Abstract: One embodiment of the present invention is a compliant thermal contactor that includes a resilient metal film having a plurality of first thermally conductive, compliant posts disposed in an array on a top side thereof and a plurality of second thermally conductive, compliant posts disposed in an array on a bottom side thereof.

Abstract: A socket connector for connecting a bulbous terminal or ball wherein the female element grips the terminal with resilient prongs with end tips at low insertion force but positive contact is maintained and wherein attempted withdrawal is normally inhibited by increasing force applied to the post by the female element in response to the withdrawal force. The female element comprises a tube of resilient conductive material that has been sliced or helically partitioned into opposing prongs of a width that decreases with axial distance from the end of the connector so as to allow the prongs of the connector to grip around the ball-like bulbous terminal and mechanically retain the terminal within the connector. The tubular element of the connector may be made by forming prongs in one or both ends of a tube by cuts of a width that increases with distance from the end of the tube.

Abstract: One embodiment of the present invention is an apparatus useful to control temperature of a device that includes: (a) a heat transfer apparatus; (b) a combined path to the heat transfer apparatus; (c) a first path maintained at a first temperature and connected to the combined path; (d) a second path maintained at a second temperature and connected to the combined path; (e) a third path connected to the combined path; (f) a pump assembly operable to circulate thermal transfer fluid: (i) from the heat transfer apparatus, (ii) through one or more of the first, second and third paths, (iii) from the one or more of the first, second and third paths, through the combined path, and (iv) from the combined path, to and through the heat transfer apparatus; and (g) a valve assembly operable to cause predetermined amounts of thermal transfer fluid to flow into one or more of the first, second, and third paths, thereby controlling the temperature.

Abstract: One embodiment of the present invention is an alignment apparatus useful to align a test head that includes: (a) two or more fluid chambers disposed in fixed relation to each other, the chambers having a movable wall and one or more apertures for admitting or releasing fluid; (b) fluid channels coupled to the one or more apertures that enable fluid to flow between at least two of the fluid chambers; and (c) one or more valves disposed to enable or to stop the flow of fluid through one or more of the one or more fluid channels.

Abstract: A socket connector for connecting a post or ball wherein the female element grips the post with resilient prongs with end tips at low insertion force but positive contact is maintained and wherein attempted withdrawal is normally inhibited by increasing force applied to the post by the female element in response to the withdrawal force. The female element comprises a tube of resilient conductive material that has been sliced or helically partitioned into opposing helical prongs so as to allow the prongs of the connector to spirally open around the post or ball-like bump and mechanically grip the post or bump as the post or bump is inserted along the longitudinal axis of the tube. The tubular element may be made by forming helical prongs in the end of a tube in helical cuts from about a mid section to one end of the tube.

Abstract: A wafer probe interconnect apparatus for use in testing a plurality of uncut chips in a semiconductor wafer. The apparatus includes a support block and a dielectric substrate coupled to the support block and supported on a patterned array of posts to inhibit displacement of the dielectric substrate under load. The dielectric substrate has probe tips protruding from a first surface and a number of contacts on a second opposing surface. The probe tips are electrically coupled to the contacts by conductive vias passing from the first surface to the second opposing surface. The posts are sufficiently pliant to allow for thermal expansion of the dielectric substrate without warpage of the dielectric substrate.

Abstract: One embodiment of the present invention is an apparatus including a fluid coupler interfaced to a test head that includes: (a) a first ring having a top surface disposed in a first plane; (b) a first movable ring, the first movable ring being movable substantially normal to the first plane relative to the first ring; (c) a first flexible diaphragm attached to the first ring along a first attachment perimeter that encloses a first effective surface area, the first flexible diaphragm being attached to the first movable ring; (d) a second ring having a top surface disposed in a second plane; (e) a second movable ring, the second movable ring being movable substantially normal to the first plane; and (f) a second flexible diaphragm attached to the second ring along a second attachment perimeter that encloses a second effective surface area, the second flexible diaphragm being attached to the second movable ring; wherein: (i) the first flexible diaphragm and the second flexible diaphragm form a first channel for f

Abstract: One embodiment of the present invention is a mounting apparatus that includes: (a) a first ring having a first surface and a second surface; (b) a second ring having a first surface and a second surface, which second ring is movable with respect to the first ring; (c) a first flexible diaphragm attached to: (i) the first surface of the first ring along a first-surface-first-ring attachment perimeter that encloses a first effective surface area, and (ii) the first surface of the second ring along a first-surface-second-ring attachment perimeter; and (d) a second flexible diaphragm attached to: (i) the second surface of the first ring along a second-surface-first-ring attachment perimeter that encloses a second effective surface area, and (ii) the second surface of the second ring at a second-surface-second-ring attachment perimeter; wherein: the first and second flexible diaphragms and the first and second rings form a chamber with one or more intake apertures.

Abstract: One embodiment of the present invention is a method for setting and controlling temperature of a device that includes: (a) thermally contacting the device to a heat transfer apparatus, the heat transfer apparatus having an apparatus intake to receive thermal transfer fluid, an apparatus exhaust to output thermal transfer fluid, and a conduit to conduct thermal transfer fluid from the apparatus intake to the apparatus exhaust through the heat transfer apparatus; (b) flowing a first thermal transfer fluid in a first thermal control circuit at a first temperature, and flowing a second thermal transfer fluid in a second thermal control circuit at a second temperature; (c) at a first predetermined time, directing the first thermal transfer fluid to flow to the apparatus intake, and from the apparatus exhaust back to the first thermal control circuit and the second thermal transfer fluid to flow in the second thermal control circuit without flowing to the apparatus intake; and (d) at a second predetermined time, di

Abstract: A wafer probe interconnect apparatus for use in testing a plurality of uncut chips in a semiconductor wafer. The apparatus includes a support block and a dielectric substrate coupled to the support block and supported on a patterned array of posts to inhibit displacement of the dielectric substrate under load. The dielectric substrate has probe tips protruding from a first surface and a number of contacts on a second opposing surface. The probe tips are electrically coupled to the contacts by conductive vias passing from the first surface to the second opposing surface. The posts are sufficiently pliant to allow for thermal expansion of the dielectric substrate without warpage of the dielectric substrate.

