Abstract: In an embodiment a vital sign sensor includes an emitter component configured to emit light, a detector component configured to detect light, a first layer of a substantially transparent material, wherein the emitter component is embedded in the first layer, and a second layer of a light scattering material arranged on the first layer, wherein the second layer includes converter particles, and wherein the first layer and the second layer are surrounded by at least one wall of a reflective material.

Abstract: A lighting device contains a first circuit board and a second circuit board. The first circuit board has one or more connecting sections having overall at least two contact areas. The second circuit board has an opening through which the connecting section of the first circuit board can extend. At least two contact elements, which are electrically connected to conductive tracks of the second circuit board, are arranged on the second circuit board. Each contact element has a contact region by which the contact element butts against one of the contact areas of the first circuit board. As a result, an electrical connection is produced between the two circuit boards.

Abstract: In an embodiment a vital sign sensor includes an emitter component configured to emit light, a detector component configured to detect light, a first layer of a substantially transparent material, wherein the emitter component is embedded in the first layer, and a second layer of a light scattering material arranged on the first layer, wherein the second layer includes converter particles, and wherein the first layer and the second layer are surrounded by at least one wall of a reflective material.

Abstract: A lighting device (in particular an MR-16 or a PAR-16 lamp) comprises a housing and a lens. A light module having a light source and a driver is attached to the lens. The lens is connected to the housing by means of a snap-on connection or by means of a formed (thermally, for example) edge section.

Abstract: A tube used for producing an electrically conductive connection between an electrical conducting element and a printed circuit board of a light fixture. The use of the tube in the printed circuit board makes it possible, due to a corresponding configuration and a region which widens in relation to the longitudinal direction, that the tube can be connected to the printed circuit board or is held thereby and can be soldered. Additionally, the configuration or widened portion prevents soldering agent from penetrating into the tube, so that a wire for voltage supply can then be introduced into the tube and can be connected thereto by deformation. As a result, an automatic and reliable method is made possible, so that a cost saving is produced.

Abstract: A light module serves for inserting into a housing of a semiconductor lamp and comprises: a driver (2), a cooling element, a light generator, abutting the cooling element, with at least one semiconductor light source, which is electrically connected with the driver, and an optical refraction element covering the at least one semiconductor light source, wherein the refraction element is fastened on the cooling element and presses the light generator onto the cooling element. A semiconductor lamp comprises a housing open at the front into which the light module is inserted from the front side and on which the light module is fastened. A method serves for producing a semiconductor lamp, wherein at least the driver, the cooling element, the light generator and the refraction element are assembled into an individually manageable light module and the light module is then inserted into a housing.

Abstract: A lighting device and the method of creating the lighting device having a lighting module and a lens mechanically connected to that lighting module. The lens has one or more connecting pins. The light module has one or more receiving openings for receiving the connecting pins. The free ends of the connecting pins are deformed by thermal deformation so that the light module is held on the lens.

Abstract: A semiconductor lamp includes a housing with a cavity to accommodate a light source, preferably an LED, and a driver for the light source. The housing has at least one injection channel for injection of an encapsulation material into the cavity of the housing. A semiconductor lamp is produced by providing a housing with a cavity and inserting a driver and a light source into the cavity. Following the insertion of the driver and the light source into the cavity, an encapsulation material is introduced into at least a part of the cavity through at least one injection channel of the housing.

Abstract: A lighting device contains a first circuit board and a second circuit board. The first circuit board has one or more connecting sections having overall at least two contact areas. The second circuit board has an opening through which the connecting section of the first circuit board can extend. At least two contact elements, which are electrically connected to conductive tracks of the second circuit board, are arranged on the second circuit board. Each contact element has a contact region by which the contact element butts against one of the contact areas of the first circuit board. As a result, an electrical connection is produced between the two circuit boards.

Abstract: Various embodiments may relate to a semiconductor lamp having at least one semiconductor light source, including multiple separately produced components, wherein at least two of the components are connected to one another by means of joint extrusion coating. Various embodiments further relate to a method for producing a semiconductor lamp having at least one semiconductor light source. The method includes at least, inserting at least one open driver housing and a cover for the driver housing into an injection mold, and extrusion coating the components inserted into the mold using potting material so that these components are permanently connected to one another by the potting material.

Abstract: Various embodiments may relate to a semiconductor lamp having at least one semiconductor light source, including multiple separately produced components, wherein at least two of the components are connected to one another by means of joint extrusion coating. Various embodiments further relate to a method for producing a semiconductor lamp having at least one semiconductor light source. The method includes at least, inserting at least one open driver housing and a cover for the driver housing into an injection mold, and extrusion coating the components inserted into the mold using potting material so that these components are permanently connected to one another by the potting material.

