Patents by Inventor Thomas Lelgermann

Thomas Lelgermann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Highly thermally conductive valve seat ring
    Patent number: 10208636
    Abstract: The invention relates to a powdermetallurgically produced valve seat ring having a carrier layer and a function layer. It is the objective of the invention to provide a valve seat ring of the kind mentioned above that offers significantly higher thermal conductivity properties. To achieve this objective and based on a valve seat ring of the kind first mentioned above the invention proposes that the carrier material of the carrier layer has a thermal conductivity higher than 55 W/m*K at a total copper content ranging between >25 and 40% w/w.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: February 19, 2019
    Assignee: Bleistahl-Produktions GmbH & Co, KG
    Inventors: Ekkehard Kohler, Dirk Emde, Anna Seyfarth, Thomas Lelgermann
  • HIGHLY THERMALLY CONDUCTIVE VALVE SEAT RING
    Publication number: 20170298790
    Abstract: The invention relates to a powdermetallurgically produced valve seat ring having a carrier layer and a function layer. It is the objective of the invention to provide a valve seat ring of the kind mentioned above that offers significantly higher thermal conductivity properties. To achieve this objective and based on a valve seat ring of the kind first mentioned above the invention proposes that the carrier material of the carrier layer has a thermal conductivity higher than 55 W/m*K at a total copper content ranging between >25 and 40% w/w.
    Type: Application
    Filed: June 21, 2017
    Publication date: October 19, 2017
    Applicant: Bleistahl-Produktions GmbH & Co. KG
    Inventors: Ekkehard Kohler, Dirk Emde, Anna Seyfarth, Thomas Lelgermann
  • Highly thermally conductive valve seat ring
    Patent number: 9702277
    Abstract: The invention relates to a powdermetallurgically produced valve seat ring having a carrier layer and a function layer. It is the objective of the invention to provide a valve seat ring of the kind mentioned above that offers significantly higher thermal conductivity properties. To achieve this objective and based on a valve seat ring of the kind first mentioned above the invention proposes that the carrier material of the carrier layer has a thermal conductivity higher than 55 W/m*K at a total copper content ranging between >25 and 40% w/w.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: July 11, 2017
    Assignee: Bleistahl-Produktions GmbH & Co. KG
    Inventors: Ekkehard Kohler, Dirk Emde, Anna Seyfarth, Thomas Lelgermann