Abstract: A semiconductor device has a first insulating layer formed over a substrate. The substrate has a plurality of conductive layers and plurality of second insulating layers formed between the conductive layers. The substrate can be a PCB or interposer. A plurality of openings is formed in the first insulating layer by etching or laser direct ablation. A semiconductor die has a plurality of bumps formed over a surface of the semiconductor die. The pattern of openings coincides with a pattern of the bumps. The die is mounted to the substrate with the bumps disposed within the openings in the first insulating layer. Alternatively, a conductive paste can be disposed within the openings in the first insulating layer. The bumps are reflowed to electrically connect the die to the first substrate. The bumps are substantially contained within the openings of the first insulating layer to reduce bridging between adjacent bumps.

Abstract: A nested stack of bowl-like disposable beverage brewing filter sheets. Each filter sheet has two adjacent folds in opposite direction forming a grippable strip for removing discrete sheets from the stack. A container for the nested stack has a removable panel for exposing the grippable strip of the outermost sheet for easy finger gripping and discrete removal of the sheet. The container is slideably receivable in a bracket adapted to hold it as a dispenser. Refillable dispensers are also disclosed.A method for preparing a beverage brewing apparatus for brewing comprises the steps of grasping with fingers of one hand the strip of the outermost filter sheet at a location other than at the edge of the sheet, pulling the filter sheet as a discrete entity from the stack, and lining the brewing basket with the single filter sheet in preparation for brewing.