Abstract: Integrated heat spreaders having electromagnetically-formed features, and semiconductor packages incorporating such integrated heat spreaders, are described. In an example, an integrated heat spreader includes a top plate flattened using an electromagnetic forming process. Methods of manufacturing integrated heat spreaders having electromagnetically-formed features are also described.

Abstract: Integrated heat spreaders having electromagnetically-formed features, and semiconductor packages incorporating such integrated heat spreaders, are described. In an example, an integrated heat spreader includes a top plate flattened using an electromagnetic forming process. Methods of manufacturing integrated heat spreaders having electromagnetically-formed features are also described.

Abstract: Processes for constructing complex turbine structures by the assembly of less complex sub-structures. The component sub-structures are bonded together at opposed mating surfaces by transient liquid bond phase techniques. The sub-structure mating surfaces are machined prior to application of the bonding material to remove oxide from the mating surfaces and ensure dimensional tolerances. Bonding material is applied to the mating surfaces by sputter deposition. Masks can be applied to the mating surfaces prior to application of the bond material so as to selectively apply bond material at only predetermined locations on the mating surface, thus eliminating excessive use of bond material for bonding the component sub-structures.