Patents by Inventor Thomas Joachim Werner MORSHEIM

Thomas Joachim Werner MORSHEIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Scalable heat dissipating microelectronic integration platform (SHDMIP) for lighting solutions and method of manufacturing thereof
    Patent number: 8669580
    Abstract: The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED Package having excellent heat dissipation and protection to LED, thus extending the lifespan of the LED. The SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuits conductively attached to the bottom lead frame and a LED conductively attached to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions. A method to manufacture the SHDMIP LED array of the present invention is provided herein.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: March 11, 2014
    Assignee: PSI Technologies, Inc.
    Inventors: Thomas Joachim Werner Morsheim, Fernando Villon Capinig, Dandy Navarro Jaducana, Anthony Augusto Malon Galay
  • Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) For Lighting Solutions And Method Of Manufacturing Thereof
    Publication number: 20120161632
    Abstract: The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED Package having excellent heat dissipation and protection to LED, thus extending the lifespan of the LED. The SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuits conductively attached to the bottom lead frame and a LED conductively attached to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions. A method to manufacture the SHDMIP LED array of the present invention is provided herein.
    Type: Application
    Filed: November 4, 2011
    Publication date: June 28, 2012
    Applicant: PSI Technologies, Inc.
    Inventors: Thomas Joachim Werner MORSHEIM, Fernando Villon Capinig, Dandy Navarro Jaducana, Anthony Augusto Malon Galay