Abstract: A thermal substrate includes a multilayer film, a first conductive layer adhered to the first outer layer of the multilayer film and a second conductive layer adhered to the second outer layer of the multilayer film. The multilayer film includes a first outer layer including a first thermoplastic polyimide, a core layer including a polyimide and a second outer layer including a second thermoplastic polyimide. The multilayer film has a total thickness in a range of from 5 to 150 ?m, and the first outer layer, the core layer and the second outer layer each include a thermally conductive filler. The first conductive layer and the second conductive layer each have a thickness in a range of from 250 to 3000 ?m.

Abstract: This invention is related to articles containing a heat source and a heat spreader to conduct heat from the heat source. The heat spreader comprises a core of one or more drawn UHMWPE sheets. The sheets are planar, i.e., have dimensions in two directions that are considerably greater than that of the third dimension. No solvent is used during the drawing process. The draw ratio is typically 100 to 150. The density of a sheet is less than 0.90 g/cm3. A sheet has good thermal conductivity k? the direction of the draw. k? is at least 30 W/mK. The thermal conductivity perpendicular to the plane of the sheet k? is greatly reduced. k? is less than. 0.20 W/mK.

Abstract: A back-contact solar cell module and a process for making such a solar cell module are provided. The module includes a porous wire mounting layer with a plurality of elongated electrically conductive wires mounted thereon. A polymeric encapsulant layer is provided between a rear surface of solar cells of the module and the porous wire mounting layer and is melted to adhere to the solar cells and penetrate the porous wire mounting layer. Back electrical contacts on the solar cells are electrically connected to the electrically conductive wires through the porous wire mounting layer.

Abstract: A process for making a back-contact solar cell module is provided. Electrically conductive wires of an integrated back-sheet are physically and electrically attached to the back contacts of the solar cells of a solar cell array through openings in a polymeric interlayer dielectric layer using an electrically conductive binder before thermal lamination of the module.

Abstract: An integrated back-sheet for a solar cell module with a plurality of electrically connected solar cells and a back-contact solar module made with the integrated back-sheet are provided. The back-sheet comprises a homogeneous polymeric substrate with a thickness of at least 0.25 mm. The polymeric substrate comprises 20 to 95 weight percent chlorosulfonated polyolefin and 1 to 50 weight percent of adhesive, based on the weight of the polymeric substrate. The adhesive is selected from thermoplastic and thermoset polymer adhesives and rosin based tackifiers. The integrated back-sheet also includes a plurality of electrically conductive metal wires disposed directly on a surface of the homogeneous polymeric substrate, and the opposite surface of the polymeric substrate is an exposed surface.

Abstract: The invention is directed to a method for rapidly forming a dense pattern of via holes in multilayer electronic circuits in which via holes in the dielectric layers are formed by drilling with an excimer laser under controlled operating conditions.

Abstract: Hole formation in a polyimide substrate employs a carbon dioxide laser.