Patents by Inventor Thomas GRADINGER
Thomas GRADINGER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160174414Abstract: Cooling apparatus cooling for an electrical or electronic device, comprising an at least partially hollow body containing a refrigerant and having a plurality of electrically conductive sections Each electrically conductive section has a respective coupling portion suitable to be operatively associated with a corresponding electrically conductive part of the electrical or electronic device, wherein the at least partially hollow body further comprises one or more electrically insulating sections. Each electrically insulating section is positioned between and electrically insulates from each other two adjacent electrically conductive sections.Type: ApplicationFiled: August 7, 2013Publication date: June 16, 2016Inventors: Francoise Molitor, Patrik Kaufmann, Tilo Buehler, Francesco Agostini, Thomas Gradinger, Federico Gamba
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Patent number: 9232685Abstract: An exemplary power electronics module includes a first power electronics element that generates a first heat flow during operation of the power electronics module, a second power electronics element that generates a second heat flow during operation of the power electronics module. The first cooler is in thermal contact with the first power electronics element to receive at least part of the first heat flow. The second cooler is in thermal contact with the second power electronics element to receive at least part of the second heat flow. A heat exchanger is configured to transmit at least part of the first heat flow and the second heat flow to a primary cooling flow and transfer heat flow in a thermally efficient manner. A magnitude of the heat flow is less than a total magnitude that is formed from a maximum first heat flow and a maximum second heat flow.Type: GrantFiled: September 12, 2013Date of Patent: January 5, 2016Assignee: ABB TECHNOLOGY AGInventors: Mathieu Habert, Oscar Apeldoorn, Thomas Gradinger
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Patent number: 9113578Abstract: A thermosiphon cooler arrangement is provided for the cooling of electric and/or electronic components, including a module of an electric and/or electronic system. The module includes a guiding structure and an inlet for receiving a stream of cooling air, and an outlet for releasing cooling air thereafter in an operating state of the module. The guiding structure is provided for guiding the cooling air entering through the inlet and leaving the module through the outlet in an operating state of the module. The module includes a thermosiphon cooler with an evaporator and a condenser for transferring a majority of a heat load to the cooling air in an operating state of the module. The evaporator is tilted with respect to the condenser wherein the condenser is arranged such that a major portion of the cooling air flows through the condenser.Type: GrantFiled: October 31, 2012Date of Patent: August 18, 2015Assignee: ABB TECHNOLOGY AGInventors: Didier Cottet, Francesco Agostini, Thomas Gradinger, Andreas Vögeli
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Patent number: 9113579Abstract: The present disclosure relates to the cooling of electric and/or electronic components, in particular to an electric and/or electronic system with a cabinet, which includes a cabinet housing including a first aperture for receiving a stream of cooling air. The cabinet housing includes a second aperture for releasing the cooling air thereafter in an operating state of the cabinet. At least two modules, which each include a guiding structure with an inlet and an outlet, are provided in the cabinet. The at least two modules are arranged in the cabinet housing such that a branch of the major portion of cooling air flowing through the first aperture of the cabinet housing is enabled to flow into each module via the inlet guided by the guiding structure through the dedicated module to the outlet and thereafter through the second aperture out of the cabinet housing.Type: GrantFiled: October 31, 2012Date of Patent: August 18, 2015Assignee: ABB TECHNOLOGY AGInventors: Didier Cottet, Francesco Agostini, Thomas Gradinger, Andreas Vögeli
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Patent number: 9097467Abstract: A heat exchanger including a first heat exchanger module with a first evaporator channel and a first condenser channel. The first evaporator channel and the first condenser channel are arranged in a first conduit. The first evaporator channel and the first condenser channel are fluidly connected to one another by a first upper distribution manifold and a first lower distribution manifold such that the first evaporator channel and the first condenser channel form a first loop for a working fluid. The first heat exchanger module includes a first evaporator heat transfer element and a first condenser heat transfer element. The heat exchanger includes a second heat exchanger module coupled to the first heat exchanger module by a fluid connection element for an exchange of the working fluid between the first heat exchanger module and second heat exchanger module.Type: GrantFiled: March 27, 2013Date of Patent: August 4, 2015Assignee: ABB RESEARCH LTDInventors: Thomas Gradinger, Bruno Agostini, Marcel Merk
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Publication number: 20150136358Abstract: A cooling element includes a first surface for receiving an electric component, and a second surface which is provided with fins for forwarding a heat load received from the electric component via the first surface to surroundings. One or more of the fins are provided with a respective flow channel for passing a fluid within each respective fin, to provide efficient cooling.Type: ApplicationFiled: November 19, 2014Publication date: May 21, 2015Applicant: ABB OyInventors: Thomas GRADINGER, Bruno Agostini
