Abstract: A method of separating a metal organic framework (MOF) from a solution and associated apparatus. The method comprises: providing a MOF containing solution; contacting the MOF containing solution with an acoustic reflector surface such that, any high frequency ultrasound applied within the MOF containing solution reflects off the acoustic reflector surface; and applying a high frequency ultrasound of at least 20 kHz to the MOF containing solution. The MOF material is substantially separated from solution as aggregated sediment that settles out of solution.

Abstract: A method of separating a metal organic framework (MOF) from a solution and associated apparatus. The method comprises: providing a MOF containing solution; contacting the MOF containing solution with an acoustic reflector surface such that, any high frequency ultrasound applied within the MOF containing solution reflects off the acoustic reflector surface; and applying a high frequency ultrasound of at least 20 kHz to the MOF containing solution. The MOF material is substantially separated from solution as aggregated sediment that settles out of solution.

Abstract: A method of separating a metal organic framework (MOF) from a solution and associated apparatus. The method comprises: providing a MOF containing solution; contacting the MOF containing solution with an acoustic reflector surface such that, any high frequency ultrasound applied within the MOF containing solution reflects off the acoustic reflector surface; and applying a high frequency ultrasound of at least 20 kHz to the MOF containing solution. The MOF material is substantially separated from solution as aggregated sediment that settles out of solution.

Abstract: A method of separating a metal organic framework (MOF) from a solution and associated apparatus. The method comprises: providing a MOF containing solution; contacting the MOF containing solution with an acoustic reflector surface such that, any high frequency ultrasound applied within the MOF containing solution reflects off the acoustic reflector surface; and applying a high frequency ultrasound of at least 20 kHz to the MOF containing solution. The MOF material is substantially separated from solution as aggregated sediment that settles out of solution.

Abstract: The present invention generally relates to a magnetic sensor in a read head having a hard or soft bias layer that is uniform in thickness within the sensor stack. The method of making such sensor is also disclosed. The free layer stripe height is first defined, followed by defining the track width, and lastly the pinned layer stripe height is defined. The pinned layer and the hard or soft bias layer are defined in the same process step. This approach eliminates a partial hard or soft bias layer and reduces potential instability issues.

Abstract: The present invention generally relates to a magnetic sensor in a read head having a hard or soft bias layer that is uniform in thickness within the sensor stack. The method of making such sensor is also disclosed. The free layer stripe height is first defined, followed by defining the track width, and lastly the pinned layer stripe height is defined. The pinned layer and the hard or soft bias layer are defined in the same process step. This approach eliminates a partial hard or soft bias layer and reduces potential instability issues.

Abstract: A temperature resistant photomask is disclosed which is made from photoresist containing Si, which is exposed to oxygen during Reactive Ion Etching. The temperature resistant photomask may include a secondary mask layer, which may also acts as a release layer, and which may include spin-on polymide. The photoresist containing Si may be exposed to oxygen during Reactive Ion Etching by introducing oxygen and carbon dioxide.

Abstract: A method is disclosed for fabricating a CPP read head for a magnetic disk drive having an electrical isolation layer. The method includes providing a first shield layer, depositing a sensor stack on the first shield layer, a CMP stop layer is deposited on the sensor stack, and a release layer is deposited a on the CMP stop layer. Photoresist material containing Si is deposited on the release layer, and the photoresist material is then patterned and then oxidized by Reactive Ion Etching to form a high temperature photomask. The electrical isolation layer is then deposited to surround the sensor stack using a high temperature deposition process. The read head is then continued as either an in-stack bias sensor with ‘draped shield’ variation, or a hard bias stabilization variation.

Abstract: A method for forming metrology structures for a CMP process is described. A trench edge is formed in a base material or stack of materials which are preferably deposited as part of the process of fabricating the production structures on the wafer. A covering film of a second material with preferably with contrasting SEM properties is deposited over the trench edge in the base material. During CMP the covering film is preferentially worn away at the edge revealing the base material. The width of the base material which has been revealed is a measure of the progress of the CMP. Since the base material and the covering material are preferably selected to have contrasting images in an SEM, a CD-SEM can be used to precisely measure the CMP progress.

Abstract: CMP process control array groups are fabricated upon the surface of the wafer for viewing through an optical microscope. The array groups include a plurality of test arrays, where each array includes a plurality of projecting test features. Each of the projecting test features are formed with the same projecting height and have a hard upper surface layer, such as diamond-like-carbon (DLC). All of the projecting test features within an array are formed with the same diameter, and the diameter of projecting test features of a particular array differs from the diameter of projecting test features in another array. The diameters are chosen such that the DLC surface is removed in specifically designed time increments, such as 5 seconds, from array to array, where projecting test features with the DLC surface removed appear as bright white, while the arrays with test features that retain some DLC surface are significantly darker.