Abstract: Microtransfer molding process and patterned substrate obtainable therefrom The present invention pertains to the field of nanoimprint lithography (NIL) processes and more specifically to a MicroTransfer Molding process used for providing a sol-gel patterned layer on a substrate without any residual layer. The process comprises the following successive steps: (a) impregnating a soft mold with a sol-gel layer coated on a first substrate, under conditions of a relative solvent pressure adjusted such that the layer swells by vapor absorption between 10 and 60% vol.

Abstract: The present invention pertains to the field of nanoimprint lithography (NIL) processes and more specifically to a soft NIL process used for providing a sol-gel patterned layer on a substrate. Specifically, this process comprises a step of adjusting the solvent uptake of the sol-gel film to 10 to 50% vol., preferably between 15 and 40% vol., by varying the relative pressure of the solvent while a soft mould is applied onto the substrate coated with the sol-gel film.

Abstract: Microtransfer molding process and patterned substrate obtainable therefrom The present invention pertains to the field of nanoimprint lithography (NIL) processes and more specifically to a MicroTransfer Molding process used for providing a sol-gel patterned layer on a substrate without any residual layer. The process comprises the following successive steps: (a) impregnating a soft mold with a sol-gel layer coated on a first substrate, under conditions of a relative solvent pressure adjusted such that the layer swells by vapor absorption between 10 and 60% vol.