Patents by Inventor Thomas Alan Deis

Thomas Alan Deis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low dielectric materials and methods for making same
    Patent number: 7307343
    Abstract: Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. These materials are characterized as having a dielectric constant (?) a dielectric constant of about 3.7 or less; a normalized wall elastic modulus (E0?), derived in part from the dielectric constant of the material, of about 15 GPa or greater; and a metal impurity level of about 500 ppm or less. Low dielectric materials are also disclosed having a dielectric constant of less than about 1.95 and a normalized wall elastic modulus (E0?), derived in part from the dielectric constant of the material, of greater than about 26 GPa.
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: December 11, 2007
    Assignee: Air Products and Chemicals, Inc.
    Inventors: John Francis Kirner, James Edward MacDougall, Brian Keith Peterson, Scott Jeffrey Weigel, Thomas Alan Deis, Martin Devenney, C. Eric Ramberg, Konstantinos Chondroudis, Keith Cendak
  • Compositions for preparing low dielectric materials
    Patent number: 7294585
    Abstract: Low dielectric materials and films comprising same have been identified for improved performance when used as performance materials, for example, in interlevel dielectrics integrated circuits as well as methods for making same. In one aspect of the present invention, the performance of the dielectric material may be improved by controlling the weight percentage of ethylene oxide groups in the at least one porogen.
    Type: Grant
    Filed: July 11, 2006
    Date of Patent: November 13, 2007
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Brian Keith Peterson, John Francis Kirner, Scott Jeffrey Weigel, James Edward MacDougall, Lisa Deis, legal representative, Thomas Albert Braymer, Keith Douglas Campbell, Martin Devenney, C. Eric Ramberg, Konstantinos Chondroudis, Keith Cendak, Thomas Alan Deis, deceased
  • Low dielectric materials and methods for making same
    Patent number: 7186613
    Abstract: Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. These materials are characterized as having a dielectric constant (?) a dielectric constant of about 3.7 or less; a normalized wall elastic modulus (E0?), derived in part from the dielectric constant of the material, of about 15 GPa or greater; and a metal impurity level of about 500 ppm or less. Low dielectric materials are also disclosed having a dielectric constant of less than about 1.95 and a normalized wall elastic modulus (E0?), derived in part from the dielectric constant of the material, of greater than about 26 GPa.
    Type: Grant
    Filed: October 13, 2004
    Date of Patent: March 6, 2007
    Assignee: Air Products And Chemicals, Inc.
    Inventors: John Francis Kirner, James Edward MacDougall, Brian Keith Peterson, Scott Jeffrey Weigel, Thomas Alan Deis, Martin Devenney, C. Eric Ramberg, Konstantinos Chondroudis, Keith Cendak
  • Apparatus and method of research for creating and testing thin films
    Publication number: 20040071888
    Abstract: The present invention is generally relates to the field of research for the discovery of films with desirable properties, and to a process for making such films. More particularly, the present invention is directed to a system or an apparatus and a method for the rapid formation of a library of liquid samples and a library of thin films therefrom, as well as to the rapid screening of these films to identify those having desirable properties, all of which may be achieved using combinatorial techniques.
    Type: Application
    Filed: May 30, 2003
    Publication date: April 15, 2004
    Applicants: Symyx Technologies, Inc., Air Products and Chemicals, Inc.
    Inventors: Konstantinos Chondroudis, Keith Cendak, Martin Devenney, C. Eric Ramberg, Xuejun (Jason) Wang, Raymond E. Carhart, Scott Jeffrey Weigel, John Francis Kirner, Thomas Alan Deis, Earl Danielson, James Edward MacDougall, Lisa Deis, Sum Nguyen
  • Low dielectric materials and methods for making same
    Publication number: 20030224156
    Abstract: Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. These materials are characterized as having a dielectric constant (&kgr;) a dielectric constant of about 3.7 or less; a normalized wall elastic modulus (E0′), derived in part from the dielectric constant of the material, of about 15 GPa or greater; and a metal impurity level of about 500 ppm or less. Low dielectric materials are also disclosed having a dielectric constant of less than about 1.95 and a normalized wall elastic modulus (E0′), derived in part from the dielectric constant of the material, of greater than about 26 GPa.
    Type: Application
    Filed: May 30, 2002
    Publication date: December 4, 2003
    Inventors: John Francis Kirner, James Edward MacDougall, Brian Keith Peterson, Scott Jeffrey Weigel, Thomas Alan Deis, Martin Devenney, C. Eric Ramberg, Konstantinos Chondroudis, Keith Cendak