Abstract: Apparatus including a body as an intermediary between a device and a printed circuit board, the body including a contact area defined by a plurality of openings each to accommodate a contact therethrough and an alignment feature adjacent the contact area and protruding from a plane defined by the contact area, wherein a surface of the alignment feature includes a friction-reducing material. A method including contacting an alignment feature of a socket with a friction-reducing material. Apparatus and system including a body as an intermediary between a device and a printed circuit board; a plurality of contacts each disposed through a contact area of the body and oriented to deflect a device in a first direction; and a load plate coupled to the body and configured to apply an actuation force on a device in a different second direction. A method including inserting a device into a socket.

Abstract: In one embodiment, the present invention includes a circuit board having integrated contacts to mate with corresponding pads of a semiconductor device. At least some of the integrated contacts are of varying sizes to enable different contact resistances between the corresponding integrated contacts and pads, enabling reduced loading forces to adapt the semiconductor device to the circuit board. Other embodiments are described and claimed.

Abstract: In one embodiment, the present invention includes a circuit board having integrated contacts to mate with corresponding pads of a semiconductor device. At least some of the integrated contacts are of varying sizes to enable different contact resistances between the corresponding integrated contacts and pads, enabling reduced loading forces to adapt the semiconductor device to the circuit board. Other embodiments are described and claimed.

Abstract: In some embodiments, a socket assembly, electronic assembly and electronic system provide current paths for supplying power and I/O signals to a processor. The socket assembly includes a base having an upper surface and a lower surface with a plurality of contacts extending from the upper surface of the base. Each of the contacts is adjacent to another contact such that each of the contacts is part of a differential pair of contacts. Each of the contacts includes a first side and a second side. One of the contacts in each differential pair of contacts is oriented in one direction while the other contact in each differential pair of contacts is oriented in an opposing direction such that the first side of one of the contacts in each differential pair faces in an opposite direction to the first side of the other contacts in each differential pair.

Abstract: Apparatus including a body as an intermediary between a device and a printed circuit board, the body including a contact area defined by a plurality of openings each to accommodate a contact therethrough and an alignment feature adjacent the contact area and protruding from a plane defined by the contact area, wherein a surface of the alignment feature includes a friction-reducing material. A method including contacting an alignment feature of a socket with a friction-reducing material. Apparatus and system including a body as an intermediary between a device and a printed circuit board; a plurality of contacts each disposed through a contact area of the body and oriented to deflect a device in a first direction; and a load plate coupled to the body and configured to apply an actuation force on a device in a different second direction. A method including inserting a device into a socket.

Abstract: In some embodiments, a socket assembly, electronic assembly and electronic system provide current paths for supplying power and I/O signals to a processor. The socket assembly includes a base having an upper surface and a lower surface with a plurality of contacts extending from the upper surface of the base. Each of the contacts is adjacent to another contact such that each of the contacts is part of a differential pair of contacts. Each of the contacts includes a first side and a second side. One of the contacts in each differential pair of contacts is oriented in one direction while the other contact in each differential pair of contacts is oriented in an opposing direction such that the first side of one of the contacts in each differential pair faces in an opposite direction to the first side of the other contacts in each differential pair.

Abstract: A land grid array (LGA) socket is connected to a power converter using compression contact technology eliminating the need for an edge-card connector typically required in such applications. The LGA socket is mounted to the power converter in a single direction of assembly (i.e., the vertical axis).

Abstract: A conventional land grid array (LGA) socket assembly uses the same socket contact in the power delivery area and the signal delivery area. Using low current socket contacts in the power delivery area may create self-heating and limit power delivery from a printed circuit board (PCB) to an IC package mounted in the socket. Embodiments of the present invention are directed to an LGA socket assembly that has a separate power delivery contact, which includes contact pins and contacts pads that are ganged using a cross beam to form a comb-shaped contact. In an alternative embodiment of the present invention, an LGA socket assembly has a shorter channel in the power delivery area than in known LGA socket assemblies. In still another embodiment, an LGA socket assembly has a shorter channel in the power delivery area in the signal delivery area.

Abstract: A land grid array (LGA) socket is connected to a power converter using compression contact technology eliminating the need for an edge-card connector typically required in such applications. The LGA socket is mounted to the power converter in a single direction of assembly (i.e., the vertical axis).

Abstract: A dual serial advanced technology attachment (SATA) connector that includes a first SATA connector interface, a second SATA connector interface, and a housing. The first SATA connector interface and the second SATA connector interface may be mounted in the housing in a double stack configuration parallel to each other. The first SATA connector interface and the second SATA connector interface may also be mounted in the housing longitudinally in an end-to-end configuration. The footprints on a printed circuit board (PCB) associated with the SATA connector interfaces provide less manufacturing problems and good electrical performance. Dual SATA interfaces on a single connector save PCB space and manufacturing assembly time.

Abstract: An apparatus comprising a direct board-to-board coaxial connection fabricated from metal parts that have been stamped and formed is disclosed. The connection allows direct board-to-board coaxial connections with a low cost and ease of manufacturing.

Abstract: An apparatus comprising a direct board-to-board coaxial connection fabricated from metal parts that have been stamped and formed is disclosed. The connection allows direct board-to-board coaxial connections with a low cost and ease of manufacturing.

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract: A dual serial advanced technology attachment (SATA) connector that includes a first SATA connector interface, a second SATA connector interface, and a housing. The first SATA connector interface and the second SATA connector interface may be mounted in the housing in a double stack configuration parallel to each other. The first SATA connector interface and the second SATA connector interface may also be mounted in the housing longitudinally in an end-to-end configuration. The footprints on a printed circuit board (PCB) associated with the SATA connector interfaces provide less manufacturing problems and good electrical performance. Dual SATA interfaces on a single connector save PCB space and manufacturing assembly time.

Abstract: A land grid array (LGA) socket is connected to a power converter using compression contact technology eliminating the need for an edge-card connector typically required in such applications. The LGA socket is mounted to the power converter in a single direction of assembly (i.e., the vertical axis).

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract: An improved coplanar transmission structure has a coplanar transmission line formed on one surface of a substrate and a lossy resistive material formed on the opposite surface of the substrate for suppressing spurious electromagnetic modes propagating through the substrate. The lossy resistive material may be nichrome or the like and is patterned on the substrate using thin or thick film processing.