Abstract: This disclosure relates to a curable composition that includes at least one maleimide-containing compound or benzoxazine compound, at least one low dielectric loss polymer or a hydrogenated derivative thereof, at least one filler, and at least one radical initiator. This disclosure also relates to using the composition to form a film, a laminate, and/or a circuit board.

Abstract: This disclosure relates to a curable composition that includes at least one maleimide-containing compound or benzoxazine compound, at least one low dielectric loss polymer or a hydrogenated derivative thereof, at least one filler, and at least one radical initiator. This disclosure also relates to using the composition to form a film, a laminate, and/or a circuit board.

Abstract: Novel polyindanebisphenols or PIBPs for the preparation of new and improved thermosetting polymers having the general formula of are provided. Also disclosed are thermoplastic or thermoset compositions prepared using the novel compounds of the invention, as well as methods of making and using the same. When copolymerized or reactive with other commercial resins such as, e.g., epoxy compounds, PIBP based polymers are characterized by high glass transition temperature (“Tg”), low dielectric constant, low moisture absorption, low coefficient of expansion, low cost, and can be processed on equipment typically used for the production of epoxy based laminates.