Abstract: Apparatuses, systems and methods of providing a security operations management (SOM) module for a payment system. Included are: a main board having primary processing components of the SOM module, and having a first security feature for impeding physical penetration of objects from to the primary processing components; a top board having at least a battery and secondary processing components of the SOM module on a presenting face to the first face for electrically connecting to the primary processing components, and having a second security feature; and an intermediate board providing a passthrough between the main and top boards to allow for the electrical connection of the primary processing components and the battery and the secondary processing components, and comprising a third security feature for impeding physical penetration into the passthrough.

Abstract: The disclosure generally relates to compositions and methods for the production of nucleic acid molecules. In some aspects, the invention allows for the microscale generation of nucleic acid molecules, optionally followed by assembly of these nucleic acid molecules into larger molecules. In some aspects, the invention allows for efficient production of nucleic acid molecules (e.g., large nucleic acid molecules such as genomes).

Abstract: Provided herein are opioid receptor modulators and pharmaceutical compositions comprising said compounds.

Abstract: Systems, methods, and cards utilized for an authentication protection layer for payment card transactions are provided. Aspects include receiving, by a transaction processing terminal, the card for the potential transaction. Obtaining card holder information for the card and transmitting a radio frequency (RF) signal and receiving RFID data from an RFID tag associated with the card. Comparing, by a processor, the card holder information to the RFID data to determine whether to authorize the potential card transaction and authorizing the potential card transaction based at least on a determination that the RFID data corresponds to the card holder information.

Abstract: Systems, methods, and cards utilized for an authentication protection layer for payment card transactions are provided. Aspects include receiving, by a transaction processing terminal, the card for the potential transaction. Obtaining card holder information for the card and transmitting a radio frequency (RF) signal and receiving RFID data from an RFID tag associated with the card. Comparing, by a processor, the card holder information to the RFID data to determine whether to authorize the potential card transaction and authorizing the potential card transaction based at least on a determination that the RFID data corresponds to the card holder information.

Abstract: A pre-bracing tube of a cold shrinking sleeve includes a tubular body made integrally of plastic. The tubular body has its outer circumferential wall forming a spiral and successive tearing groove and a spiral and successive belt body between every two tearing grooves when the tubular body is shaped. Thus, when the tubular body is torn along the tearing grooves, the belt bodies can be drawn and takes advantage of an opportunity to draw the torn portion out of the tubular body. The tearing groove of the tubular body is formed when the tubular body is injection molded so it is needless to carry out any processing to the tubular body for obtaining a finished product, easy in manufacturing, convenient in production and able to lower cost. In addition, various molds can be made for matching with requirements of different diameters or lengths.

Abstract: A method and apparatus are provided for implementing automatic-calibration of a Time Domain Reflectometer (TDR) probing apparatus. A calibration procedure is performed automatically each time a TDR probe is moved from a device under test (DUT). A current calibration TDR waveform is obtained and compared with a reference calibration TDR waveform, checking for deviations between the current and reference measurements. If a deviation is detected, then the user is notified and calibration is failed.

Abstract: A method and apparatus are provided for implementing automatic-calibration of a Time Domain Reflectometer (TDR) probing apparatus. A calibration procedure is performed automatically each time a TDR probe is moved from a device under test (DUT). A current calibration TDR waveform is obtained and compared with a reference calibration TDR waveform, checking for deviations between the current and reference measurements. If a deviation is detected, then the user is notified and calibration is failed.

Abstract: A modular heat sink decoupling capacitor array includes a plurality of modules, each defining parallel distributed decoupling plates, and each module forming a heat sink fin. Each module includes multiple spaced apart contacts for providing low inductance connections with an associated device. A power distribution interposer module is attached to a heat sink surface of the modular decoupling capacitor. The interposer module is used for implementing power delivery without using valuable ball grid array (BGA) connections and printed circuit board (PCB) layers.

Abstract: A method and apparatus are provided for implementing very high density signal probing of a printed circuit board having a pad pattern connected to signals of interest. A metal plate includes a plurality of through holes arranged in a predefined pattern that corresponds to the pad pattern on the printed circuit board. At least one signal module is inserted within a selected one of the through holes of the metal plate. Each signal module defines a coaxial connector for electrical mating engagement with a coaxial cable connector and has an embedded resistor. At least one power/ground module is inserted within a selected one of the through holes. Each power/ground module contains a high dielectric constant material between an outer conductor and a center conductor defining a capacitor. The capacitor provides a low impedance path between the metal plate and a power or ground pad of the printed circuit board.