Abstract: A vehicle identification device includes one or more clips configured to attach the device to a vehicle door or window. The identification device optionally includes reflective material so that the vehicle is more easily seen. The identification device optionally includes identification indicia such as letters or numbers. The identification device is optionally deployed from within the vehicle, thus improving safety.

Abstract: Automated article processing, particularly semiconductor wafer processing, is accomplished in a modular article processing machine. The design of the machine allows easy reconfiguration between single and multiple processing station systems. Articles are handled according to a method which easily accommodates the various configurations of the machine and which provides efficient throughput. The machine includes a number of electromechanical and pneumatic systems under the control of at least one microprocessor. Machine state knowledge necessary for startup in the midst of operation, such as following a power interruption, is provided by a mechanical counter indexed at the completion of each stage of operation by the microprocessor controller.

Abstract: Wafer transport in the vacuum portion of an automated wafer processing machine is accomplished by means of an improved transport mechanism. The primary transport device is a rail guided, magnetically driven shuttle plate. Baffles serve to isolate the particle producing portions of the mechanism from the wafers. The major drive components are located inside the rails and outside the vacuum containment system. A pin lift apparatus located on the reactor chucks serves to remove and replace wafers on the shuttle plate. The disclosed apparatus provides efficient and reliable wafer transport with a minimum amount of particulate generation and is easily reconfigurable to single or multiple head machines.

Abstract: A plasma reactor of the single wafer, planar electrode type achieves improved serviceability by means of a service seal arrangement. The lower electrode of the plasma reactor is carried on a chuck. Both the chuck and the upper portions of the reactor seal to an upper plate of a vacuum containment vessel. A wafer transport mechanism is contained within the vacuum containment vessel. The sealing arrangement allows removal of the upper portions of the reactor and even replacement of the lower electrode without disturbing the vacuum in the vacuum containment vessel.