Abstract: Although wedgelet-based partitioning seems to represent a better tradeoff between side information rate on the one hand and achievable variety in partitioning possibilities on the other hand, compared to contour partitioning, the ability to alleviate the constraints of the partitioning to the extent that the partitions have to be wedgelet partitions, enables applying relatively uncomplex statistical analysis onto overlaid spatially sampled texture information in order to derive a good predictor for the bi-segmentation in a depth/disparity map. Thus, in accordance with a first aspect it is exactly the increase of the freedom which alleviates the signaling overhead provided that co-located texture information in form of a picture is present. Another aspect pertains the possibility to save side information rate involved with signaling a respective coding mode supporting irregular partitioning.

Abstract: Block-based coding of a picture is done by providing an intra-prediction coding concept according to which a certain block of the picture is intra-prediction coded using a certain intra-coding mode by partitioning the predetermined block into partitions which are, for reconstruction purposes, sequentially subject to spatial prediction using the intra-prediction coding mode signaled for the certain block followed by correcting the thus obtained predictor using a prediction residual so that for preceding partitions a reconstruction of the samples is available to the decoder at the time of processing the next, then current, partition.

Abstract: Embodiments are described which exploit a finding, according to which a higher compression rate or better rate/distortion ratio may be achieved by adopting or predicting second coding parameters used for encoding a second view of the multi-view signal from first coding parameters used in encoding a first view of the multi-view signal. In other words, the inventors found out that the redundancies between views of a multi-view signal are not restricted to the views themselves, such as the video information thereof, but that the coding parameters in parallelly encoding these views show similarities which may be exploited in order to further improve the coding rate.

Abstract: Hybrid video decoder supporting intermediate view synthesis of an intermediate view video from a first- and a second-view video which are predictively coded into a multi-view data signal with frames of the second-view video being spatially subdivided into sub-regions and the multi-view data signal having a prediction mode is provided, having: an extractor configured to respectively extract, from the multi-view data signal, for sub-regions of the frames of the second-view video, a disparity vector and a prediction residual; a predictive reconstructor configured to reconstruct the sub-regions of the frames of the second-view video, by generating a prediction from a reconstructed version of a portion of frames of the first-view video using the disparity vectors and a prediction residual for the respective sub-regions; and an intermediate view synthesizer configured to reconstruct first portions of the intermediate view video.

Abstract: A digital assistant may execute one or more tasks using robotic processing automation (RPA). The digital assistant (or robot) assigns a workflow to a robot to monitor for one or more triggers. The one or more triggers comprise one or more events causing a robot to perform an automated tasks with or without user involvement. The robot also identifies the one or more triggers during the monitoring of the one or more triggers, and loads a workflow associated with the one or more identified triggers. The robot further includes executing the loaded workflow to perform one or more tasks associated with the one or more triggers.

Abstract: The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.

Abstract: A drive device (10) for a forming machine (11) includes a hypocycloid gear assembly (20) having an eccentric gear (23), a stationary annulus gear (24) and a planetary gear system (28). The planetary gear system (28) includes an orbiting gear (29) orbiting and rolling in an annulus gear (24). The orbiting gear (29) is connected to at least one first planetary gear (35). On the first planetary gear (35), a first planetary gear equalization mass (m2) is disposed diametrically opposite an output bearing. At least one first eccentric gear equalization mass (m3) is arranged on the eccentric gear (23). The first eccentric gear equalization mass (m3) is arranged diametrically opposite, relative to a planetary gear axis (PA) about which the planetary gear system (28) rotates. The resultant forces and torques acting on the annulus gear (24) can at least be reduced by the equalization masses.

Abstract: The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.

Abstract: The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.

Abstract: An integrated semiconductor device having a stabilization function includes a substrate layer, an insulating layer, ground plane layer formed between the substrate layer and the insulating layer and a signal plane layer formed on a surface of the insulating layer facing away from the substrate layer. An n-port, e.g. a transistor, is formed within the substrate layer on a first side of the substrate layer. A via hole is formed through the insulating layer. A resistor is formed within the ground plane layer.

Abstract: A drive device (10) for a forming machine (11) includes a hypocycloid gear assembly (20) having an eccentric gear (23), a stationary annulus gear (24) and a planetary gear system (28). The planetary gear system (28) includes an orbiting gear (29) orbiting and rolling in an annulus gear (24). The orbiting gear (29) is connected to at least one first planetary gear (35). On the first planetary gear (35), a first planetary gear equalization mass (m2) is disposed diametrically opposite an output bearing. At least one first eccentric gear equalization mass (m3) is arranged on the eccentric gear (23). The first eccentric gear equalization mass (m3) is arranged diametrically opposite, relative to a planetary gear axis (PA) about which the planetary gear system (28) rotates. The resultant forces and torques acting on the annulus gear (24) can at least be reduced by the equalization masses.

Abstract: An integrated semiconductor device having a stabilization function includes a substrate layer, an insulating layer, ground plane layer formed between the substrate layer and the insulating layer and a signal plane layer formed on a surface of the insulating layer facing away from the substrate layer. An n-port, e.g. a transistor, is formed within the substrate layer on a first side of the substrate layer. A via hole is formed through the insulating layer. A resistor is formed within the ground plane layer.

Abstract: A feeding structure including a carrier substrate, a top conductor plane of a cavity formed in the carrier substrate, a feedline substrate covering the top conductor plane, a signal conductor of a feedline, the signal conductor being formed in or on the feedline substrate opposite the top conductor plane, a via probe connected to the signal conductor and leading through the feedline substrate and the top conductor plane into the cavity, a ring-shaped aperture formed in the top conductor plane around the via probe, and at least one slot-shaped aperture formed in the top conductor plane starting at the ring-shaped aperture and leading away from the via probe.

Abstract: The present invention relates to a feeding structure for coupling a feedline to a cavity. To increase the coupling, which can contribute to achieving a broad bandwidth, a feeding structure is proposed comprising a carrier substrate, a top conductor plane of a cavity formed in said carrier substrate, a feedline substrate covering said top conductor plane, a signal conductor of a feedline, said signal conductor being formed in or on said feedline substrate opposite said top conductor plane, a via probe connected to said signal conductor and leading through said feedline substrate and said top conductor plane into said cavity, a ring-shaped aperture formed in said top conductor plane around said via probe, and at least one slot-shaped aperture formed in said top conductor plane starting at said ring-shaped aperture and leading away from said via probe.

Abstract: The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.