Patents by Inventor Thomas G. Wagner

Thomas G. Wagner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked ball grid array
    Patent number: 6657134
    Abstract: A ball grid array mounted circuit includes a stress relief substrate having spaced conductive vias extending between its surfaces and connection pads at the surfaces. Solder connections formed from solder balls connect between pads at the top surface and connection pads at an electronic component. Solder connections formed from solder balls connect between pads at the bottom surface and connection pads at a printed circuit board (PCB). The solder connections absorb at least a portion of the stress due to differences between the thermal coefficient of expansion of the electronic component and the PCB.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: December 2, 2003
    Assignee: Honeywell International Inc.
    Inventors: Richard K. Spielberger, Ronald J. Jensen, Thomas G. Wagner
  • Ball grid array package
    Publication number: 20030102156
    Abstract: A ball grid array mounted circuit includes a stress relief substrate having spaced conductive vias extending between its surfaces and connection pads at the surfaces. Solder connections formed from solder balls connect between pads at the top surface and connection pads at an electronic component. Solder connections formed from solder balls connect between pads at the bottom surface and connection pads at a printed circuit board (PCB). The solder connections absorb at least a portion of the stress due to differences between the thermal coefficient of expansion of the electronic component and the PCB.
    Type: Application
    Filed: November 30, 2001
    Publication date: June 5, 2003
    Inventors: Richard K. Spielberger, Ronald J. Jensen, Thomas G. Wagner