Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The pulsed laser produces pulse bursts with 5-20 pulses per pulse burst and pulse burst energy of 300-600 micro Joules per burst. The focal line is directed into the glass composite workpiece, generating induced absorption within the material.

Abstract: A glass sheet processing apparatus includes a first gantry assembly that extends across a glass sheet in a cross-machine direction. The first gantry assembly includes a processing head that moves along a length of the first gantry assembly and includes a laser comprising an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A second gantry assembly extends across the glass sheet in the cross-machine direction. The second gantry assembly includes a processing head that moves along a length of the second gantry assembly.

Abstract: A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.

Abstract: A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.

Abstract: A laser system includes a controller comprising a processor and a non-transitory machine-readable memory, a laser head configured to output a laser beam, a work bed positioned opposite the laser head, and a power meter communicatively coupled to the electronic control unit and integrated within the work bed. The laser system further includes a knife edge plate positioned between the power meter and the laser head, and a machine-readable instruction set stored in the non-transitory machine readable memory that causes the laser system to perform at least the following when executed by the processor: position the laser head at a distance from the power meter, cause the laser head to output the laser beam, translate the laser head across the power meter, receive power signals from the power meter as the laser beam is translated across the power meter, and calculate a spot size based on the power signals.

Abstract: In some embodiments, a method of forming a glass article comprises perforating a glass substrate along a contour with a laser forming a plurality of perforations, such that the contour separates a first portion of the glass substrate from a second portion of the glass substrate. After perforating, thermal forming the glass substrate into a non-planar shape with a mold, and separating the first portion of the glass substrate from the second portion of the glass substrate.

Abstract: A laser system includes a controller comprising a processor and a non-transitory machine-readable memory, a laser head configured to output a laser beam, a work bed positioned opposite the laser head, and a power meter communicatively coupled to the electronic control unit and integrated within the work bed. The laser system further includes a knife edge plate positioned between the power meter and the laser head, and a machine-readable instruction set stored in the non-transitory machine readable memory that causes the laser system to perform at least the following when executed by the processor: position the laser head at a distance from the power meter, cause the laser head to output the laser beam, translate the laser head across the power meter, receive power signals from the power meter as the laser beam is translated across the power meter, and calculate a spot size based on the power signals.

Abstract: A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.

Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.

Abstract: A glass sheet processing apparatus includes a glass sheet processing station including a laser cutting assembly that includes an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A glass holding conveyor belt carries a glass sheet by the laser cutting assembly so that the laser beam focal line is positioned on the glass sheet with the glass sheet on the glass holding conveyor belt. The glass holding conveyor belt is configured to carry multiple glass sheets to the laser cutting assembly for cutting the multiple glass sheets on the glass holding conveyor belt in a repeated fashion.

Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The pulsed laser produces pulse bursts with 5-20 pulses per pulse burst and pulse burst energy of 300-600 micro Joules per burst. The focal line is directed into the glass composite workpiece, generating induced absorption within the material.

Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.

Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.