Patents by Inventor Thomas F. Klein, III

Thomas F. Klein, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7948443
    Abstract: A structural phased array antenna and method for manufacturing are disclosed. An integrated structural antenna aperture can be used to reduce net weight, cost, and volume where an array of antenna elements are incorporated into a structural member, e.g. in a spacecraft. A structural material layer, such as a structural foam, may be used with the array of individual antenna element cavities machined into the layer. The antenna element cavities are lined with a conductive material, such as plated aluminum. Facesheets may be bonded to the front and/or backside of the structural material layer in order to increase strength and/or stiffness using an RF transparent material. The array of antenna elements may be coupled to filters at the back side of structural material layer.
    Type: Grant
    Filed: January 23, 2008
    Date of Patent: May 24, 2011
    Assignee: The Boeing Company
    Inventors: Steven J. Bullock, Kenneth H. Griess, Thomas F. Klein, III, Otis F. Layton, Julio A. Navarro, Manny S. Urcia
  • Publication number: 20090184881
    Abstract: A structural phased array antenna and method for manufacturing are disclosed. An integrated structural antenna aperture can be used to reduce net weight, cost, and volume where an array of antenna elements are incorporated into a structural member, e.g. in a spacecraft. A structural material layer, such as a structural foam, may be used with the array of individual antenna element cavities machined into the layer. The antenna element cavities are lined with a conductive material, such as plated aluminum. Facesheets may be bonded to the front and/or backside of the structural material layer in order to increase strength and/or stiffness using an RF transparent material. The array of antenna elements may be coupled to filters at the back side of structural material layer.
    Type: Application
    Filed: January 23, 2008
    Publication date: July 23, 2009
    Applicant: The Boeing Company
    Inventors: Steven J. Bullock, Kenneth H. Griess, Thomas F. Klein, III, Otis F. Layton, Julio A. Navarro, Manny S. Urcia
  • Publication number: 20090179791
    Abstract: Systems and methods are disclosed herein to provide improved phased array antenna system. For example, in accordance with an embodiment of the present invention, a phased array antenna system includes a plurality of horn/filter assemblies. A plurality of modules are adapted to provide RF signals to the horn/filter assemblies. Each of the horn/filter assemblies is mounted on a top surface of a corresponding one of the modules. A thermal system is adapted to cool the modules. The modules are mounted on a first surface of the thermal system. A plurality of distribution boards associated with the modules are mounted on a second surface of the thermal system. A plurality of interconnects associated with the modules are adapted to connect the modules with the distribution boards through the thermal system.
    Type: Application
    Filed: July 24, 2006
    Publication date: July 16, 2009
    Inventors: David Kalian, Thomas F. Klein, III, Paul J. Tatomir, Alfred E. Lee
  • Patent number: 7551136
    Abstract: Systems and methods are disclosed herein to provide improved phased array antenna system. For example, in accordance with an embodiment of the present invention, a phased array antenna system includes a plurality of horn/filter assemblies. A plurality of modules are adapted to provide RF signals to the horn/filter assemblies. Each of the horn/filter assemblies is mounted on a top surface of a corresponding one of the modules. A thermal system is adapted to cool the modules. The modules are mounted on a first surface of the thermal system. A plurality of distribution boards associated with the modules are mounted on a second surface of the thermal system. A plurality of interconnects associated with the modules are adapted to connect the modules with the distribution boards through the thermal system.
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: June 23, 2009
    Assignee: The Boeing Company
    Inventors: David Kalian, Thomas F. Klein, III, Paul J. Tatomir, Alfred E. Lee