Abstract: One embodiment of the present invention is a socket useful to contact an electronic device, the socket including: (a) one or more contactor holder plates including one or more first through holes having a first hole cross sectional area, and one or more second through holes having a second hole cross sectional area; (b) one or more first contactors having a body with a first body cross sectional area disposed in the first through holes; (c) one or more second contactors having a body with a second body cross sectional area disposed in the second through holes; and (d) a heat sink in thermal contact with one or more of the one or more contactor holder plates; wherein a first ratio of the first hole cross sectional area to the first body cross sectional area is different from a second ratio of the second hole cross sectional area to the second body cross sectional area.

Abstract: Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of the first panel by at least one tab that extends from an edge of the first circuit board to an edge of the disposable part of the first panel; (c) applying an insulating coating to the first circuit board so that at least each edge of the first circuit board is covered thereby; and (d) separating the first circuit board from the disposable part in a manner whereupon at least part of the tab remains attached to the first circuit board and includes an exposed edge of the conductive sheet of the first circuit board. Circuit boards formed by the method are also provided.

Abstract: A circuit board layer 2 in accordance with the present invention includes a conductive sheet 4 sandwiched between an insulating top layer 10 and an insulating bottom layer 14. The top and bottom layers 10 and 14 and the conductive sheet 4 define the circuit board layer 2 having an edge that includes an edge 20 of the conductive sheet 4. An insulating edge layer 18 covers substantially all of the edge 20 of the conductive sheet 4.

Abstract: An improved structure and method for making interconnects for a thin package of stacked integrated circuits is described. The structure uses a spring contact to replace traditional solder balls in a stacked structure. The spring contacts are incorporated in an integrated circuit layer and may be made from stressed metal or physical bending of a metal structure. The spring contacts enable electrical coupling to adjacent circuit layers immediately above or immediately below the integrated circuit layer.

Abstract: A circuit board layer 2 in accordance with the present invention includes a conductive sheet 4 sandwiched between an insulating top layer 10 and an insulating bottom layer 14. The top and bottom layers 10 and 14 and the conductive sheet 4 define the circuit board layer 2 having an edge that includes an edge 20 of the conductive sheet 4. An insulating edge layer 18 covers substantially all of the edge 20 of the conductive sheet 4.

Abstract: A single-sided compliant probe is provided that includes a conductive tip shaped as one or more thin conductive fins having one edge which is positioned on a supporting substrate in a manner that allows the opposing edge to engage a contact pad and to move flexibly with respect to the supporting substrate while in close proximity to adjacent probes in an array. The probe tip is oriented in a direction of wipe of the tip across the contact pad but moves substantially vertically in response to the force of a mating contact pad as it is mechanically biased against the tip. Mechanical compliance of the probe allows electrical contact to be made reliably between the probe and its corresponding contact pad on a microelectronic device, where the mechanical compliance accommodates variations in height of the contact pad and wipe improves reliability of electrical engagement.

Abstract: A small single-sided compliant probe is provided that includes a conductive tip, which is positioned on a supporting surface in a manner that allows a tip on the probe to move flexibly with respect to the supporting surface in close proximity to adjacent probes in an array. The probe tip moves vertically in response to the force of a mating contact pad as it biased against the tip. Mechanical compliance of the probe allows electrical contact to be made reliably between the probe and a corresponding contact pad on a microelectronic device, where the mechanical compliance accommodates variations in height of the contact pad.

Abstract: A circuit board layer 2 in accordance with the present invention includes a conductive sheet 4 sandwiched between an insulating top layer 10 and an insulating bottom layer 14. The top and bottom layers 10 and 14 and the conductive sheet 4 define the circuit board layer 2 having an edge that includes an edge 20 of the conductive sheet 4. An insulating edge layer 18 covers substantially all of the edge 20 of the conductive sheet 4.

Abstract: A mechanically compliant probe for electrically connecting to contact pads on microelectronic devices. The probe is used for burn-in of integrated circuits at the wafer level. Additional applications include probe cards for testing integrated circuits and sockets for flip-chips. One embodiment of the probe includes a probe tip which is held on an extension arm projecting laterally from an elongated flat spring. The spring is supported above a substrate by posts such that the probe tip moves vertically in response to a contact force on the probe tip. Deflection of the probe tip is compliantly limited by bending and torsional flexure of the sheet spring. Mechanical compliance of the tip allows arrays of the probe to contact pads on integrated circuits where the pads are not precisely planar.

Abstract: A small single-sided compliant probe is provided that includes a conductive tip, which is positioned on a supporting surface in a manner that allows a tip on the probe to move flexibly with respect to the supporting surface in close proximity to adjacent probes in an array. The probe tip moves vertically in response to the force of a mating contact pad as it biased against the tip. Mechanical compliance of the probe allows electrical contact to be made reliably between the probe and a corresponding contact pad on a microelectronic device, where the mechanical compliance accommodates variations in height of the contact pad.