Abstract: The present invention provides a radiation shielding material, particularly for shielding of particle radiation, comprising a fibre material and a radiation damping filler, wherein the amount of the radiation damping filler is 40 to 95 wt. % based on the dry weight of the radiation shielding material. The present invention further provides a radiation shielding structure, particularly for shielding of particle radiation, comprising a bottom layer and a top layer, wherein a hollow structure is sandwiched between the bottom layer and the top layer, wherein the hollow structure is filled with a radiation damping filler.

Abstract: A microfluidic chip includes a functional area, which is covered by a flexible or deformable cover. The cover has an expansion limiter. This expansion limiter can for example be embodied as a stable plate including one or more than one opening. The expansion limiter may be fixedly connected to the cover.

Abstract: The present invention relates to an adhesive material, especially an electrically and/or thermally and/or radiation-curing or curable adhesive material, having at least one adhesive constituent and/or adhesive matrix, and moreover having at least one additive in the form of a carbon material, especially based on carbon nanomaterials and/or carbon micromaterials, present in the adhesive constituent and/or adhesive matrix. The invention further relates to a method for producing, activating and/or curing an adhesive material. Finally the invention also relates to a method for adhesively bonding two substrates.