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Patent number: 8913386Abstract: A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module includes at least one panel for cooling electric and/or electronic components. Two sheets of the panel are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets. The conduit extends in a direction of a plane formed by the sheets. Cooling may be provided by evaporating coolant in the conduit at an evaporation section of the panel and by condensing the coolant at a condensing section of the panel. A heat load may be transferred from a heat source to a heat receiving unit. The heat receiving unit is adapted to transfer the heat load to the panel which transfers the heat load to an ambient environment by a thermal carrier.Type: GrantFiled: March 28, 2012Date of Patent: December 16, 2014Assignee: ABB Research Ltd.Inventors: Thomas Gradinger, Berk Yesin, Francesco Agostini
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Patent number: 8714302Abstract: Exemplary embodiments are directed to a cooling apparatus for cooling a power electronic device, the apparatus including at least one panel that is adapted to be thermally connected to a heat source in order to receive heat from the heat source. The panel is also adapted to be thermally in contact with an air flow in order to transfer heat from the panel. The panel includes at least one hole between a first side of the panel and a second side of the panel. The hole is adapted to attenuate a vibrating air pressure generated by an acoustic noise source and carried by the air.Type: GrantFiled: July 6, 2012Date of Patent: May 6, 2014Assignee: ABB Research LtdInventors: Thomas Gradinger, Francesco Agostini
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Publication number: 20140071629Abstract: An exemplary power electronics module includes a first power electronics element that generates a first heat flow during operation of the power electronics module, a second power electronics element that generates a second heat flow during operation of the power electronics module. The first cooler is in thermal contact with the first power electronics element to receive at least part of the first heat flow. The second cooler is in thermal contact with the second power electronics element to receive at least part of the second heat flow. A heat exchanger is configured to transmit at least part of the first heat flow and the second heat flow to a primary cooling flow and transfer heat flow in a thermally efficient manner. A magnitude of the heat flow is less than a total magnitude that is formed from a maximum first heat flow and a maximum second heat flow.Type: ApplicationFiled: September 12, 2013Publication date: March 13, 2014Applicant: ABB Technology AGInventors: Mathieu HABERT, Oscar APELDOORN, Thomas GRADINGER
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Publication number: 20130340978Abstract: A two-phase heat exchanger for cooling at least one electronic and/or electric component includes an evaporator and a condenser. The evaporator transfers heat from the electronic and/or electric component to a working fluid. The condenser includes a roll-bonded panel, which has a first channel which has a first connection port and a second connection port. The evaporator has a second channel and first connection openings and second connection openings. The first connection port of the first channel is connected to one first connection opening of the evaporator and the second connection port of the first channel is connected to one second connection opening of the evaporator and the working fluid is provided to convey heat by convection from the evaporator to the condenser by flowing from the second channel through the first connection opening or the second connection opening of the evaporator towards the first channel.Type: ApplicationFiled: June 20, 2013Publication date: December 26, 2013Inventors: Francesco AGOSTINI, Matteo Fabbri, Thomas Gradinger
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Publication number: 20130258594Abstract: A heat exchanger including a first heat exchanger module with a first evaporator channel and a first condenser channel. The first evaporator channel and the first condenser channel are arranged in a first conduit. The first evaporator channel and the first condenser channel are fluidly connected to one another by a first upper distribution manifold and a first lower distribution manifold such that the first evaporator channel and the first condenser channel form a first loop for a working fluid. The first heat exchanger module includes a first evaporator heat transfer element and a first condenser heat transfer element. The heat exchanger includes a second heat exchanger module coupled to the first heat exchanger module by a fluid connection element for an exchange of the working fluid between the first heat exchanger module and second heat exchanger module.Type: ApplicationFiled: March 27, 2013Publication date: October 3, 2013Applicant: ABB RESEARCH LTDInventors: Thomas Gradinger, Bruno Agostini, Marcel Merk
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Publication number: 20130077245Abstract: A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module includes at least one panel for cooling electric and/or electronic components. Two sheets of the panel are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets. The conduit extends in a direction of a plane formed by the sheets. Cooling may be provided by evaporating coolant in the conduit at an evaporation section of the panel and by condensing the coolant at a condensing section of the panel. A heat load may be transferred from a heat source to a heat receiving unit. The heat receiving unit is adapted to transfer the heat load to the panel which transfers the heat load to an ambient environment by a thermal carrier.Type: ApplicationFiled: March 28, 2012Publication date: March 28, 2013Applicant: ABB RESEARCH LTDInventors: Thomas Gradinger, Berk Yesin, Francesco Agostini
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Publication number: 20130008633Abstract: Exemplary embodiments are directed to a cooling apparatus for cooling a power electronic device, the apparatus including at least one panel that is adapted to be thermally connected to a heat source in order to receive heat from the heat source. The panel is also adapted to be thermally in contact with an air flow in order to transfer heat from the panel. The panel includes at least one hole between a first side of the panel and a second side of the panel. The hole is adapted to attenuate a vibrating air pressure generated by an acoustic noise source and carried by the air.Type: ApplicationFiled: July 6, 2012Publication date: January 10, 2013Applicant: ABB Research LtdInventors: Thomas GRADINGER, Francesco Agostini