Abstract: A wafer transfer unit includes at least one data processing unit, which is configured at least for a registration and/or processing of sensor data of at least one sensor, allocated to at least one sub-component of a wafer transfer system, of a sensor module, in particular includes at least one wafer processing module of the wafer transfer system, includes at least one wafer interface system of the wafer transfer system with a wafer transport container and a loading and/or unloading station for a loading and/or unloading of the wafer transport container and/or of the wafer processing module, includes at least one wafer transport container transport system of the wafer transfer system and/or includes at least one wafer handling robot of the wafer transfer system.

Abstract: A wafer transfer unit includes at least one data processing unit, which is configured at least for a registration and/or processing of sensor data of at least one sensor, allocated to at least one sub-component of a wafer transfer system, of a sensor module, in particular includes at least one wafer processing module of the wafer transfer system, includes at least one wafer interface system of the wafer transfer system with a wafer transport container and a loading and/or unloading station for a loading and/or unloading of the wafer transport container and/or of the wafer processing module, includes at least one wafer transport container transport system of the wafer transfer system and/or includes at least one wafer handling robot of the wafer transfer system.

Abstract: This invention relates generally to slits used in optics that must be precisely aligned and adjusted. The optical slits of the present invention are useful in x-ray optics, x-ray beam lines, optical systems in which the entrance slit is critical for high wavelength resolution. The invention is particularly useful in ultra high vacuum systems where lubricants are difficult to use and designs which avoid the movement of metal parts against one another are important, such as monochrometers for high wavelength resolution with ultra high vacuum systems. The invention further relates to optical systems in which temperature characteristics of the slit materials is important. The present invention yet additionally relates to precision slits wherein the opposing edges of the slit must be precisely moved relative to a center line between the edges with each edge retaining its parallel orientation with respect to the other edge and/or the center line.

Abstract: An integrated circuit package magazine and receptacle is provided in which one or both ends of a longitudinally elongated magazine tube (10) are cut-out to form inwardly facing spring gates (16) which have ends (18) abutting ends (22) of a series of integrated semiconductor packages (20) slidably contained on a rail surface (13) in the interior of the magazine. In its neutral inward position spring gate 16 functions to prevent egress of the semiconductor packages while allowing easy ingress of the packages by spring movement of the spring gate upwardly into a position in the same plane as the top wall (15) of the tube. The tube may take various exterior and interior configurations. Automatic release of semiconductor packages from the tube is provided by utilizing the tube in conjunction with a receptacle (30) having a longitudinal rail (34) onto which the magazine is insertable.