Abstract: An optical communications adapter module is provided which includes a casing of a XENPAK-sized module and an optical communications board assembly positioned within the casing. The module also includes a first optical connector coupled to a second optical connector by fiber optics capable of communicating data between the first optical connector and the second optical connector where the first optical connector is coupled to a data transmission connector of the optical communications board assembly and the second optical connector is positioned at a face plate of the casing. The module also includes a third optical connector coupled to a fourth optical connector through fiber optics capable of transmitting data where the third optical connector is coupled to a data reception connector of the optical communications board assembly and the fourth optical connector is positioned at the face plate of the casing.

Abstract: An optical communications adapter module is provided which includes a XENPAK-sized casing and an optical communications board assembly positioned in the casing where the optical communications board assembly has an optical transmission connector and an optical reception connector. The optical transmission connector and the optical reception connector are positioned in connector openings at a first end of the XENPAK-sized casing. The module further includes a board extender coupled to the optical communications board assembly where the board extender is capable of communicating data between the optical communications board assembly and a client computing device.

Abstract: An optical communications adapter module is provided which includes a XENPAK-sized casing and an XFP board assembly having an optical transmission connector and an optical reception connector where the XFP board assembly is positioned within the casing so the optical transmission connector and the optical reception connector are positioned in connector openings at a first end of the casing. The module further includes a conversion board that is coupled to the XFP board where the conversion board is capable of communicating data between the XFP board assembly and a client computing device.

Abstract: A fiber-optic device package structure includes at least one, and typically several, optical stage subassemblies, and a housing in which each optical stage subassembly is received in a parallel, facing arrangement. Each optical stage subassembly has a thermnal/structural plate, an annular plurality of turns of a fiber-optic fiber supported on the thermal/structural plate, and a light connector to the fiber-optic fiber. Preferably, the annular plurality of turns is formed as a freestanding annulus of the plurality of turns of the fiber-optic fiber encapsulated within an encapsulant.

Abstract: An optical transition device provides a connection between two fiber structures. The device comprises a first transition body having a first transition body bore therethrough, a first fiber connector connected to the first transition body and having a first connector bore therethrough, a second transition body affixed to the first transition body and having a second transition body bore therethrough, and a second fiber connector connected to the second transition body and having a second connector bore therethrough. The first connector bore, the first transition body bore, the second transition body bore, and the second connector bore are coaxial along a transition axis. A graded-index lens is disposed within the transition body bores with an optical axis of the lens coincident with the transition axis. An axial positioning structure positions the graded-index lens axially along the transition axis.

Abstract: A circuit arrangement and methods for sensing whether line terminator devices are present at terminal ends of high speed communications pathways, and enabling a switching terminator in accordance therewith, are disclosed. In one embodiment, the communications pathway comprises a Small Computer System Interface (SCSI) bus comprising internal and external bus segments and bus control lines, including a reset line consisting of internal and external reset line segments. First and second system reset signals are supplied from a central processor unit (CPU) to various system components. Line terminator devices may or may not be coupled to the ends of the internal and external bus segments. The first system reset signal is directed to first and second transistors coupled together in an "upside down" collector-to-emitter configuration comprising a two-quadrant bidirectional switch which opens upon assertion of the first system reset signal.