Abstract: Some mechanical, electrical, and thermal properties of high Tc superconductors such as (Ba, Y) cuprates can be substantially improved by the dispersal of an appropriate metal in the superconductive body. For instance, mixing Ag particles with superconductive powder of nominal composition Ba2YCu3O7 and processing the mixture in the conventional manner can produce superconductive bodies having Tc of about 93 K and substantially greater fracture strength and normal state electrical and thermal conductivity than otherwise identical bodies that do not contain Ag particles.

Abstract: Many potential applications of CVD diamond film require the ability to remove a predetermined quantity of material from a surface of the film. We have discovered that such removal is advantageously accomplished by contacting the surface of the polycrystalline diamond film with a metal selected from Fe, Ni, Mn and Ti (preferably Fe and Mn, most preferably Mn), and maintaining the metal-contacted diamond film at a temperature in the range 600-1100° C. (preferably 800-1000° C.) without relative lateral motion between the film and the metal, for an effective time for removal of the quantity of material, exemplarily less than 100 hours. The metal can be in any appropriate form, e.g., a deposited layer, (including a patterned layer), a foil, or powder. We have also discovered that the local thermal conductivity of CVD diamond films typically increases with distance from the lower surface of an as-grown film.

Abstract: The invention is a reconfigurable optical grating device using force from programmable magnets to alter the mechanical strain, preferably a tensile strain, on the gratings so as to induce a latchable change in grating periodicity using a pulse or short-duration current. It includes apparatus for limiting the maximum strain applied to the grating so that the fiber does not fracture, and it provides strain without rotation or twisting of the fiber grating. In preferred embodiment it provides control of magnetic force so as to accurately obtain a predetermined amount of strain and hence wavelength shift in the grating with a minimal amount of electrical power. The inventive structure is useful, e.g. for wavelength division multiplexed optical communication system comprising wavelength channel add/drop devices and/or dynamically gain-equalized amplifiers.

Abstract: The invention is embodied in an anisotropic, soft magnetic thin film article comprising a cobalt-iron-chromium-nitrogen (Co--Fe--Cr--N) alloy. The thin film is formed such that the alloy has a relatively high saturation magnetization (4.pi.M.sub.s), e.g., greater than approximately 8 kilogauss (kG), a relatively low coercivity (H.sub.c), e.g., less than approximately 2.0 oersteds (Oe), a relatively high squareness ratio (M.sub.r /M.sub.s), e.g., greater than approximately 0.90, and a relatively high anisotropy field (H.sub.k), e.g., greater than approximately 20 Oe, in an as-deposited condition or, alternatively, with a relatively low temperature treatment, e.g., below approximately 300.degree. Celsius. The inventive films are suitable for use in electromagnetic devices, e.g., in microtransformer cores, inductor cores and in magnetic read-write heads.

Abstract: Articles according to the invention comprise a superconductive cuprate (e.g., YBa.sub.2 Cu.sub.3 O.sub.7) body containing elongate grains measuring at least about 10 .mu.m along the long axis and having an aspect ratio of at least 10:1. Bodies according to the invention can have relatively high critical current density, as compared to analogous non-textured bodies.

Abstract: New solder compositions having enhanced mechanical properties are disclosed. Relatively inert particles having a diameter of 2000 nm or less are dispersed in a solder material having an average grain size of 500 nm or less to produce such solder compositions. The dispersed particles act as physical barriers substantially impeding the motion of grain boundaries and inhibiting grain growth during thermal and stress cycling which substantially inhibits coarsening. As a consequence, the solder composition exhibits an advantageous level of superplasticity that is substantially resistant to joint failure. Methods for forming articles using such solder compositions is also disclosed.

Abstract: The present invention provides improved techniques for metallizing ceramic substrates. The method comprises providing a ceramic substrate and depositing a layer of reducible material on the ceramic substrate. The layer of reducible material includes a reducible ceramic such as copper oxide. The ceramic substrate having the layer of reducible material disposed thereon is heated and the reducible material is contacted with a reducing agent to create a conductive region. The conductive region is either a metallized region formed by reduction, or it is a conductive ceramic formed through surface reduction. The present invention further provides a metallized ceramic substrate. The metallized layer comprises ceramic regions having at least one constituent in common with the ceramic substrate. The ceramic substrate and the ceramic regions of the metallized layer are sintered to each other such that the metallized region is interspersed between the sintered ceramic regions.