Patents by Inventor Thomas E. Pettit
Thomas E. Pettit has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7594328Abstract: A method of forming a slotted substrate that includes patterning a thin film over a substrate so that at least a portion of the substrate within a slot region is not covered by the thin film. In addition, a slot is formed in the substrate through the slot region that extends through the substrate and the thin film, wherein a chip count in a shelf surrounding the slot is minimized when the slot is formed in the substrate through the thin film in the slot region.Type: GrantFiled: February 28, 2005Date of Patent: September 29, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: Roberto A. Pugliese, Jr., Mark H. MacKenzie, Thomas E. Pettit, Victorio A. Chavarria, Steven P Storm, Allen H Smith, Tony Cruz-Uribe
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Patent number: 6945634Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate. In one embodiment, the thin film is at least one of a metal film, a polymer film, and a dielectric film. In another embodiment, the thin film material is ductile and/or deposited under compression. In one embodiment, the substrate is silicon, and the thin film is an insulating layer grown from the substrate, such as field oxide. In one embodiment, the thin film is PSG.Type: GrantFiled: October 3, 2003Date of Patent: September 20, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Roberto A. Pugliese, Jr., Mark H. MacKenzie, Thomas E Pettit, Victorio A. Chavarria, Steven P Storm, Allen H Smith
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Patent number: 6834946Abstract: An ink jet cartridge is provided comprising an outlet port, an ink containing region, and a wick substantially surrounding a portion of the ink containing region, the wick being configured such that ink flows to the outlet port. Preferably, the wick is configured such that ink flows to the outlet port irrespective of an orientation of the ink jet cartridge.Type: GrantFiled: January 28, 2002Date of Patent: December 28, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: James C. McKinnell, Thomas E. Pettit, Raymond James Ehlers Jr., Eric S. Dod, Roberta Stinson
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Publication number: 20040067319Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate.Type: ApplicationFiled: October 3, 2003Publication date: April 8, 2004Inventors: Roberto A. Pugliese, Mark H. MacKenzie, Thomas E. Pettit, Victorio A. Chavarria, Steven P. Storm, Allen H. Smith
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Patent number: 6648732Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate. In one embodiment, the thin film is at least one of a metal film, a polymer film, and a dielectric film. In another embodiment, the thin film material is ductile and/or deposited under compression. In one embodiment, the substrate is silicon, and the thin film is an insulating layer grown from the substrate, such as field oxide. In one embodiment, the thin film is PSG.Type: GrantFiled: January 30, 2001Date of Patent: November 18, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: Roberto A. Pugliese, Jr., Mark H. MacKenzie, Thomas E Pettit, Victorio A. Chavarria, Steven P Storm, Allen H Smith
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Patent number: 6623335Abstract: A method of forming an ink fill slot in a silicon substrate of an ink-jet printhead includes fluidizing abrasive particulate material with a first gas within a storage container, combining the gas fluidized abrasive particulate material with a stream of a second gas to provide a stream of the gas fluidized abrasive particulate material, and directing the stream of the gas fluidized abrasive particulate material at the silicon substrate to form the ink fill slot in the silicon substrate.Type: GrantFiled: December 17, 2001Date of Patent: September 23, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: Thomas E. Pettit, James Denning Smith
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Patent number: 6623338Abstract: A method of abrading a portion of a silicon substrate includes fluidizing abrasive particulate material with a first gas within a storage container, combining the gas fluidized abrasive particulate material with a stream of a second gas to provide a stream of the gas fluidized abrasive particulate material, and directing the stream of the gas fluidized abrasive particulate material at the silicon substrate to abrade the portion of the silicon substrate.Type: GrantFiled: December 17, 2001Date of Patent: September 23, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: Thomas E. Pettit, James Denning Smith
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Publication number: 20030142178Abstract: An ink jet cartridge is provided comprising an outlet port, an ink containing region, and a wick substantially surrounding a portion of the ink containing region, the wick being configured such that ink flows to the outlet port. Preferably, the wick is configured such that ink flows to the outlet port irrespective of an orientation of the ink jet cartridge.Type: ApplicationFiled: January 28, 2002Publication date: July 31, 2003Inventors: James C. McKinnell, Thomas E. Pettit, Raymond James Ehlers, Eric S. Dod, Roberta Stinson
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Patent number: 6435950Abstract: A method of delivering abrasive particulate material under pressure from a storage container adapted to contain the abrasive particulate material therein includes communicating an inlet valve with an inlet opening of the storage container and supplying a first gas, regulated to a first predetermined pressure, to the inlet valve. The first gas is released through the inlet valve and into the storage container, and a quantity of the abrasive particulate material is discharged through an outlet opening of the storage container to an output junction. In addition a second gas, regulated to a second predetermined pressure, is supplied to the output junction. As such, a pressurized supply of the abrasive particulate material is formed and delivered through the output junction.Type: GrantFiled: December 17, 2001Date of Patent: August 20, 2002Assignee: Hewlett-Packard CompanyInventors: Thomas E. Pettit, James Denning Smith
