulated downlink data for processing in the DL data path. The uplink data may include data related to a video call or network diagnostics. The user application data generated by the application and proceeding through the UL data path may be used to validate the DL data path. Downlink control information (DCI) may be determined by the UE and provided to the DL data path to accompany the uplink data. The DCI may include simulated uplink grants and/or simulated downlink scheduling assignments. The simulated downlink scheduling assignments may be determined based on availability of the uplink data in the UE's memory.

Abstract: A liquid handling system that is configured to receive an interchangeable pipetting head that is selected from a plurality of interchangeable pipetting heads for automated liquid handling flexibility and scalability. The system includes a housing and at least one pipetting head disposed within that housing for aspirating and dispensing a liquid. A locking mechanism interchangeably receives the at least one pipetting head and includes an adaptor plate and a support block. The adaptor plate is operably coupled to the housing and the support block is operably coupled to the at least one pipetting head. The support block is then, in turn, is configured to be operably coupled to the adaptor plate.

Abstract: A liquid handling system that is configured to receive an interchangeable pipetting head that is selected from a plurality of interchangeable pipetting heads for automated liquid handling flexibility and scalability. The system includes a housing and at least one pipetting head disposed within that housing for aspirating and dispensing a liquid. A locking mechanism interchangeably receives the at least one pipetting head and includes an adaptor plate and a support block. The adaptor plate is operably coupled to the housing and the support block is operably coupled to the at least one pipetting head. The support block is then, in turn, is configured to be operably coupled to the adaptor plate.

Abstract: A combination product cooling and flux management apparatus is mounted above a reflow soldering oven. The apparatus has a sealed housing with four openings: an ambient air inlet, an ambient air outlet, a recirculating gas inlet and a recirculating gas outlet. The recirculating gas blower is mounted in a first end of the housing and draws air into the recirculating gas inlet, through a recirculating gas side of a gas-to-gas heat exchanger and out the recirculating gas outlet, where it is recirculated through a product cooling chamber and back into the recirculating gas inlet. The ambient air blower is mounted in a second end of the housing and draws air into the ambient air inlet, through an ambient air side of the gas-to-gas heat exchanger and out the ambient air outlet to the surrounding atmosphere.

Abstract: A combination product cooling and flux management apparatus is mounted above a reflow soldering oven. The apparatus has a sealed housing with four openings: an ambient air inlet, an ambient air outlet, a recirculating gas inlet and a recirculating gas outlet. The recirculating gas blower is mounted in a first end of the housing and draws air into the recirculating gas inlet, through a recirculating gas side of a gas-to-gas heat exchanger and out the recirculating gas outlet, where it is recirculated through a product cooling chamber and back into the recirculating gas inlet. The ambient air blower is mounted in a second end of the housing and draws air into the ambient air inlet, through an ambient air side of the gas-to-gas heat exchanger and out the ambient air outlet to the surrounding atmosphere.