Abstract: A semiconductor lamp includes a housing with a cavity to accommodate a light source, preferably an LED, and a driver for the light source. The housing has at least one injection channel for injection of an encapsulation material into the cavity of the housing. A semiconductor lamp is produced by providing a housing with a cavity and inserting a driver and a light source into the cavity. Following the insertion of the driver and the light source into the cavity, an encapsulation material is introduced into at least a part of the cavity through at least one injection channel of the housing.

Abstract: A semiconductor lamp (1) has at least one semiconductor light source (8) arranged on a front face (7) of a substrate (6) and a driver circuit (11) for activating the at least one semiconductor light source (8), at least part of the driver circuit (11) being secured on a rear face (10) of the substrate (6), facing away from the at least one semiconductor light source (8). The invention can be used, in particular, for retrofit lamps, in particular incandescent- or halogen retrofit lamps.

Abstract: A tube used for producing an electrically conductive connection between an electrical conducting element and a printed circuit board of a light fixture. The use of the tube in the printed circuit board makes it possible, due to a corresponding configuration and a region which widens in relation to the longitudinal direction, that the tube can be connected to the printed circuit board or is held thereby and can be soldered. Additionally, the configuration or widened portion prevents soldering agent from penetrating into the tube, so that a wire for voltage supply can then be introduced into the tube and can be connected thereto by deformation. As a result, an automatic and reliable method is made possible, so that a cost saving is produced.

Abstract: A lighting device and the method of creating the lighting device having a lighting module and a lens mechanically connected to that said lighting module. The lens has one or more connecting pins. The light module has one or more receiving openings for receiving the connecting pins. The free ends of the connecting pins are deformed by thermal deformation so that the light module is held on the lens.

Abstract: Various embodiments may relate to a semiconductor lamp having at least one semiconductor light source, including multiple separately produced components, wherein at least two of the components are connected to one another by means of joint extrusion coating. Various embodiments further relate to a method for producing a semiconductor lamp having at least one semiconductor light source. The method includes at least, inserting at least one open driver housing and a cover for the driver housing into an injection mold, and extrusion coating the components inserted into the mold using potting material so that these components are permanently connected to one another by the potting material.

Abstract: A lighting device (in particular an MR-16 or a PAR-16 lamp) comprises a housing and a lens. A light module having a light source and a driver is attached to the lens. The lens is connected to the housing by means of a snap-on connection or by means of a formed (thermally, for example) edge section.

Abstract: A semiconductor lamp comprises a housing in which a driver is accommodated and at least one contact pin protruding from the housing outwards, wherein the contact pin is tubular and riveted to the housing and the driver is connected to the contact pin via an electrically conductive connection element which is inserted into a cavity of the contact pin. A method serves for producing a semiconductor lamp, wherein at least one tubular contact pin is inserted into a feedthrough of a housing from outside till the contact pin abuts the housing, the contact pin is next riveted with the housing on the inside and a driver is inserted into the housing, whereby an electrically conductive connection element is inserted into the contact pin. The invention is particularly applicable to LED retrofit lamps for replacing bipin halogen lamps, in particular MR16 lamps.

Abstract: A light module (1) serves for inserting into a housing (23) of a semiconductor lamp (24) and comprises: a driver (2), a cooling element (10), a light generator (15), abutting the cooling element, with at least one semiconductor light source (17), which is electrically connected with the driver (2), and an optical refraction element (18) covering the at least one semiconductor light source, wherein the refraction element is fastened on the cooling element and presses the light generator (15) onto the cooling element. A semiconductor lamp (24) comprises a housing open at the front into which the light module is inserted from the front side and on which the light module is fastened. A method serves for producing a semiconductor lamp, wherein at least the driver, the cooling element, the light generator and the refraction element are assembled into an individually manageable light module and the light module is then inserted into a housing.

Abstract: A semiconductor lamp (1) comprises a housing (2) in which a driver (3) is accommodated and at least one contact pin (6) protruding from the housing (2) outwards, wherein the contact pin (6) is tubular and riveted to the housing (2) and the driver (3) is connected to the contact pin (6) via an electrically conductive connection element (12) which is inserted into a cavity (13) of the contact pin (6). A method serves for producing a semiconductor lamp (1), wherein at least one tubular contact pin (6) is inserted into a feedthrough (5) of a housing (2) from outside till the contact pin (6) abuts the housing (2), the contact pin (6) is next riveted with the housing (2) on the inside and a driver (3) is inserted into the housing (2), whereby an electrically conductive connection element (12) is inserted into the contact pin (6). The invention is particularly applicable to LED retrofit lamps for replacing bipin halogen lamps, in particular MR16 lamps.