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Publication number: 20020102918Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate.Type: ApplicationFiled: January 30, 2001Publication date: August 1, 2002Inventors: Roberto A. Pugliese, Mark H. MacKenzie, Thomas E. Pettit, Victorio A. Chavarria, Steven P. Storm, Allen H. Smith
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Patent number: 6425804Abstract: A pressurized delivery system for abrasive particulate material includes a storage container adapted to contain the abrasive particulate material therein, an input pressure line adapted to communicate with a pressurized source, and a fluidizing pressure line communicating with the input pressure line and an inlet opening in the storage container. A back-pressure pressure line communicates with an unoccupied portion of the storage container and an output pressure line. The output pressure line, into which the abrasive particulate material is fed from the storage container, communicates with the input pressure line, the back-pressure pressure line, and an outlet opening of storage container. During operation, pressurized gas is released through the inlet opening and into the storage container such that the abrasive particulate material adjacent the outlet opening is fluidized and maintained flowable so as to achieve consistent flow of the abrasive particulate material through the outlet opening.Type: GrantFiled: March 21, 2000Date of Patent: July 30, 2002Assignee: Hewlett-Packard CompanyInventors: Thomas E. Pettit, James Denning Smith
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Publication number: 20020052175Abstract: A pressurized delivery system for abrasive particulate material includes a storage container adapted to contain the abrasive particulate material therein, an input pressure line adapted to communicate with a pressurized source, and a fluidizing pressure line communicating with the input pressure line and an inlet opening in the storage container. A back-pressure pressure line communicates with an unoccupied portion of the storage container and an output pressure line. The output pressure line, into which the abrasive particulate material is fed from the storage container, communicates with the input pressure line, the back-pressure pressure line, and an outlet opening of storage container. During operation, pressurized gas is released through the inlet opening and into the storage container such that the abrasive particulate material adjacent the outlet opening is fluidized and maintained flowable so as to achieve consistent flow of the abrasive particulate material through the outlet opening.Type: ApplicationFiled: December 17, 2001Publication date: May 2, 2002Inventors: Thomas E. Pettit, James Denning Smith
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Publication number: 20020049025Abstract: A pressurized delivery system for abrasive particulate material includes a storage container adapted to contain the abrasive particulate material therein, an input pressure line adapted to communicate with a pressurized source, and a fluidizing pressure line communicating with the input pressure line and an inlet opening in the storage container. A back-pressure pressure line communicates with an unoccupied portion of the storage container and an output pressure line. The output pressure line, into which the abrasive particulate material is fed from the storage container, communicates with the input pressure line, the back-pressure pressure line, and an outlet opening of storage container. During operation, pressurized gas is released through the inlet opening and into the storage container such that the abrasive particulate material adjacent the outlet opening is fluidized and maintained flowable so as to achieve consistent flow of the abrasive particulate material through the outlet opening.Type: ApplicationFiled: December 17, 2001Publication date: April 25, 2002Inventors: Thomas E. Pettit, James Denning Smith
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Publication number: 20020045405Abstract: A pressurized delivery system for abrasive particulate material includes a storage container adapted to contain the abrasive particulate material therein, an input pressure line adapted to communicate with a pressurized source, and a fluidizing pressure line communicating with the input pressure line and an inlet opening in the storage container. A back-pressure pressure line communicates with an unoccupied portion of the storage container and an output pressure line. The output pressure line, into which the abrasive particulate material is fed from the storage container, communicates with the input pressure line, the back-pressure pressure line, and an outlet opening of storage container. During operation, pressurized gas is released through the inlet opening and into the storage container such that the abrasive particulate material adjacent the outlet opening is fluidized and maintained flowable so as to achieve consistent flow of the abrasive particulate material through the outlet opening.Type: ApplicationFiled: December 17, 2001Publication date: April 18, 2002Inventors: Thomas E. Pettit, James Denning Smith
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Patent number: 6238269Abstract: A technique for controlling the abrasive jet machining process to drill an ink feed slot through an ink jet printhead substrate. The approach results in a relatively even slot edge adjacent to channels that supply the ink-droplet firing chambers of the printhead. The evenness of the edge reduces the tolerances required for designing the channels and other printhead components, thus permitting the construction of printheads with increased droplet ejection frequency. The printhead size is correspondingly reduced.Type: GrantFiled: January 26, 2000Date of Patent: May 29, 2001Assignee: Hewlett-Packard CompanyInventors: Jeffrey R. Pollard, Thomas E. Pettit, Shen Buswell, Nichole Godwin