Abstract: A method for serializing ceramic substrates in which a laser is used to remove unfired paste material from an unfired ceramic substrate. The paste material is removed by exposing the unwanted paste material to laser radiation in a programmed sequence of x and y coordinate moves. The laser radiation removes the unwanted paste material, leaving the identifying characters intact. The identifying characters can be used for part identification and traceability.

Abstract: The present invention contemplates a method and apparatus for selectively depositing metal or other materials upon a transparent substrate utilizing a laser source. More particularly, the invention contemplates depositing material in highly selective areas with a high degree of adhesion and uniformity.The invention attains these results with an arrangement wherein a laser source 12 is located on one side of a transparent or translucent substrate 18 upon which metal is to be deposited, so that the laser beam can be directed through the substrate. A reservoir 20 of metal is located on supports 24 on the opposite side of the substrate adjacent to the surface thereof. Deflection means 14, 16 are provided to selectively scan the laser beam at predetermined intensity levels over a desired pattern.The scanned laser beam acts to heat and vaporize metal from the metal reservoir, which is then redeposited upon the adjacent surface of the glass substrate.