Abstract: A portable cooling system and apparatus for semiconductor device testing includes a free piston Stirling cooler. This eliminates the need for cumbersome remotely located equipment, such as a chillers, compressors, coolant storage equipment, hoses and hose connections. An electrical power line and an air supply line are routed from a head control unit to a portable system control unit. The head control unit is positioned by an adjustable frame structure to locate the Stirling cooler vertically directly over a semiconductor device under test. The head control unit includes a thermal adapter system, which is configured between the free piston Stirling cooler and the semiconductor device under test.

Abstract: A portable cooling system and apparatus for semiconductor device testing includes a free piston Stirling cooler. This eliminates the need for cumbersome remotely located equipment, such as a chillers, compressors, coolant storage equipment, hoses and hose connections. An electrical power line and an air supply line are routed from a head control unit to a portable system control unit. The head control unit is positioned by an adjustable frame structure to locate the Stirling cooler vertically directly over a semiconductor device under test. The head control unit includes a thermal adapter system, which is configured between the free piston Stirling cooler and the semiconductor device under test.

Abstract: A thermal control unit (TCU) for controlling temperature of a device under test (DUT) includes a sealed evaporation chamber disposed therein, the evaporation chamber configured with a refrigerant inlet and a refrigerant outlet; and at least one surface for thermal engagement of the device under test and configured to conduct heat to the evaporation chamber. A test system and a computer program product are disclosed.

Abstract: A thermal control unit (TCU) for controlling temperature of a device under test (DUT) includes a sealed evaporation chamber disposed therein, the evaporation chamber configured with a refrigerant inlet and a refrigerant outlet; and at least one surface for thermal engagement of the device under test and configured to conduct heat to the evaporation chamber. A test system and a computer program product are disclosed.

Abstract: Self-enclosing heat exchangers are made from stacked plates having raised peripheral flanges on one side of the plates and continuous peripheral ridges on the other side of the plates, so that when the plates are put together, fully enclosed alternating flow channels are provided between the plates. The plates have raised bosses defining flow ports that line-up in the stacked plates to form manifolds for the flow of heat exchange fluids through alternate plates. Rib and groove barriers are formed in the plates inside the peripheral flanges and ridges. The barriers prevent short circuit flow on one side of the plates and promote flow to remote areas on the other side of the plates, to improve the overall efficiency of the heat exchangers.

Abstract: A heat exchanger is disclosed for automotive lubricants and coolants wherein the heat exchanger has a calibrated bypass orifice located therein to maintain the flow therethrough at all times, particularly during cold flow operation, or high pressure transient conditions such as at engine start-up. The heat exchanger has a housing defining a fluid inlet chamber and a fluid outlet chamber. A separator is located between the inlet and outlet chambers and heat exchange passages are located between and communicate with the inlet and outlet chambers. The separator has a calibrated bypass orifice therethrough for the continuous flow of fluid between the inlet and outlet chambers bypassing the heat exchange passages.